Probe Cards
semiconductor bond pad and signal terminals interchangeable electro-mechano Interface to tester.
See Also: Cards, Extender Cards, POST Cards, Test Cards, Probe Card Interfaces, Wafer, Test Probes
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Probe Cards
PICOPROBE® PROBE CARDS by GGB Industries, Inc., allows for more chip design flexibility because each probe card is custom configured to your circuit for testing wafers on either manual or automatic probe stations. Probe cards with complex layouts consisting of numerous DC contacts and multiple microwave probes with operating frequencies of 40, 50, 67, or 110 GHz can be custom fabricated quickly and inexpensively.
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Probe Cards
Minitile™ with Advanced Cantilever™ technology and WedgeTile™
Each probe is designed for wide temperature ranges and so the probe expansion characteristics are closely matched to the wafer’s expansion characteristics. This allows the user to take a fast measurement while a system is in a settling or thermal stabilization mode and helps compensate for wafer expansion.
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Probe Cards
Direct Dock
Direct dock style wafer probing allows for a higher bandwidth, increased pin density and testing more devices in parallel. Direct dock probe cards also support the growing movement of traditional final test to wafer probe which allows for known good die (KGD) and reduced cost of ownership.
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Probe Cards
These cards are compatible with WLCSP and can be customized according to pin positions. They can be used for a pitch of up to 180 μm. We are developing a product for a pitch of 150 μm, to be compatible with narrower pitches.
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Probe Cards
Ceramic Blades
SV TCL offers a variety of ceramic blades and blade probe cards. We have patented ceramic microstrip blade probes available in low leakage and low capacitance for optimal signal transference, while SV TCL's blade cards are ideal for parametric and RF testing.
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Cantilever Probe Cards
Venture
Nidec SV Probe’s VentureTM line of cantilever probe cards represents the finest epoxy technology on the market and are perfect for logic testing. The Venture line includes an extensive array of cantilever cards, single to multi-die for a variety of test systems. Other capabilities include: • 3K Points • Pad Pitches as Tight as 35µm • Up to 32 DUTsContact your Nidec SV Probe sales representative to determine which VentureTM product is right for your testing application.
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Probe Cards
Probe cards are the key in measuring reliability in the ever-evolving testing of semiconductor integrated circuits, which are becoming faster, more compact, and more efficient. We provide a variety of probe cards tailored to customer needs and test environments, always at the highest level of quality.
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Cryogenic 4K Probe Cards
Over the last 20 years the Celadon Engineering team has developed an expertise in cryogenic materials which has resulted in a solid reputation in the industry for producing extremely stable cryogenic on-wafer probe cards as well as DUT probing solutions. These Cryogenic probe cards have all the benefits of Celadon’s Crash Resistant™ probe technology but with the ability to probe as cold as humanly possible. Celadon’s cryogenic solutions vary from standard VersaTile™ footprints which interface to positioners to innovate custom PCB based designs to allow for flexibility when testing at these very cold temperatures. Lakeshore cryogenic wire is used in standard DC solutions for high density cable-out designs to support high pin count applications. During the development process, Celadon works closely with the cryogenic prober vendor to ensure the integrated solution is optimized for current and future testing needs.
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Probilt™ Probe Card Analyzers
ITC has a complete range of probe card metrology products that address all probe technologies, probe card sizes and probe counts.
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Probe Card
Japan Electronic Materials Corp.
The probe card is a tool for testing semiconductors used at "Wafer Test" to check quality of IC or LSI in the first process of semiconductor manufacturing. The probe card is expendable.
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Full Wafer Test System
FOX-1P
Enables High Throughput, Single Touchdown, Full Wafer Production Testing. Capable of simultaneously testing up to 16,000 die in a single wafer touchdown. Resource configurable up to 16,384 " Universal Channels " - each programmable as anI/O, Clock, Pin Parametric Measurement Unit ( PPMU ) or Device Power Supply ( DPS ). Software-enabled per site flexibility to support small and large device pin count test needs. Comprehensive functional and parametric test capabilities Deep functional pattern data and capture memory optimized for BIST/DFT testing. Per channel PMU for per site parametric testing Individual channel over-current protection to protect wafers and probe cards. Configured for high volume production. Compatible with industry standard probers and probe cards. Available as an integrated test cell with prober, probe cards and 16,384 channel probe I/F. Configurable as a single or dual system integrated test cell.
