System-on Chip
A complete computer "System on a Chip".
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Product
32GB DDR4-3200 2GbX8 1.2V ECC Samsung Chip
AQD-D4U32GE32-SB
Memory Module
32GB, Speed 3200MHz, 30u" Gold Plating Thickness, Anti-sulfurization resistance, ECC.
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Product
8G DDR3-1600 240Pin 512MX8 1.35V ECC Samsung Chip
AQD-D3L8GE16-SG
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DDR3-1600 ECC, 240-Pin, 512MX8, Samsung Chip.
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Product
Chip Test Adapter
SOJ EDO/FPM
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Our new addition to the RAMCHECK line provides support for common 20 to 42-pin EDO/FPM DRAM SOJ chips of sizes 256Kx16/18, 1Mx16/18, 8Mx8, 16Mx4, 2Mx8, 4Mx4, 16Mx1, 1Mx4, and 4Mx1.
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Product
8GB DDR4-3200 1GbX8 1.2V ECC Samsung Chip
AQD-D4U8GE32-SE
Memory Module
8GB, Speed 3200MHz, 30u" Gold Plating Thickness, Anti-sulfurization resistance, ECC.
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Product
ISDN Chip Set
Emutel Symphony
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Emutel Symphony is a convenient and flexible Basic Rate ISDN, Primary Rate ISDN and Analog PSTN network simulator. With support for S, U, E1, T1 and PSTN analog interfaces you can use the Emutel Symphony to test and develop a full range of ISDN(E1/T BRIS BRIU) and PSTN analog (FXS) equipment.
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Product
16G DDR5-4800 288Pin 2GX8 1.1V Registered Samsung Chip
AQD-D5V16GR48-SB
Memory Module
Samsung Original Chip, Dual 32-bit Subchannels. Increased Banks and Burst Length, DDR5 4.8GT/s. Same-Bank Refresh, On-die ECC for Enhanced RAS.
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Product
16GB DDR5-5600 288Pin 2GX8 1.1V Unbuffered Hynix Chip
AQD-D5V16GN56-HB
Memory Module
Hynix Original Chip, Increased Banks and Burst Length, DDR5 5.6GT/s, Same-Bank Refresh, On-die ECC for Enhanced RAS.
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Product
Thin Film Chip Resistors, High Reliability Type
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Panasonic Industrial Devices Sales Company of America
An AEC-Q200 Compliant SeriesPanasonic components specified as AEC-Q200 Compliant are consistently designed into automotive systems. However, today’s Design Engineers are specifying AEC-Q200 components to meet the high-quality standards of devices beyond automotive applications.
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Product
Metal Foil Llow Resistance Chip Resistor
MFR (Metal foil)
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*Low Resistance / TCR / EMF 9only FOR MnCu) / Inductance*Excellent long term stability*RoHS compliant and halogen free.*Lead free.* High precision current sensing and voltage division.
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Product
Thermal Test Chip
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Thermal Engineering Associates, Inc.
Thermal Test Chips (TTC) are used in many different Applications: Package Thermal Characterization, Heat Source Simulator, Temperature Reference Platform, Transient Analysis, System Thermal Management Design, Thermal Interface Material (TIM) Measurement & Characterization, Heat Sink Measurement & Characterization.
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Product
25G DFB Laser Diode Chips
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Guilin GLsun Science and Tech Group Co., LTD
25G DFB Laser Diode Chips by GLSN
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Product
LED Tester For Chip And Wafer
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Electrical Testing: Forward：VF,DVF,VFDReverse：VZ,IROptical Testing: can test LOP in cd/mcd/W/mW/lm... from different optical componentsWavelength λp,λd,λc,hw,purity,(x,y),CCT,CRIFour-wire measurement and contact resistance in case of deviation.Auto polarity identification and preheat function.Compatible mechanical interface.Optional ESD static test system or polycrystalline test system
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Product
Thin Film/Metal Film Chip SMD Chip Resistors
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Panasonic Industrial Devices Sales Company of America
Panasonic’s industry leading Thin-Film Chip Resistors features include high reliability at high temperature and high humidity as well as high accuracy, low current noise and excellent linearity. Panasonic’s High Precision Thin Film Resistors are designed for robust applications where long life is crucial in markets such as automotive, appliance or industrial. These Resistors boast a high accuracy of up to 10ppm, 0.05% making them one of the best-in-class Resistors on the market today. Panasonic Thin-Film Resistors are available in case sizes down to 0201. Compliant standards include: IEC 60115-8, JIS C 5201-8, and EIAJ RC-2133B. These Resistors are AEC-Q200 Certified.
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Product
High Precision Thick Film Chip Resistors
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Panasonic Industrial Devices Sales Company of America
An AEC-Q200 Compliant SeriesPanasonic components specified as AEC-Q200 Compliant are consistently designed into automotive systems. However, today’s Design Engineers are specifying AEC-Q200 components to meet the high-quality standards of devices beyond automotive applications.
