Thermal Expansion
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Thermal Vacuum Chamber & Control
Based on several successful deliveries of complex DAQ systems, WinSoft was selected by 2 major satellite manufacturers to design and build a DAQ and Control systems which are connected to various thermal vacuum chambers - all connected to a central database.The chambers are used for environmental testing. The data collected by the DAQ system is recorded continuously every few seconds over a period of a few months.
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CAN FD/CXPI Communications Expansion Kit
OP-SB87FD
OP-SB87FD is an expansion board for LE-8200A/LE-8200 used for monitor/simulation of CAN (ISO 11898-1), CAN FD (ISO11898-1:2015), and CXPI (JASO D015). With this kit and the line state sheet, LE-8200A/LE-8200 works as a stand-alone type analzyer for CAN, CAN FD, and CXPI. The board supports development of CAN (used for automotive industry and other industries), CAN FD (next-generation standard of CAN providing more high-speed and communication capacity), and CXPI (invented in Japan to replace direct wirings) devices.
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Marine Thermal Handheld Camera
Ocean Scout 640
The Ocean Scout 640 is a rugged, handheld thermal camera that lets you see other vessels, landmarks, buoys, and floating debris in total darkness. The Ocean Scout 640 offers the tools you need to see clearly, steer confidently, and respond quickly in an emergency. With its high resolution LCD display and FLIR’s industry-leading thermal sensor technology, Ocean Scout makes your time on the water safer and more relaxing.
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Multispectral PTZ Thermal Camera
FLIR Elara DX-Series
The FLIR Elara™ DX-Series multispectral pan/tilt/zoom (PTZ) security camera provides full situational awareness in the most punishing environments. Combining thermal and visible light imagers, the Elara DX-Series gives operators the ability to monitor large areas in complete darkness, glaring light, and adverse weather. The exceptional detection and identification capabilities of multispectral cameras help integrators provide solutions for challenging imaging problems at critical infrastructure sites and remote facilities.
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EM & Thermal Simulation Software
SEMCAD X
Schmid & Partner Engineering AG
SEMCAD X is the latest generation of 3-D FDTD full-wave simulation software offering unprecedented levels of user-friendliness, speed & memory efficiency. Its application range has been further greatly extended by incorporating the world's first EM ADI-FDTD solver.
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Fixed Network Thermal Cameras
FLIR FC-Series R (Automation)
The FC-Series R features on-board, non-contact temperature measurement capabilities for fire detection, safety, and thermal monitoring of substations, waste disposal, and valuable equipment. FC-Series R combines state-of-the-art image detail and on-board video analytics to provide reliable detection. Flexible alarming options include email, web and mobile apps, edge image storage, digital outputs, or VMS event notifications.
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Thermal Engineering Projects
Precision Development Consulting Inc
Open loop temperature controller, LED process tool, Single wafer CVD chamber, Batch CVD Tool, Batch ALD Tool, MOCVD equipment, Device cooler
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Thermal Shock Test Chambers
How well does your product stand up to the shock of extreme thermal temperature changes? Tenney Environmental's thermal shock test chambers take products from 200°C to -65°C in just seconds.
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DSP, Expansion & Software
A wide range of products designed to control, mix, and optimize audio signals.
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Special Function I/O Expansion
This add-in module is 40 times faster than USB 1.x implementations and supports signaling up to 480 Megabits per second (Mbps). It is based upon the NEC uPD720101 USB 2.0 host controller that is supported by a wide range of operating systems including Windows and Linux.
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PMC/XMC Expansion Card
EXP238
The EXP238 is a 6U VMEbus form factor expansion card offering three XMC/PMC expansion sites. When ordered as an option for the XVB603 VMEbus single board computer, the 3-slot solution greatly expands system flexibility.
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TRA-300 LED Thermal Resistance Structure Analyzer
Hangzhou Everfine Photo-E-Info Co., LTD
The TRA-300 accurately measures the thermal resistance, junction temperature, optical power, voltage, current and other parameters of LED packaging products.The heating and cooling curves of LED can also be obtained, and the integral and differential thermal structure functions can be obtained by establishing the finite element model.Through the structural function analysis of the TRA-300 special software, the fine thermal resistance structure of the LED (from the chip to the thermal resistance value of each package structure) can be obtained, so as to objectively evaluate the heat dissipation quality and thermal management level of the LED package products, and provide the best verification for the heat dissipation design of the LED.
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Data Acquisition Module for Embedded Systems with IO60 expansion
IO60-M410
WINSYSTEMS’ IO60-M410 is a reliable data acquisition module for embedded systems with IO60 expansion featuring 24 GPIO (General Purpose Input-Output) tolerant to 30 V DC. Activity LEDs indicate device communication and DAC fault. WINSYSTEMS can provide custom configurations for OEM clients. Please contact a Applications Engineer through our contact page for details.
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Serial I/O Expansion
It is well suited for embedded applications requiring a large number of serial I/O ports. Each channel supports RS-232, RS-485, and RS-422 electrical levels to interface to a wide variety of serial communications devices such as modems, data collection equipment, and distributed I/O terminals. The PCM-COM8 will operate over the full industrial temperature range of -40 to +85 Celsius.
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Isolated Analog Input Expansion Board
MSXB 084
The MSXB 084 Isolated Analog Input Expansion Board provides isolated analog inputs for DAP systems. Use these boards to eliminate ground currents – a potential source of noise in your measurement and control signals – and eliminate timing skew.