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Probe Holders
Model P7
Made from 300 series stainless steel, the P7 probe holders accept all model 407 replaceable probe tips, and are secured with a set screw. When used with the P7 Tool Holder Adapter Arm; “Z” position adjustments are easy, and can accommodate a variety fixtures and probe card holders. Designed for both high temperature (-65 to 300°C) and high electrical isolation measurements.
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PCIe Carrier For PMC And PrPMC
PCI104
The PCI104 is a PCIe carrier for PCI Mezzanine Cards (PMC) or Processor PCI Mezzanine Cards (PrPMC). The PCI104 carrier allows simplified testing of PMC/PrPMCs and their associated PMC I/O Modules (PIMs) by using a PC environment during board development or deployment. The PCI104 can also reduce the costs of manufacturing PMC/PrPMCs by allowing manufacturers to use off-the-shelf PCs for functional testing. The PCI104 converts the PCIe x4 edge connection to PCI-X via a PCIe to PCI-X bridge. The trace lengths to the PMC/PrPMCare kept to a minimum so the PMC/PrPMC can run with a133MHz PCI-X clock speed. The J4 connector of the installed PMC/PrPMC is routed to a 96-pin DIN connector per theVITA-35 specification. The PCIe to PCI-X bridge can run in either transparent or non-transparent mode and can also operate in forward or reverse mode. The PCI104 has a fan mounted on the board to cool the PMC/PrPMC. The fan can easily be removed for testing and probing of hosted card.
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Cost-Effective ATE System
PRO RACK ATE
Qmax Test Technologies Pvt. Ltd.
Pro-Rack is a cost effective ATE System, which comes with Modular Structure provision option to improvise and enhance much instrumentation based on the user’s requirements. Basically it is designed to cater to the needs of PCB test and repair depots, keeping in mind the changing PCB technology and the challenges in testing them off-line. It can provide complete PCB test and diagnostic functions for any kind of PCB including the latest very high density complex PCBs with high pin count PQFP, FPGA VLSI chips. AC /DC parametric tests enables testing of the DC parametric of device pins on the edge connector for input bias current, Fan out capacity ,Tri-state leakage currents, AC parametric measurements such as Input / Output Propagation delay Rise time / Fall time to further enhance fault coverage. Pro-Rack is designed with VPC Mass Interconnect adapter with 16 bit fixture ID interface to the UUT through simple clips and probes or through card edge or through a bed of nail test fixture.
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Probe Card Analyzers
PB3600
The PB3600 provides the latest techniques in testing and maintaining probe cards. Designed through joint development with many of the world’s largest semiconductor and probe card manufacturers, ITC has produced an ergonomic analyzer with the greatest measurement resolution, highest throughput, most flexibility and still made it easy to use.
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Wafer Testing
Trio Vertical
SV TCL's TrioTM is a reliable solution for advanced wafer testing challenges, specifically full array and parallel probing. We offer a complete line of vertical probe card products, each designed for your unique application.
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Probe Card
VC20E Series
The 20mm VC20 is a highly adaptable probe card solution for a wide variety of tests including Modeling & Characterization, Wafer Level Reliability or Parametric Test. It can be easily combined with different interfaces to create modular probe cards supporting Keithley, Keysight or other custom tester platforms. Probes can be configured in either single or dual layer.
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Generic Probe Cards, PIB's, and Loadboards
Test Spectrum can provide generic Probe Cards, Probe Interface Boards (PIB), and loadboards. Choose from existing configurations already designed, or a generic test board for your specific tester configuration can be designed quickly.Teradyne J750 Probe Card and PIB; Teradyne Integra Flex PIB; Teradyne Ultra Flex PIB; Teradyne Catalyst PIB; Credence Quartet PIB (Probe Interface Board); Advantest 93K 1024 PIB
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Cantilever Probe Cards
Cantilever Probe Cards are based on the approved epoxy ring design. The probe-needles are precisely arranged the required pattern to ensure proper contact on the pads.
