Failure
See Also: Destructive
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Product
Partial Load Failure
PLF Device
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The control device series “PLF” has been designed to monitor the partial and/ or total failure of the alternating current absorbed by loads driven by static switches and / or electromechanical relays.
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Product
Failure Analysis
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Failure analysis on electronic components is a continuous challenging task. The smaller transistor dimensions, increasing functional complexity and changing device packaging styles requires new tools and skills for sample preparation, fault localization techniques, high resolution imaging and analysis.
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Product
Failure Analysis – Materials
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Failure analysis – materials is the investigation into the background or history of a sample, or an event, to determine why a particular failure occurred. A product failure may include premature breakage, discoloration or even an unexpected odor. It is useful to know if this failure is a new, unique occurrence or if it has been an ongoing issue. The investigation can involve analyzing the sample as it currently exists and extrapolating from that data what may have caused the failure. A sample of the “good” vs. “bad” product may also be useful for comparison purposes.
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Product
Failure Analysis
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A partial list of our state of the art test equipment, applicable to these testing disciplines, will include the following: Two Scanning Electron Microscopes with EDS (SEM/EDS) Three Differential Scanning Calorimeters (DSC) Three Thermogravimetric Analyzers (TGA) Three Thermo Mechanical Analyzers (TMA) One Dynamic Mechanical Analyzer (DMA) Two Real-Time Fluoroscopic X-ray Systems, including a Microfocus System One Fourier Transform Infrared Microscope (FTIR) (capable of identifying a single particle of an unknown material) Two Ion Chromatographs (IC) (capable of identifying ionic impurities in ppm)
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Product
Failure and Technology Analysis
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Failure analyses in order to clarify the failure cause soonest possible.From single device to the whole system - and from highly complex IC up to printed circuit board (PCB), mounting & interconnection technology and printed board assembly (PBA).
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Product
Failure Analysis
MicroINSPECT 300FA
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The MicroINSPECT 300FA is an automated wafer inspection tool used for semiconductor wafer failure analysis. Its small footprint, high speed, and low cost relative to its rich features yield a superb cost of ownership and makes this an ideal tool for your fab or failure analysis lab. The MicroINSPECT 300FA combines advanced robotics, wafer sorting, an intelligent wafer inspection microscope together with SiteVIEW Software to produce an integrated failure analysis tool.
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Product
Failure Analysis
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Failure Analysis (FA) plays a crucial role in the production of semiconductors. It provides process and design feedback to determine the root cause of any failures. Time-to-data for the FA Engineer is a critical measurement and SemiProbe’s Probe System for Life ® (PS4L) is ideally suited to excel in this application. All key components are interchangeable, making it easy to switch between individual die, wafers, and packaged parts.
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Product
Destructive Physical Analysis & Failure Analysis
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DPACI's component analysis laboratory performs major analytical functions, such as destructive physical analysis, failure analysis, counterfeit analysis, and material analysis on components & devices. Our destructive physical analysis techniques are performed in accordance with standards and methods used in most military and space program requirements. Solutions for difficult production problems are resolved through our failure analysis procedures.
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Product
Battery Testing
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Weshine Electric Manufacturing Co., Ltd
The DC test method is adopted to simulate the actual use of the battery in a real and objective way, which can effectively eliminate the hidden dangers such as deficiency, deficiency and connection failure between batteries while measuring the internal resistance of the battery.
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Product
Voltage Protection ICs
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ST’s voltage protection devices prevent external overvoltage (or undervoltage) peaks from damaging circuitry. They are commonly implemented on the power charging patch of portable devices to prevent USB or AC charger power failure. ST’s devices offer the advantage of very precise voltage thresholds, so that the protection is activated accurately, and without fail.
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Product
PXIe-1066DC, 18-Slot, DC Power Supply PXI Chassis
781812-01
Chassis
PXIe, 18-Slot, DC Power Supply PXI Chassis—The PXIe‑1066DC adds high-availability features to the PXI Express platform to maximize system uptime. Built on the PXIe‑1065 backplane architecture, the PXIe‑1066DC incorporates hot-swappable, redundant DC power supplies as well as hot-swappable, front-accessible, redundant cooling fans. These high-availability features improve the mean time between failure (MTBF) and mean time to repair (MTTR) of the PXI system.