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Product
32GB SO-DDR4-3200 2GbX8 1.2V Samsung Chip
AQD-SD4U32GN32-SB
Memory Module
32GB, Speed 3200MHz, 30u" Gold Plating Thickness, Anti-sulfurization resistance, Unbuffered.
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Product
32GB SO-DDR4-3200 2GbX8 1.2V ECC Samsung Chip
AQD-SD4U32GE32-SB
Memory Module
32GB, Speed 3200MHz, 30u" Gold Plating Thickness, Anti-sulfurization resistance, ECC.
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Product
Anti-Surge Chip Resistors (Double-Sided Resistive)
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Panasonic Industrial Devices Sales Company of America
An AEC-Q200 Compliant SeriesPanasonic components specified as AEC-Q200 Compliant are consistently designed into automotive systems. However, today’s Design Engineers are specifying AEC-Q200 components to meet the high-quality standards of devices beyond automotive applications.
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Product
Wafer Chip Inspection System
7940
System
Chroma 7940 wafer chip inspection system is an automated inspection system for postdiced wafer chip inspection.
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Product
8G DDR5-4800 288Pin 1GX16 1.1V Unbuffered Samsung Chip
AQD-D5V8GN48-SC
Memory Module
Samsung Original Chip, Increased Banks and Burst Length. DDR5 4.8GT/s, Same-Bank Refresh, On-die ECC for Enhanced RAS.
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Product
Metal Foil Low Resistance Chip Resistor
MFF
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*Low Resistance / TCR / EMF / Inductance*Excellent long term stabilityRoHS compliant and halogen free.*Lead free.*High precision current sensing and voltage division.
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Product
16G R-DDR4-3200 1GX8 1.2V Samsung Chip -40~85C
AQD-D4U16R32-SEW
Memory Module
Registered DIMM, 30u" Gold Plating Thickness, Anti-sulfurization resistance. 1.2V power consumption, Samsung original chip, wide temperatures from -40° to 85°C.
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Product
IEEE-488 GPIB Device Interface IC (Chip) for the PCI-Bus
GPIB-72120
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The i72120 GPIB-Chip is the ideal solution to implement a IEEE488.2 GPIB interface for next generation PCI based instruments. The GPIB-ASIC is designed to meet all of the functional requirements for talker and listener (TL) devices as specified by the IEEE Standards 488.1-1987 and 488.2-1987. Connected between the PCI bus and the GPIB, this GPIB-IC provides high-level management of the GPIB to unburden the processor and to simplify both hardware and software design. The i72120 is fully compatible with the PCI specification and requires only the addition of bus driver/receiver components to implement a talker/listener GPIB interface.
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Product
Thin Film Chip Resistors, High Voltage Type
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Panasonic Industrial Devices Sales Company of America
Thin Film Chip Resistors, High Voltage Type by Panasonic
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Product
Current Sensing Chip Resistors
CS
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*3W rating in 1W size, 1225 package*High purity alumina substrate for high power dissipation*Long side terminations with higher power rating
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Product
Chip Inductors-Multilayer
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Bourns Miltilayer chip inductors offer high frequency, nickel barrier, monolithic construction for high reliability, and magnetically shielded construction providing low radiation. They are well-suited for DC-DC converters, and prevention of electromagnetic interference to signals on the secondary side of electronic equipment, among many applications.
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Product
16G DDR5-4800 288Pin 2GX8 1.1V Unbuffered Samsung Chip
AQD-D5V16GN48-SB
Memory Module
Samsung Original Chip, Increased Banks and Burst Length. DDR5 4.8GT/s, Same-Bank Refresh, On-die ECC for Enhanced RAS.
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Product
4G DDR3-1600 240Pin 512MX8 1.35V Unbuffered Samsung Chip
AQD-D3L4GN16-SG1
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DDR3 1600Mhz Unbuffered DIMM, 30μ" gold plating thickness, 1.35V power consumption, Samsung original chip.
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Product
4G SO-DDR3-1600 204Pin 512MX8 1.35V Unbuffered Samsung Chip
AQD-SD3L4GN16-SG1
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DDR3 1600Mhz Unbuffered SO-DIMM, 30μ" gold plating thickness, 1.35V power consumption, Samsung original chip.
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Product
Anti-Sulfurated High Power Wide Terminal Chip Resistors
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Panasonic Industrial Devices Sales Company of America
An AEC-Q200 Compliant SeriesPanasonic components specified as AEC-Q200 Compliant are consistently designed into automotive systems. However, today’s Design Engineers are specifying AEC-Q200 components to meet the high-quality standards of devices beyond automotive applications.
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Product
32GB SO-DIMM DDR5-5600 262Pin 2GX8 1.1V Unbuffered Hynix Chip
AQD-SD5V32GN56-HB
Memory Module
Hynix Original Chip, Increased Banks and Burst Length, DDR5 5.6GT/s. Same-Bank Refresh, On-die ECC for Enhanced RAS.
