Showing results: 256 - 270 of 280 items found.
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DCS-120 -
Becker & Hickl GmbH
*FLIM Upgrade for Existing Conventional Microscope*Two Fully Parallel TCSPC FLIM Channels*Compact bh Simple-Tau or Power-Tau System*Scanning by Fast Galvanometer Mirrors*Channel Seperation by Dichroic or Polarising Beamsplitters*Individually Selectable Pinholes and Filters*One or Two BDL-SMN or BDS-SM ps Diode Lasers*Two Fully Confocal Detection Channels*Two HPM-100-40 GaAsP Hybrid Detectors*Optional: Two HPM-100-06 Hybrid Detectors, IRF Width < 20 ps FWHM*Optional: HPM-100-50 Hybrid Detectors for NIR FLIM*Optional: Multi-Wavelength FLIM*Excellent Time Resolution: Electrical IRF Width 6.5 ps FWHM*Time Channel Width Down to 813 fs*Megapixel FLIM, Up to 2048 x 2048 Pixels at 256 Time Channels*Simultaneous FLIM/PLIM*Wideband Version, Compatible with Tuneable Lasers*Electronic Pinhole Alignment*Z-Stack FLIM Acquisition with Zeiss Axio Observer Z1*Optional: Spatial Mosaic FLIM via Motorized Sample Stage
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DCS-120 MP -
Becker & Hickl GmbH
*Multiphoton FLIM Upgrade for Existing Conventional Microscope*Two Fully Parallel TCSPC FLIM Channels*Compact bh Simple-Tau or Power-Tau System*Scanning by Fast Galvanometer Mirrors*Channel Seperation by Dichroic or Polarising Beamsplitters*Individually Selectable Pinholes and Filters*Excitation by Ti:Sa Laser*Two Non-Descanned Detection Channels*Two HPM-100-40 GaAsP Hybrid Detectors*Optional: Two HPM-100-06 Hybrid Detectors, IRF Width < 20 ps FWHM*Optional: HPM-100-50 Hybrid Detectors for NIR FLIM*Optional: Multi-Wavelength FLIM*Excellent Time Resolution: Electrical IRF Width 6.5 ps FWHM*Time Channel Width Down to 813 fs*Megapixel FLIM, Up to 2048 x 2048 Pixels at 256 Time Channels*Simultaneous FLIM/PLIM*Electronic Pinhole Alignment*Z-Stack FLIM Acquisition with Zeiss Axio Observer Z1*Optional: Spatial Mosaic FLIM via Motorized Sample Stage*Laser Control via SPCM Software
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2580 Series -
Instron
Instron® load cells are a key part of a materials testing system. Instron is the only global materials testing supplier that designs and manufactures its own load cells. This ensures that Instron load cells meet the unique requirements of materials testing such as; high accuracy over a wide measurement range, high stiffness, resistance to offset loads, accurate alignment and excellent zero stability. The 2580-xxxN Series load cells are specifically designed for use with 5900 testing systems; offering exceptional performance with the ability to measure forces as low as 1/1000th of the force capacity to an accuracy of 0.5% of reading.The load cells can withstand loads up to 150% of their force capacity without damage and 300% without mechanical failure. Automatic transducer recognition and electrical calibration, makes them easy to use. The load cells allow the user to zero out the tare weight of a grip or fixture that weighs up to 10% of the force capacity, while still maintaining the full specified accuracy.