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Product
Copper TAPs
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Profitap Copper TAPs provide complete access and visibility into your network by creating an exact copy of full-duplex 10M/100M/1G/10G traffic at wire speed with no impact to the network link. Profitap Copper TAPs introduce no point of failure to the network. They are designed for redundant powering, which allows a second power supply to activate if the first were to become unavailable. In case of complete power loss, Profitap Copper TAPs guarantee that the link remains operational by instantly switching to a fully passive mode.
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Product
Test System
ETS788XL
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The 50/100 MHz ETS788XL system is the compact protable version of our ETS788. Made with the new high-performance precision components of our Griffin series, this portable powerhouse offers an optional tough road case and ready to go to any test site needed. Just pop off the covers and get started. Whether it's research, Failure Analysis, or single-event effects testing, his powerful member of the HiLevel family takes advantage of all of the tried and true features that have served users so successfully to date.
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Product
Internal Vapor Analyzer
IVA® MODEL 210S
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The IVA® system is specifically designed for the quantitative analysis of low molecular weight gases contained in hermetic packages, cavities and other enclosures. The Model 210s concept integrates automated hardware with easy-to-use icon-driven software. Its design permits routine quality control, failure analysis and research level testing operation as a turn-key analytical system.
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Product
Microelectronics Test & Engineering Services
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EAG's Microelectronics Test and Engineering lab network provides semiconductor and electronics design firms worldwide with test, debug, and early engineering support to help you with new product introduction. We actively service a broad range of semiconductor and electronics companies worldwide. Services include ATE testing, Reliability testing and qualification, ESD testing, Failure Analysis, FIB Circuit Edit and Debug. for both ICs and systems
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Product
Network Surveillance System
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The network backbone contains a wealth of information that can be monitored and collected to support diagnostic, troubleshooting, and fraud prevention activities. Surveillance of network characteristics is becoming more important than ever before. Few important aspects of network surveillance include, Performance Monitoring, Security, Fraud Prevention, Physical Layer monitoring, Billing Verification, Remote Protocol Analysis, Failure Prediction, Traffic Engineering, Call Quality Monitoring and Troubleshooting.
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Product
Spectro Modular
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Spectro predicts the remaining useful life of a battery with capacity measurement. A "pass" gives a grace period; "fail" requests replacement" why do starter batteries commonly fail? Capacity fade is the most common cause of failure that often goes unnoticed.
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Product
Power Forensics
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Use EA Technology Power Forensics to investigate power asset aging, failure, incidents and fires; our expertise, experience, techniques and facilities can help you find out why your assets have failed, how they have failed and what you can do to prevent future failures. We can also investigate and assess apparently healthy, suspect or degrading equipment before it fails.
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Product
Falling Dart Impact Tester
FDI-01
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Jinan Leading Instruments Co., Ltd.
FDI-01 Falling Dart Impact Testeris applicable in the impact result and energy measurement of the falling dartfrom a certain height against plastic films and sheets with a thickness less than1mm, whichwould result in 50% tested specimen failure.
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Product
Electron Microscope Sample Preparation
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Excellent sample preparation is the prerequisite for first-class electron microscopy. Be prepared – for great results in EM Sample Preparation! Perfect preparation makes the difference between trying and achieving, between failure and success, between results and excellent results. So be prepared for great results with Leica Microsystems!
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Product
Thermal Shock Test Chamber
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observe the product characteristics and failure occurrences caused by different materials and their thermal expansion coefficients, thermal shock testing is subjected to the product. In thermal shock testing alternating high and low temperatures are fed in the chamber. WEIBER designs and manufactures customised THERMAL SHOCK CHAMBERS with separately controlled temperature zones (2 zone and 3 zone), liquid to liquid (2 zone) depending on configuration of the chamber chosen.
