Failure
See Also: Destructive
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Failure Analysis
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Failure Analysis (FA) plays a crucial role in the production of semiconductors. It provides process and design feedback to determine the root cause of any failures. Time-to-data for the FA Engineer is a critical measurement and SemiProbe’s Probe System for Life ® (PS4L) is ideally suited to excel in this application. All key components are interchangeable, making it easy to switch between individual die, wafers, and packaged parts.
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Failure Analysis Services
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Innovative Circuits Engineering, inc
Innovative circuits engineerin's failure analysis group performs root cause analysis on a wide variety of integrated circuit devices.
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Root Cause Failure Analysis
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Maintenance Reliability Group, LLC
Root Cause Analysis of Grease Lubricated Components: Root cause analysis includes a complete root-cause failure report and recommendations for further monitoring and corrective actions. MRG will test for grease consistency, oxidation, product contamination and wear metals utilizing Grease Thief® Analyzer die extrusion test, FTIR, RULER and RDE Spectroscopy. Testing includes Analytical Ferrography and Rheometer testing. Testing can include the submission of a failed component for extraction of grease from failed component and visual inspection for Root Cause Analysis.Root Cause Analysis of Grease Lubricated Components: Root cause analysis includes a complete root-cause failure report and recommendations for further monitoring and corrective actions. MRG will test for grease consistency, oxidation, product contamination and wear metals utilizing Grease Thief® Analyzer die extrusion test, FTIR, RULER and RDE Spectroscopy. Testing includes Analytical Ferrography and Rheometer testing. Testing can include the submission of a failed component for extraction of grease from failed component and visual inspection for Root Cause Analysis.
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Destructive Physical Analysis & Failure Analysis
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DPACI's component analysis laboratory performs major analytical functions, such as destructive physical analysis, failure analysis, counterfeit analysis, and material analysis on components & devices. Our destructive physical analysis techniques are performed in accordance with standards and methods used in most military and space program requirements. Solutions for difficult production problems are resolved through our failure analysis procedures.
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Failure Analysis
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Failure analysis on electronic components is a continuous challenging task. The smaller transistor dimensions, increasing functional complexity and changing device packaging styles requires new tools and skills for sample preparation, fault localization techniques, high resolution imaging and analysis.
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Failure Analysis – Materials
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Failure analysis – materials is the investigation into the background or history of a sample, or an event, to determine why a particular failure occurred. A product failure may include premature breakage, discoloration or even an unexpected odor. It is useful to know if this failure is a new, unique occurrence or if it has been an ongoing issue. The investigation can involve analyzing the sample as it currently exists and extrapolating from that data what may have caused the failure. A sample of the “good” vs. “bad” product may also be useful for comparison purposes.
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Failure and Technology Analysis
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Failure analyses in order to clarify the failure cause soonest possible.From single device to the whole system - and from highly complex IC up to printed circuit board (PCB), mounting & interconnection technology and printed board assembly (PBA).
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Failure Analysis
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A partial list of our state of the art test equipment, applicable to these testing disciplines, will include the following: Two Scanning Electron Microscopes with EDS (SEM/EDS) Three Differential Scanning Calorimeters (DSC) Three Thermogravimetric Analyzers (TGA) Three Thermo Mechanical Analyzers (TMA) One Dynamic Mechanical Analyzer (DMA) Two Real-Time Fluoroscopic X-ray Systems, including a Microfocus System One Fourier Transform Infrared Microscope (FTIR) (capable of identifying a single particle of an unknown material) Two Ion Chromatographs (IC) (capable of identifying ionic impurities in ppm)
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Benchmark, Competitive and Failure Analysis
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Helping you determine the root cause of product failures and evaluate products against industry competition and standards.We provide third-party verification and support for claims related to performance versus competition, root product failure cause, and benchmark industry performance. As an independent laboratory with over 60 years of product testing experience, our expertise helps you evaluate products for a variety of performance related characteristics. Additionally, we can provide expert witness legal testimony for insurance claims, CPSC filings, and civil/criminal court cases through our testing results and data.
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Failure Analyziz and Quality Assurance
NX20
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There's no room for error in the data provided by your instruments. Park NX20, with its reputation as the world's most accurate large sample AFM, is rated so highly in the semiconductor and hard disk industry for its data accuracy.
