Memory Test Systems
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Memory Test Systems
ICs that record and retain data are called memory devices. Our memory test systems are optimized for volume production of memory semiconductors, a market where low-mix high-volume production is the norm, and feature industry-best parallelism (the ability to test a large number of semiconductors at the same time).
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Memory Test System
T5511
Offering Multi-functionality and Industry's Top Test Speed of 8Gbps.
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Flash Memory Test System
T5830
T5830 memory tester, the latest member of its T5800 product family, optimized for testing a wide range of flash memory devices used in mobile electronic devices. The highly flexible T5830 tester has all of the capabilities needed to perform wafer sorting and final testing of price-sensitive flash memories.
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Memory Test System
T5835
The new T5835 has full testing functionality, from package testing to high-speed wafer testing, for any memory ICs with operating speeds up to 5.4 Gbps, including all next-generation memories from NAND flash devices to DDR-DRAM and LPDDR-DRAM. It can handle 768 devices simultaneously for final package-level testing. It additionally features functions such as an enhanced programmable power supply (PPS) for advanced mobile memories, and a real-time DQS vs. DQ function to improve yield.
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Memory Burn-In Test
The N3500 is Neosem Technology’s fourth generation memory test system. Specifically designed for Flash Components and Flash Cards, the N3500 tester-on-a-board architecture targets the broadest range of DUT technologies in various form factors and packages. Each Tester Board (or “Blade”) contains 288 I/O pins and 32 DPS supplies.
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Memory Test System
T5830/T5830ES
Highly flexible tester which has all of the capabilities needed to perform wafer sorting and final testing of price-sensitive flash memories
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Memory Test System
T5833/T5833ES
T5833 system is a cost-efficient, high-volume test solution capable of performing both wafer sort and final test of DRAM and NAND flash memory devices. Amid surging sales of mobile electronics, DRAMs, NAND flash memories and multi-chip packages (MCPs) — the main device types used in smart phones and tablets — are quickly evolving toward higher speeds and greater device capacity. Internet and cloud servers also are driving demand for faster, higher-capacity ICs. Yet the cost of testing today's wide array of memory devices is an obstacle for chipmakers, which urgently require solutions that can deliver high functionality, high performance and low cost of test (COT). Advantest's new, multifunctional T5833 memory test system meets these needs, delivering both wafer sort and final test capabilities for a full range of memory devices, including LPDDR3-DRAMs, high-speed NAND flash memories and next-generation non-volatile memory ICs.
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Memory Test System
T5851/T5851ES
The T5851 system is designed to provide a cost-effective test solution for evaluating high-speed protocol NAND flash memories including UFS3.0 universal flash storage and PCIe Gen 4 NVMe solid-state drives (SSD), both of which are expected to be in high demand for the LTE 5G communications market.
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Memory Test System
T5801
Capable of Testing Ultra-High-Speed DRAM Devices, Supporting Next-Generation GDDR7, LPDDR6, and DDR6 Technologies
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Memory Test System
T5230
T5230 memory test system for NAND/NVM devices adopts a combined array architecture to achieve best-in-class cost-of-test performance for wafer test, including wafer-level burn-in (WLBI) and built-in self-test (BIST). The system can perform on-wafer test of 1,024 memory devices per test head in parallel, delivering high productivity and enabling floor space savings of up to 86%. Multiple test cells are connected per system controller in the T5230, allowing independent wafer test of each test cell. The test cells can be stored in a general multi-wafer prober while minimizing the test cell floor space, and the tester can be docked with probers in both linear and multi-stack configurations. For functional tests at a maximum test rate of 125MHz/250Mbps, the T5230 assures high timing accuracy, repeatability, and failure detection capability.
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Memory Test System
T5221
The T5521 is a memory test system that supports wafer test and wafer burn-in test of non-volatile memory devices such as NAND flash, housed within a multi-wafer prober to reduce test floor footprint.
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Memory Test Systems
T5503HS2
Semiconductor memories are in high demand to meet the needs of fast-growing end markets such as portable electronics and servers. It has been forecasted that applications ranging from mobile devices and data centers to automobiles, gaming systems and graphics cards will consume an estimated 120 billion gigabits of DRAM capacity. To meet this market demand, new generations of memories with data-transfer speeds of 6.4 Gbps and higher are being developed. Advantest’s second-generation T5503HS2 tester is designed to handle these ultra-high-speed memory ICs.
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Standalone Bench Test System for FCT, ICT, ISP and Boundary Scan
LEON Bench
The LEONBench test system is a flexible and scalable test system that features an excellent signal integrity and a high-quality fixture interface. This is achieved by combining a cableless connection from ABex modules to Virginia panel interface connectors. The system is optimized for high pin count test applications. Furthermore, it can be equipped with vacuum and pneumatic. Support for multi-level contact fixtures enables separate contact levels for FCT and ICT. The Konrad ITA (Interchangeable Test Adapter) frame allows various fixture houses all over the world to build custom fixtures for the LEONBench. Up to 15U additional rack space allows adding a bunch of high-performance measurement devices from various manufactures. An integrated power distribution unit takes care about power on and off sequencing.As part of the LEON Family, LEONBench is based on the ABex platform which directly incorporates Konrad analog bus technology and PXI/PXIe in one chassis.
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Automated Test Systems
WinSoft designs, develops and integrates automated functional test systems for use in aerospace, military, high tech and commercial applications
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Mixed Signal Battery Test System
The Mixed-Signal Battery-Test System is an automated test platform designed to meet today’s advanced battery test requirements. The platform is ideal for testing a range of battery cells and packs, and can be used in applications such as research and design, quality control, and end-of-line manufacturing. Its distributed architecture provides a scalable solution with configurable system components to accommodate specific applications.