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DCS-120 Macro -
Becker & Hickl GmbH
*FLIM of Macroscopic Objects*Scan Field Up to 15 mm Diameter*Two Fully Parallel TCSPC FLIM Channels*Compact bh Simple-Tau or Power-Tau System*Scanning by Fast Galvanometer Mirrors*Channel Seperation by Dichroic or Polarising Beamsplitters*Individually Selectable Pinholes and Filters*One or Two BDL-SMN or BDS-SM ps Diode Lasers*Tuneable Excitation by Super-Continuum Laser with AOTF*Two Fully Parallel Detection Channels*Two HPM-100-40 GaAsP Hybrid Detectors*Optional: Two HPM-100-06 Hybrid Detectors, IRF Width < 20 ps FWHM*Optional: HPM-100-50 Hybrid Detectors for NIR FLIM*Optional: Multi-Wavelength FLIM*Excellent Time Resolution: Electrical IRF Width 6.5 ps FWHM*Time Channel Width Down to 813 fs*Megapixel FLIM, Up to 2048 x 2048 Pixels at 256 Time Channels*Simultaneous FLIM/PLIM*Wideband Version, Compatible with Tuneable Lasers*Electronic Pinhole Alignment*Optional: Spatial Mosaic FLIM via Motorized Sample Stage
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EV Group
An accurate wafer bonding process is the key factor in obtaining high quality single crystalline silicon films on insulating substrates. The EVG850 SOI/Direct Wafer Bonding systems are designed to fulfill a wide range of fusion/molecular wafer bonding applications, with main focus on SOI substrates manufacturing. Ultra clean handling of wafers throughout the bonding process assures high-yield and void-free bonds. All essential steps, from cleaning and alignment to pre-bonding and IR-inspection are combined in one high volume production system. EVG850 is the only production bonding system built to operate in high throughput, high-yield environments and guarantees void-free SOI wafers up to 300 mm.The EVG300 series single wafer cleaning systems are designed for efficient removal of particles. In semiconductor processing, efficient cleaning and particles removal prior to critical process steps enables maximum yield. Wafer Bonding is a process which is strongly affected by particles: each particle on the wafer surface produces a void orders of magnitude larger than its diameter, contributing to a dramatic yield loss.
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Muquans, SAS
The Absolute Quantum Gravimeter is the only quantum gravity sensor available on the market place. Thanks to its disruptive technology, this instrument offers unique features:*Absolute gravity measurement at the µGal level.*Automated Continuous Data Acquisition for several months. No long-term drift.*Excellent immunity to ground vibrations thanks to an active compensation system (no mechanical isolation).*Easy and quick operation : the AQG is ready to measure within 1h (no laser alignment nor mechanical assembling, no preliminary pumping, no superspring). User-friendly software requiring no knowledge in quantum physics.*Compact and transportable sensor.*Low maintenance constraints (in particular, no moving parts in our vacuum chamber).*Station to station repeatability of the absolute measurement within a few μGal.
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MPI Advanced Semiconductor Test
MPI designed dedicated SiPH upgrades for its well known 200 and 300 mm probe systems, which includes:*Various options of high-precision fiber alignment systems for ultra-fast scanning routines*Multiple measurement capabilities for O-O, O-E, E-O and E-E device configuration*Integrated Z-sensing for detecting the fiber to wafer contact point*Crash protection when using two optical fiber arms*Wide temperature range from -50°C to 200°C*Optional dark box for testing in light tight environment*Extensive software package for supporting easy integration to operator’s test executive*Probe system compatibility: TS2000-IFE, TS2000-SE, TS3000, TS3000-SE, TS3500 and TS3500-SE
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Model 8256 -
Pentek, Inc.
- Video: AOC 2021 Mercury's Model 8256 SOSA Aligned Dev. Platform and RFM3202 Microwave Transceiver- Video: Model 8256 3U VPX SOSA Aligned Development Platform, multi-vendor operation demonstration- Video: Model 8256 3U VPX SOSA Aligned Development Chassis- Developed in alignment with the SOSA™ Technical Standard- Ideal development platform for Pentek's- Model 5550 8-Channel A/D & D/A Zynq UltraScale+ RFSoC Processor - SOSA Aligned 3U VPX- Model 5553 8-Channel A/D & D/A Zynq UltraScale+ RFSoC Processor - SOSA Aligned 3U VPX- 8-slots provide space for a range of acquisition and processing boards- Optional rear panel RF and optical connections- Compatible with the Quartz product family
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1120 -
Photon Kinetics
The Photon Kinetics 1120 Bare Fiber Aligner makes it possible to reduce test setup time to seconds, thereby reducing overall testing cost. Just strip the fiber, scribe and break it (or use a more precise fiber cleaver, if desired) and then insert the prepared end into the 1120. In an instant, the fiber is coupled to your OTDR or chromatic dispersion test system with low optical loss and low reflectance. The 1120's compact, ergonomic industrial design is well-suited for low to moderate volume fiber and cable testing applications where automated fiber alignment systems are less economical. It is particularly useful as part of an in-process or finished cable test station employing either the 8000i or 8000 OTDR, and the OASYS.net OTDR Automation Software.
