Showing results: 1 - 15 of 30 items found.
-
ONFI -
Arasan Chip Systems, Inc.
Arasan is the leading supplier of mobile storage IP and its products are used by most first tier memory suppliers. Arasan's deep experience with NAND flash memory interfaces and mobile storage standards began in 2001 when it joined the SD Association and shipped industry first SD card IP in 2003. Arasan is a current member of ONFI and JEDEC.
-
NplusT -
Saniffer
NplusT was created in December 2002 by Tams Kerekes' 20-years experience in the field of electrical semiconductors and reliability testing.The company started with the sales representation of semiconductor equipment and consumable suppliers. In the meantime, qualified engineering services, linked to the represented products, were provided in Europe.In 2003 NplusT started to market "RIFLE", the non-volatile memory engineering tester, and related services. In a few years, this product has become a reference platform for many memory makers.In 2005 Liliom Laboratories, a Hungarian software development company, merged into NplusT. Thanks to this operation, the company became leader in the test data collection and processing segment.From 2008 a dominant portion of NplusTs turn-over derived from licensing software products. Today almost every European along with several Far East semicon companies license our software products and make use of qualified engineering services.From 2011, NplusT provides turn-key solutions for device testing and characterization, including hardware, software and support.
-
XMC-554C -
Curtiss-Wright Defense Solutions
The XMC-554C is a rugged, high performance, reliable and power-efficient NAND flash solid state drive (SSD) solution. The XMC-554C does not have any moving parts, providing significantly lower power consumption and an order of magnitude improvement in reliability in environments with vibration and contaminants, compared to traditional rotating hard disk drives (HDD).
-
Magnum VUx -
Teradyne, Inc.
Teradyne’s Magnum VUx system is a flexible, superset test platform for all NAND and MCP products, both cutting edge UFS 3.0, uMCP, and PCIe Gen 4 mobile and automotive devices, as well as SSD NAND ONFI and Toggle, and legacy NAND products such as UFS 2.1, PCIe Gen 3, e.MMC, and eMCP.
-
ONFI – NAND -
Arasan Chip Systems, Inc.
Continuous leadership in standards development and extensive customer adoption of previous versions ensures that Arasan has the knowledge and expertise to deliver compliant products with superior customer support. Extensive experience and compliance testing with all versions of ONFI specifications make the choice of Arasan ONFI NAND flash controller the lowest risk approach to implementation of ONFI enabled products. Arasan’s development engineering team provides direct support to customers ensuring that the highest level of knowledge is immediately available to the customer thus reducing problem resolution time.
-
BusFinder -
Acute Technology Inc.
*PC-based, 64 channels*USB 3.0 interface, 12V power adaptor*32Gb total memory*Protocol Analyzer：eMMC5.1, NAND Flash, SD3.0, SD 4.0 (UHS-II)*Logic Analyzer：eMMC5.1, NAND Flash, SD3.0, Serial Flash, SPI NAND, SPI*Each protocol has its own probe for easier connection, higher capture quality*Two sets of voltage detects to detects voltage changes
-
Ironwood Electronics
Open Nand Flash Interface (ONFi) specify a unique package & I/O configurations. This catalog covers the variations within the ONFi specifications.
-
T5831/T5831ES -
Advantest Corp.
High-productivity tester achieves low cost-of-test by performing massive parallel testing of NAND Flash and MCPs for SSDs and mobile applications
-
AATA Japan Co., LTD.
Package FunctionSMV(2.9mm*2.8mm) AND GateUSV(2.0mm*2.1mm) NAND GateFM8(5.0mm*4.5mm) NOR GateSM8(2.9mm*4.0mm) OR GateUS8(2.0mm*3.1mm) INVERTER
-
MS7208 -
MiNT Systems Corporation
The MS7208 system can test a wide range of device families including – but not limited to – NAND flash, NOR flash, multi-level flash, multi-die flash, EEPROM, RAM, and mixed-technology memory devices.
-
MVME8100 -
ELMA Electronic, Inc.
High performance 6U VME/VXS SBC with NXP QorIQ P5020 processor offers expanded IO and memory with PCIe and SRIO and multiple USB, Serial and Ethernet ports. Memory up to 8GB DDR3, 512KB FRAM non-volatile memory, 8GB eMMC NAND Flash.
-
T5833/T5833ES -
Advantest Corp.
T5833 system is a cost-efficient, high-volume test solution capable of performing both wafer sort and final test of DRAM and NAND flash memory devices. Amid surging sales of mobile electronics, DRAMs, NAND flash memories and multi-chip packages (MCPs) — the main device types used in smart phones and tablets — are quickly evolving toward higher speeds and greater device capacity. Internet and cloud servers also are driving demand for faster, higher-capacity ICs. Yet the cost of testing today's wide array of memory devices is an obstacle for chipmakers, which urgently require solutions that can deliver high functionality, high performance and low cost of test (COT). Advantest's new, multifunctional T5833 memory test system meets these needs, delivering both wafer sort and final test capabilities for a full range of memory devices, including LPDDR3-DRAMs, high-speed NAND flash memories and next-generation non-volatile memory ICs.
-
T5822 -
Advantest Corp.
Wafer-level testing of DRAMs, NAND devices and other non-volatile memories used throughout portable electronic devices. The T5822 is designed to provide manufacturers of multiple memory devices with cost efficiency and optimal functionality, including full test coverage of as many as 1,536 devices in parallel with data transfer rates up to 1.2 gigabits per second (Gbps).
-
Analog Devices Inc.
Analog Devices logic gate products offer logic functions such as AND, NAND, OR, and NOR, and include both –3.3 V and +3.3 V single supply options. Our products feature low power consumption, fast rise and fall times, differential and single-ended operation, and support high data rates up to 45 Gbps in an RoHS compliant package.
-
CS-620F -
HORIBA, Ltd.
In 3D NAND manufacturing process, dozens of layers of SiO2 and SiN are deposited, and the SiN layer is selectively removed using hot phos.In this process, the desired etching rate can be achieved by controlling the concentration and temperature of the chemical solution.Previous products have difficulty to measure high temperature chemicals, but the CS-620F is able to measure at high temperatures up to 170 C degrees.