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Other Test Systems
Your business challenges do not fit the typical mold. Your test requirements are different. Ball Systems has more than 50 years of experience in multiple industries that has exposed our team to a wide variety of testing applications. As a result, we’ve likely created a solution for a challenge similar to yours.
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Scienlab Battery Test System – Pack Level, 110 KW Compact Version
SL1710A
Compact solution for testing Battery Packs with output power up to 110 kW and voltage range up to 1500 V
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Semiconductor Test System
TS-960e
The GENASYS Semi TS-960e PXI Express Semiconductor Test System is an integrated test platform that offers comparable system features and capabilities found in proprietary ATE systems. Available as a bench top system or with an integrated manipulator, the TS-960e takes full advantage of the PXI architecture to achieve a cost-effective and full-featured test solution for device, SoC and SiP test applications.
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Compact & Flexible Test Systems for FCT,ICT, ISP and Boundary Scan Designed for Easy Integration
LEON Rack
The LEONRack test system is a flexible test system that could be installed in automation or handling solutions. It is highly flexible and available in three different chassis sizes from low pin count to high pin count test systems. As part of the LEON Family, LEONRack is based on the ABex platform which directly incorporates Konrad analog bus technology and PXI/PXIe in one chassis.
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Eagle Test Systems
ETS-200T
The ETS-364 is a general-purpose precision analog and mixed-signal test platform designed for high volume production testing of integrated circuits; optimized for high throughput applications with a fully integrated multisite software and hardware architecture.
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PXI Semiconductor/IC Test System
A high-density 100MHz PXIe digital IO card designed for characterizing, validating, and testing a variety of digital and mixed-signal ICs. Each IO card consists of a Sequencer Pattern Generator (SQPG) and 32 channels of full ATE-like features. The 33010 IO card is expandable up to 256 channels. Some unique features of the 33010 include an on-board SQPG, per pin timing/levels/ PMU/TFMU, multiple time domains, and multithreaded testing for complex IC testing. Each channel is also equipped with 64M vector memory, 16 timing sets with on-the-fly timing change, and per pin timing and frequency measurements up to 400 MHz.
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VLSI Test System
3380
The 3380 VSLI test system equipped with a maximum of 1280 I/O channels, 256 VI sources, flexable architecture and comprehensive optional function boards (ADDA/Hi-voltage DPS) can meet the high parallel multi-test tendency.
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Universal Test System
LEON System
A universal ICT, FCT, ISP and Boundary Scan platform.Based on the ABex platform, which directly integrates Konrad analog bus technology and PXI/PXIe in one chassis, the LEON platform can be configured to solve various test challenges. Due to this architecture only one system provides the complete test flow combining ICT, ISP, Boundary Scan and FCT.Various form factors and configurations allow a perfect combination between cost, speed and test coverage. The modular architecture provides the possibility to reconfigure or upgrade the systems based on your test needs.The LEON System software provides a powerful development and test execution environment which directly supports NI TestStand. All systems and components could be integrated into third party software using supplied APIs.
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EMI Test System
TS9975
The R&S®TS9975 is the base system for conducted and radiated EMI measurements. Due to its modular design, it covers a wide range of applications and can be very easily adapted to the measurement task at hand. Any configuration is possible – from conducted measurements and the small precompliance system with a compact test cell to the accredited test system for large equipment under test. Combinations of different applications or incremental expansion are easily possible.
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Build-to-Print for Test Systems
Built-to-print / test system replication addresses your internal capacity and capability constraints. Ball Systems has perfected quoting, procurement, planning, assembly, testing, quality, delivery and installation to ensure your testers are on-time and on-budget, and meet design and production standards while keeping open and transparent communication.
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Test System Optimized for High Volume Production Testing of Integrated Circuits
ETS-364 / ETS-600
The ETS-364 is a general-purpose precision analog and mixed-signal test platform designed for high volume production testing of integrated circuits; optimized for high throughput applications with a fully integrated multisite software and hardware architecture. The test system offers separate floating resources for each site, improving site isolation and measurement accuracy coupled with digital instrumentation enabling the most efficient, high-volume testing available. The system supports up to 240 analog pin channels, and offers 133 MVPS digital vector rate with up to 128 digital pin channels. Eagle's scalability includes the ability to double the capacity of an ETS-364, providing more than 480 analog pin channels and up to 256 digital I/O pin channels with the ETS-600.
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Test System
BMS HIL
The BMS Hardware-in-the-Loop (HIL) Test System is a high performance platform providing all necessary input signals used for battery pack simulation. A real-time operating system executes complex cell and pack models commonly used for BMS algorithm development and firmware regression testing.
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Regenerative Battery Pack Test System
17020E
Charge/discharge modes (CC, CV, CP)Power Range: 10kW / 20kW per channelVoltage Range: 60V/ 100VCurrent Range: 100A/200A/300A/400A/ 500A/600A/700A/800A per channelRegenerative battery energy discharge, efficiency 85%Channels paralleled for higher currentsDriving cycle simulationFast current conversion without current interruptHigh precision measurementSmooth current without over shootTest data analysis functionData recovery protection (after power failure)Independent protection of multi-channel
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In-Circuit Test
TestStation LH
The TestStation LH in-circuit test system is a lower-cost, small footprint, feature scalable version of Teradyne's popular, award winning TestStation product family. TestStation LH features SafeTest protection technologies for accurate, reliable, and safe testing of the latest low-voltage technologies.
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Photonics Module Test System
58625
Chroma 58625 provides characterization testing for 3D sensing illumination devices. various test modules are combined for validation testing under precise temperature control.