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Circuit AOI 4.0 -
Machvision
Circuit AOI 4.0 is a set of industry-standard, automated precision inspection systems that combine precision, robust construction and line-of-sight technology for assembly and production under stringent regulatory standards and is ideal for PCB / HDI line inspection.It uses innovative alignment detection logic to detect defects such as short / open circuit, protrusion / depression, scratch, pinhole, residual copper, line width / line distance violation, missing objects, unwanted objects, and so on. The system can be used with off-line set-up station and off-line re-check station to enhance the detection capacity.Circuit AOI 4.0 uses multi-angle LED light source, compared to the traditional single angle light source design, can obtain the best image contrast, widely used in different plate inspection.
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MCL-NSOM -
Mad City Labs Inc.
The MCL-NSOM is a fully operational near field scanning optical microscope. It has been built on Mad City Labs versatile RM21™ inverted optical microscope which allows users to convert between NSOM, SPM, and fluorescence optical microscopy techniques. The MCL-NSOM builds on our successful resonant probe SPM and incorporates common elements such as the MadPLL® phase lock loop controller. The NSOM also exploits our expertise in precision motion control by including six axes of motorized positioning, for the sample and NSOM probe, and three axes of closed loop nanopositioning to provide exceptional position resolution and accuracy. The MCL-NSOM also includes a 635nm laser excitation source, fiber launch, oil immersion objective lens (100x, 1.25 N.A.), CMOS alignment camera and avalanche photodiode detector. The microscope configurable design allows researchers to tailor the instrument for many different optical microscopy techniques including near field spectroscopy. The MCL-NSOM is operated in aperture mode with shear force feedback. The standard 5 modes are supported: illumination, collection, illumination and collection, reflection and reflection collection. We supply a LabVIEW™ based software package which automates the motion control features.
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Thorlabs, Inc.
Thorlabs' Mode-Conditioned Light Sources are fiber-coupled LED sources that have an output with a flat-top profile in the far field. Common applications include the testing of multimode fused fiber components as well as verification of modal behavior in fiber-based setups. Standard fiber-coupled LED sources can have a range of output profiles that are usually not uniform and vary from source to source. This can be dependent on emitter orientation, alignment with fiber tip, and connector assembly. These mode-conditioned sources have been engineered to distribute light evenly into all transverse modes, resulting in an equilibrium modal distribution at the output. The front panel includes an adjustment knob to control the power and an output port that accepts 2.2 mm wide-key FC/PC connectors. A DS15 15 V power supply with a location-specific plug is included with each device.
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MTI Instruments
MTI Instruments offers high resolution capacitance sensors, probes and systems that generate low noise, highly accurate and high stable measurements. Our Capacitance sensor line-up offers accurate measurements for automated inspection applications such as thread quality inspection, disk drive run-out, leveling or flatness measurement, lens alignment, tire run-out and bulging. Our Accumeasure capacitive sensors offer large stand-off distance that includes single and multiple channel rack systems that connect up to 10 capacitive sensors or capacitance probes with individual analog measurement outputs. We also offer cost-effective customized capacitive sensor amplifier board and probe system for easy integration. Our inspection systems linearity exceeds 0.01% full scale measurement (FSM) and resolution to sub nanometers.
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LumiSun-50 -
Innovations In Optics Inc.
The LumiSun-50™ is a high power, multi-wavelength LED solar simulator that meets IEC 60904-9 Class AAA for spectral match, uniformity of irradiance, and temporal stability. The LumiSun-50 achieves a spatially uniform illumination field from a chip-on-board (COB), multiple-wavelength LED die array. The field of illumination is 50 x 50 mm at a working distance of 200 mm. The LumiSun-50 includes a driver/controller which individually provides constant current to each die in the COB array. Total irradiance of 1.1 sun units is provided and can be decreased to 0.1 suns. The LED light source of the LumiSun-50 is contained within an air-cooled housing that can rotate the angular beam alignment. Adjustment and setting of the optimum light path working distance is visually facilitated by a converging pair of red dot laser pointers.
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ficonTEC Service GmbH
Our machines employ industry-proven production technologies – micro-positioning, active/passive precision alignment, attachment via welding, soldering and/or bonding, and automated optical inspection. ficonTEC also provides a suite of test capabilities for individual components and hybrid opto-electronic devices, both on and off-wafer. Moreover, with everything being orchestrated by our flexible PROCESS CONTROL MASTER software, the machine platforms and product lines described below become so much more than just the sum of their parts. The technologies and capabilities implemented in all machine platforms translate into a broad and established spectrum of production process expertise. We are continually refining capability, modularity and design so that these systems reliably and cost-effectively meet and exceed efficiency and yield requirements even for cutting-edge production processes. For the team here at ficonTEC, we face your challenges every day.