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Product
Dual Fiber Transceivers
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The benefits and overall savings on a single strand (simplex) versusdual strand (duplex) fiber implementation can be considerable.Considerations include not only the cost of fiber optic cabling itself,but also the labor and material involved in terminating the endpoints,simplex versus duplex patch cords, cross-connect rack space, reducedpoints of failure, and other direct and indirect costs. This technologycan also defer the need to install new fiber to support unexpectedgrowth requirements.
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Product
Pinhole & Porosity
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Premature corrosion of a substrate is usually due to a coating failure. A major cause is the presence of flaws in the finished coating. Collectively referred to as porosity, the main types of flaws are:
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Product
Moisture Measurement
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Moisture: The presence of moisture within a material will result in poor adhesion, premature coating failure and poor appearance. For example, applying a powder coating to a damp wooden panel will cause steam to be created when the panel passes through the curing oven, thus causing damage to the coating. It is not sufficient to simply ensure that the surface is dry by touch. The surface of the substrate is often the driest point due to evaporation. It is important to establish the moisture content within the substrate itself. The moisture measurement can either be taken using a Pin moisture meter or Pinless (Contact-Type) moisture meter.
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Product
Rock Mechanics Testing Equipment
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Rock mechanics is the part of geotechnical engineering that studies the behaviour of rocks under variable physical and environmental conditions. Testing is undertaken to enable the prevention of geotechnical failure such as shearing, by measuring the behaviour of rocks for compliance with regulations, design specifications and quality control standards.
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Product
Timing Signal Generator
OSA 5548C TSG
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Our OSA 5548C Timing Signal Generator (TSG) is a scalable synchronization solution ranging anywhere from 20 unprotected outputs up to a thousand protected outputs by adding up to four expansion shelves to the core unit. Its ultra-compact footprint makes it ideal for telecom operators to provide scalable network synchronization in over-crowded exchanges. The OSA 5548C TSG’s distributed intelligence message passing system eliminates single points of failure and guarantees reliable uptime. Core unit and expansion shelves share the same modules, minimizing overall administrative complexity and enabling reduced homologation activity.
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Product
In-Circuit Tester
Omega MTS888
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With the continuous and fast pace of development in the electronic manufacturing the time from design to production is a critical factor for success or failure of a product. The time from design to test is a major part of this process. The high performance tester from Digitaltest, the MTS888 Omega, has been designed to speed up this process.
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Product
Copper Test Solution
DSX CableAnalyzer™ Series
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The DSX CableAnalyzer Series copper test solution enables testing and certification of twisted pair cabling for up to 40 Gigabit Ethernet deployments and will handle any cabling system whether it is a Cat 5e, 6, 6A, 8 or Class FA and I/II. Certifying a cable is one part of a process that starts with system design and ends with system acceptance. The faster that process goes, the more profitable you'll be. Unfortunately, there are a lot of things that slow the process down setting up the tester incorrectly, testing to the wrong limits, waiting for skilled technicians to analyze and troubleshoot failures, misinterpretation of results, and producing test reports that customers cannot understand.
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Product
Combustible Gas Leak Detector
Model - KM 5540EX
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Kusam Electrical Industries Limited
• CNEX Ex ib IIB T4 GB approved.• High Quality Japanese sensor.• Anti-explosion 3.7V 1500mAH Li-ion battery equipped.• Instant sensor failure indication.• Easily check the status of alarm devices (buzzer, LEDs).• Built-in temperature compensation to provide excellent environment independency.• Audible ticker signal & visual leak size indicator.• Adjustable sensitivity, fast warm-up, low battery indicator.
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Product
BOD Meter
LD-LBOD-A10
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BOD MeterLD-LBOD-A10is a benchtop unit designed to automatically measure B.O.D. (biological oxygen demand) with 0 to 4000 mg/ L measurement range. Simple and safe mercury pressure difference measurement method is applied to prevent poisoning caused by the leakage of the mercury column. Equipped with high end brand mini thermal printer, quickly prints measurement process data, result data. Automatically saves test data on power failure and executes experimental process once power supply is on.