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Cryogenic Applications
Over the last 20 years the Celadon Engineering team has developed an expertise in cryogenic materials which has resulted in a solid reputation in the industry for producing extremely stable cryogenic on-wafer probe card as well as DUT probing solutions. These custom cryogenic probe card solutions are widely used to test Space, Military, Medical and Quantum Computing products. Celadon’s cryogenic solutions vary from standard VersaTile™ footprints which interface to positioners to innovative custom PCB based designs to allow for flexibility when testing at these very cold temperatures. Lakeshore cryogenic wire is used in standard DC solutions for high density cableout designs to support high pin count applications. During the development process, Celadon works closely with the cryogenic prober vendor to ensure the integrated solution is optimized for current and future testing needs.
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PROBE CARD
the electrical characteristics of the individual CHIPs in WAFER that have been completed through the FAB stage during the semiconductor fabrication process
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Complete Power Quality Analysis System
PK4564
PK4564 complete Power Quality Analysis System includes PS4550 Power Quality Analyzer with extended memory, AC charger, Quick-Start manual, deluxe voltage leads, four eFX6000 flexible current probes, SD memory card, CAS3 hard-shell carrying case, PSM-A Software, and 1-year deluxe warranty.
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Probe Card
T90™ Series
The 90 mm tile was designed for mounting on a standard 4.5″ probe card holder for multi-site wafer level reliability testing. The 1.6 mm (0.062″) thick rails allow the chassis to slip into planarity adjustable probe card holders for most analytical probe stations.
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Semiconductor Test
Smiths Interconnect’s test socket and probe card solutions utilize IDI contact technology to ensure superior quality and reliability in semiconductor test applications. Our best-in-class engineering, development and technical expertise ensure support of automated, system level and development test platforms.
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Probe Card
VC43™/VC43EAF™
VC43™/VC43EAF™ probe cards offer a larger format version of the popular VC20. In addition to saving time, another advantage of the modularity is the ability to leave the interface in place and simply install the VC43™ topside using Celadon’s twist and lock insertion tool which minimizes the possibility of triboelectric or interconnect issues that can occur during typical probe card changes. The VC43™ can be used for production parametric test, modeling, characterization, and wafer level reliability testing. Cards can be configured up to 104 probes in either single or dual layer with near vertical probes to minimize scrub lengths on pads allowing the VC43s to probe pads as small as 30 microns.
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Complete Power Analysis System
PK3564-PRO
PK3564-PRO complete Power Analysis System includes PS3550 Power Analyzer, AC charger, Quick-Start manual, deluxe voltage leads, four eFX6000 flexible current probes, SD memory card, CAS3 hard-shell carrying case, PSM-A Software, Mini Line-to-DC Converter, Bluetooth Adapter, USB Communications Cable, and 1-year deluxe warranty.
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Vertical Probe Cards
B3
The patent-pending B3™ structure requires a minimum number of parts and can handle up to 300 probes. This vertical technology can provide: • Increased Uptime • Extended Probe Lifetime • Reduced Maintenance • Lower Cost of TestThe B3™ is an ideal solution for testing small pads and the low force probes minimize scrub. Planarity also remains stable over time increasing probe card life. Contact your sales representative to learn more about our B3™ probe cards.
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Cantilever type Probe Card / C type
CE Series
Japan Electronic Materials Corp.
*Standard Cantilever Probe Card*Low Contact force*Stable Contact*High accuracy of alignment*Suitable for variety of Devices
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FCB Probe Card
The FCB Probe Card is the most mature technology of buckling beam probe card. It is aimed to achieve the semiconductor ship manufacture time-to-market (TTM) and cost of test (COT) demand. FCB is a proven solution for a variety of semiconductor production tests from early engineering pilot-runs to high volume manufacturing (HVM). FCB is ready for device requiring high signal integrity probing (SI) and/or power integrity probing (PI). Applications include cutting-edge SiPs/SoCs, WLP, graphic processors, micro processor, industrial microcontrollers, and more. FCB guarantees the world’s best overall cost-of-ownership (COO) for various DUT applications.