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Professional Thermal Imaging Cameras
PeakTech Prüf- und Messtechnik GmbH
Is a thermal imaging camera with a thermal resolution of 160x120 thermal image points with a high-quality sensor, which makes even the smallest temperature differences visible. All thermal images can be opened and evaluated using the enclosed software, with subsequent changes, e.g. can be done on the pallet selection. Use this new development to find thermal bridges in thermography, leaks in systems and pipe systems or track heating pipes in walls and floors.
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Thermal Shock Environmental Test Chamber
Guangdong Bell Experiment Equipment Co.,Ltd
DGBell’s Thermal Shock Chamber provide the sudden temperature changes between extreme cold and extreme hot from -65℃ to 150℃ (customized available), specially for environmental stress screen test of the industries that rely on thermal testing, such as component, board electronic assemblies, defense, material stress, consumer products etc. The thermal shock test can cause faulting or cracking by the expansion and contraction on the products, indicates the hidden manufacturing defects. Bell’s Thermal Shock Chamber ensure you to launch qualified product to the market.
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Thermal Imaging
Omega's thermal imaging products are designed for non-contact temperature measurement with the unique feature to see temperature gradients. Some can capture images and measure multiple spots.
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Marine Thermal Cameras with Active Gyro-Stabilization
FLIR M364
Pairing a rugged, all-weather design with one of the most advanced FLIR thermal imaging cores, the M332 and M364 deliver awareness-enhancing thermal vision for law enforcement, commercial, and recreational applications. Advanced gyro-stabilization and high-performance thermal imaging detect obstacles and targets in complete darkness and heavy seas, allowing safe navigation in the most challenging conditions.
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Thermal Imaging Range
Di-LOG Offer the full FLIR Thermal Imaging range. Contact us for more information and to book your on-site demonstration
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Vertical Thermal Shock Chambers
FSV Series
Bemco FSV Series Vertical Thermal Shock chambers are available in two zone (FS2V - hot and cold) and three zone (FS3V hot - cold - hot) versions, with two temperature ranges (-75 C to +200 C or -160 C to +200 C), and two types of cooling systems (all mechanical cooling - no expendable refrigerant required, or all LN2). Very low temperature, -160 C chambers, are always liquid nitrogen cooled. Two zone chambers are offered in four standard sizes, while three zone chambers are offered in three standard sizes.
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Thermal Load Boards
Thermal Engineering Associates, Inc.
A Thermal Load Board (TLB) is used to simulate an application printed circuit assembly (PCA) either before all the heat-producing components are available for mounting on the application PCA or if the heat-producing components require complex electronic circuitry to create heat within the components. The TLB is typically designed to be as mechanically and thermally equivalent to the application PCA and usually offers a way to vary the power dissipation of the elements that simulate the heat-producing components.
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Low Thermal EMF Relays
Series 100
The Pickering Series 100 is a complete range of Single-in- Line (SIL) reed relays primarily intended for direct drive from 4000B CMOS or similar low current sources. They feature a very low level of thermal EMF.
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Thermal Imagers & Systems
Advanced Energy’s turn-key thermal imagers and systems accurately measure temperature and use reliable infrared technology. These high-tech instruments can precisely determine the temperature and temperature distribution of small and fast-moving objects.
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PCIe Gen3 Module For PCIe Bus Expansion
PCI123
The PCI123 is VadaTech’s 3rd generation PCIe expansion module based on the PCI-SIG specification. The board is a high-speed bridge from the host PCIe bus to VadaTech’s UTC006 PCIe Gen 3 x16 MCH.
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Thermal Camera
Shenzhen UYIGAO Electronic Technology Co., Ltd
This is an infrared thermal imager that combines the functions of surface temperature measurement and real-time thermal imaging. The traditional thermal imaging camera needs to measure each component one by one, while this instrument does not need to. Therefore, it helps to save your time. Even the potential problems can be clearly displayed on the color screen which helps users quickly locate the central point to measure cursor and temperature.
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XMCspan XMC Expansion Board
XMCspan
The XMCspan allows users to customize and expand I/O options when coupled with VMEbus SBCs, adding up to 4 XMC or PMC slots.
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Thermal and Mechanical Testing System
3500 System
The Gleeble 3500 is a fully integrated digital closed loop control thermal and mechanical testing system. Easy-to-use Windows based computer software, combined with an array of powerful processors, provides an extremely user-friendly interface to create, run and analyze data.
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Thermal Characterization Testing Services
Thermal Engineering Associates, Inc.
Thermal Characterization - TEA offers this service to customers having need for precise thermal parameter values for product data sheets, purchase specifications, specific application configurations, and/or device comparisons. This service is offered for a wide range of Discrete Devices (i.e., Bipolar Junction Transistors, MOSFETs, IGBTs, Diodes, SCRs, Triacs) and Integrated Circuits (i.e., digital, linear and mixed-signal devices).
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Handheld Thermal Imaging Camera
RevealPRO
RevealPRO is our most advanced handheld thermal imaging camera yet. Highly durable and easy to use, RevealPRO combines a high-performance 320 x 240 thermal sensor with intuitive software to help you work smarter. And, when you need it, a powerful 300-lumen LED light is available at the touch of a button. Offering adjustable thermal level, span, and emissivity settings, RevealPRO breaks new barriers by offering high-resolution thermal imaging and software capabilities at an affordable price of $699.00 USD.
