Product

Coupler Workstations

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Lightel Technologies, Inc.

Lightel Technologies, Inc.

Workstations using pure hydrogen gas from a tabletop generator, tank supply, or oxygen, can achieve high enough temperatures to develop Fused Biconic Tapered devices, Power Combiners, Wavelength Division Multiplexers, Thermal Core Expansion devices, and many other products.

Product

Digital Image Correlation System for Complete 3D Warpage, Thermal Expansion, and Strain Analysis of Materials and Components in the Heating and Cooling Phase

Q-400 TCT

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Dantec Dynamics A/S

Q-400 TCT - Dantec Dynamics A/S

The Q-400 TCT system is designed for complete three-dimensional and highly sensitive warpage, thermal expansion measurement and strain analysis of materials and components in the heating and cooling phase. Areas from 50 mm x 70 mm down to 2 mm x 3 mm can be investigated. Measurements can be done from room temperature up to 300°C and down to -40°C. The system is specially suited for thermal expansion measurement of electronic components and is frequently used in the development and testing of complex anisotropic materials, components, and structures in electronic applications.

Product

Horizontal Dilatometers

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TA Instruments

TA Instruments

TA Instruments’ unique True Differential configuration makes our dilatometers the preferred choice for the most accurate measurement of Coefficient of Thermal Expansion (CTE). The high precision linear position sensor, the thermostat equipped measuring head housing, and the use of thermally ultra-stable materials all contribute to the outstanding displacement resolution, and ensure the most accurate measurement of low CTE values.

Product

SM / Expansion Unit

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Eclypse International

Eclypse International

A testing procedure designed to thoroughly test the electrical characteristics of a wire or cable, may require additional test points to connect the end points of all conductive paths. The changing and alteration of Test Adapter Cables (TACs) would become obsolete when having access to one or several expansion units. Increased testing efficiency alleviates the long, drawn out down times of the disabled aircraft while improving product readiness. Additional time can be spent on troubleshooting and problem identification and will not require the user to unhook and connect TACs to different matrices. Adding additional expansion units will save the user time, money, and effort.

Product

Thermal Printer

DP-581H

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Graphtec Corporation

DP-581H - Graphtec Corporation

It allows to print data without AC power by driven with built-in rechargeable battery, enables to use anywhere. Lithium-ion battery (6-cell, 11.1 V, 6000 mAh, 66.6 Wh)

Product

Expansion I/O Module.

SI-MOD66xx

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Sheldon Instruments

SI-MOD66xx - Sheldon Instruments

The SI-MOD66xx is a family of high resolution, multi function data acquisition and control modules that plug into any SI-CxDSP carrier processor card for the PCI bus.

Product

Expansion Peripherals

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Campbell Scientific, Inc.

Campbell Scientific, Inc.

Expansion peripherals are used with data loggers to achieve many purposes, including the following: add additional channels, extend data communications networks, perform media conversions, read vibrating wire sensors, and build distributed measurement networks.

Product

Thermal Analysis

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TA Instruments

TA Instruments

Thermal Analysis is important to a wide variety of industries, including polymers, composites, pharmaceuticals, foods, petroleum, inorganic and organic chemicals, and many others. These instruments typically measure heat flow, weight loss, dimension change, or mechanical properties as a function of temperature. Properties characterized include melting, crystallization, glass transitions, cross-linking, oxidation, decomposition, volatilization, coefficient of thermal expansion, and modulus. These experiments allow the user to examine end-use performance, composition, processing, stability, and molecular structure and mobility.

Product

Thermal Imaging

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Transcat, Inc.

Transcat, Inc.

Transcat is an industry-leading supplier of thermal imagers and infrared cameras for every application, ranging from building or HVAC diagnostics and spot temperature measurement to complex and operation-critical industrial preventative maintenance and energy loss analysis. Our featured thermal imaging brands, Fluke and FLIR, continue to expand their diverse range of product offerings with new and innovative cameras at every price level.

Product

FMC Expansion I/O Module.

SI-MOD32xx

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Sheldon Instruments

SI-MOD32xx - Sheldon Instruments

The SI-MOD32xx is a family of high resolution, FMC form factor, high channel count multi function data acquisition and control modules that plug into any SI-DSP or FPGA carrier card.

Product

Expansion Data Acquisition Boards

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ICP DAS USA, Inc.

ICP DAS USA, Inc.

ICP DAS USA offers Data Acquisition Expansion Boards for our programmable controllers, which allows users to upgrade the capabilities of their current controllers for new or revised use. Featuring different I/O configurations, the Data Acquisition Expansion Boards are available for the I-7188 embedded data acquisition controllers, VPD touch screen controllers, LinPAC and WinPAC Linux and Windows based programmable automation controllers, and much more!

Product

Analog Input Expansion Board

MSXB 037

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Microstar Laboratories, Inc.

MSXB 037 - Microstar Laboratories, Inc.

The Microstar Laboratories Analog Input Expansion Board, part number MSXB 037, provides analog input expansion for Analog Backplane systems. The Analog Input Expansion Board is compatible with the MSXB 030-01 and MSXB 031-01 Analog Backplanes.

Product

Thermal Cameras

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Excelitas Technologies Corp.

Excelitas Technologies Corp.

Excelitas designs and manufactures a range of medium and long range thermal cameras covering the MWIR and LWIR wavebands.  All cameras utilize the latest sensor technologies and benefit from our proven pedigree in designing and manufacturing high performance optical modules and cameras for demanding surveillance, targeting, naval and C-UAS applications.

Product

Thermal Wafer Chuck

HC4000 Series

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American Probe & Technologies, Inc.

HC4000 Series - American Probe & Technologies, Inc.

A specialized hardware component used in semiconductor testing to hold and heat or cool silicon wafers during analytical probing.

Product

Thermal Imager with App

testo 872

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Testo AG

testo 872 - Testo AG

The testo 872 thermal imager is ideally suited for professional industrial and building thermography - at the same time it ensures your work is both quick and easy. It is versatile to use, for example in industrial and mechanical maintenance or for detecting structural defects. You can generate error-free and objectively comparable infrared images using its handy functions. The IFOV warner, testo -Assist and testo ScaleAssist mean you can avoid measurement errors and not only effortlessly achieve optimum setting of emissivity () and reflected temperature (RTC) for building thermography, but also of thermal image scale.

Product

PMCspan PMC Expansion Board

PMCspan

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ELMA Electronic, Inc.

PMCspan - ELMA Electronic, Inc.

SMART Embedded Computing’s PMCspan allows users to customize and expand I/O options when coupled with a Smart SBC.

Product

Thermal Neutron Detector

TN15

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Kromek Group plc

TN15 - Kromek Group plc

The TN15 high sensitivity thermal neutron detector utilizes a state-of-the-art silicon photomultiplier (SiPM) and offers world-leading specification in a compact form. The TN15 surpasses the performance of a 100mm long 13mm3 He tube at 4 atmospheres and does not need cooling but operates at room temperature.

Product

Thermal Load Boards

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Thermal Engineering Associates, Inc.

Thermal Engineering Associates, Inc.

A Thermal Load Board (TLB) is used to simulate an application printed circuit assembly (PCA) either before all the heat-producing components are available for mounting on the application PCA or if the heat-producing components require complex electronic circuitry to create heat within the components. The TLB is typically designed to be as mechanically and thermally equivalent to the application PCA and usually offers a way to vary the power dissipation of the elements that simulate the heat-producing components.