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Equipment Failure Diagnosis System and Safety Management System
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A system for diagnosing failures of rotating machinery such as turbines, motors, pumps, fans, and compressors, which are major facilities in nuclear power, hydropower, thermal power plants, petrochemical plants, shipbuilding, and aviation, through displacement sensors.
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Super MUTT Deluxe Standard Edition
#9008-SE
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Innovative Products of America
The Super MUTT places a load on the trailer's electrical circuits to identify wiring problems while providing remote control operation over both air brakes and lights. Built to facilitate a one-man testing operation, the Super MUTT reduces guesswork and inspection time to prevent failures that lead to expensive road calls and citations. The remote control allows for repetitive air brake actuation at each axle to reveal developing problems often missed by normal testing procedures.
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PXI System Monitoring Module
Monitoring Module
The PXI System Monitoring Module can be used with a PXI Chassis to detect and report chassis voltage rail problems, abnormal chassis intake temperature, or a chassis power shuttle fan failure. The PXI System Monitoring Module also includes a relay that can toggle when any of the parameters fall outside the chassis operating specification.
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System Modeling for Diagnostic Design and Analysis
EXpress
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eXpress is a comprehensive model-based diagnostics engineering software application providing an environment for the design, capture, integration, evaluation and optimization of complex or large-scale system diagnostics, prognostics health management (PHM), systems testability engineering, failure mode and effects analysis and system safety analysis. eXpress is uniquely suited to influence the diagnostic development for new designs or to exploit the diagnostic challenges of existing legacy systems. Its robust structure facilitates the capture of extensive interdisciplinary design knowledge providing an unmatched ability to corroborate, reuse and re-purpose expert knowledge in performing standardised testability, reliability and maintainability analyses.
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Battery Monitoring System
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JUNXY Battery Monitoring Systems are designed in accordance with IEEE Battery Maintenance recommendations. This allows you to maintain a safe and secure system with Real-time monitoring, which will minimize the probability of a failure and optimize the service life of the battery. JUNXY Battery Monitoring Systems not only monitor the batteries, but also the external parameters which could affect the performance of the system, providing added security. It is a powerful tool for mitigating and preventing costly downtime due to unexpected system failure.
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Inspection Microscope
Z-NIR
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The McBain Z-NIR Near Infrared Inspection System is best-in-class for wafer-to-wafer and die-to-die alignment measurement and verification. This unique tool has been sold into many industries with various applications including sub-surface wafer and die inspection for cracks and bond integrity, MEMS, wafer bonding, 3-D chip stacking, failure analysis, process development, tool verification, part characterization, environmental testing and more.
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Acoustic Microscope
AMI D9650Z
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The D9650Z incorporates the latest C-SAM technology with enhanced features to accommodate the testing of Power Modules as well as performing standard C-SAM operations. This new system configuration is optimized for inspection of heatsink bond integrity, thickness of bond layer and wire bond welds. Powered by our Sonolytics software platform with PolyGate technology, the D9650Z is ideal for failure analysis, process development and QC screening in low-volume production environments.
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Transmitter Control Subsystem (TCS)
Loran C Accufix 7500
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USCG Loran Transmitter Control and Display stations modernized and upgraded to state-of-the-art processor controlled technology. Fully redundant system with comprehensive built-in performance monitoring. Automatic switchover upon detection of error, high single point failure tolerance. Long distance communications link supports remote station operation on a continuous basis. Built-in fault detection and monitoring enables dynamic re-allocation of failed subsystem modules, and fault isolation to major replacement assemblies.
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BF-Series Soft Stop Plus Models
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The E-DRIV® BF-Series soft stop plus models is designed with an unique "soft-stop" shock absorbing clutch that is ideal for fastening shock sensitive components such as disk drives, plastics, and electronics. The ergonomically designed soft stop clutch reduces impact and vibration transmitted in the screw fastening process, which delivers less torque reaction to operator. The electric screwdriver offers a Double Hit Mode for soft joint applications and a selectable Soft Start mode. Designed for precision torque control the brushless motor design ensures durability and reduces the standard maintenance costs associated with brush type electric screwdrivers. The NF power tool is ESD certified, ensuring less than 1 Ohm at the bit tip. ESD management assures product quality, cost savings and a reduction in overall ESD failures.
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Open Frame Industrial Touch Monitor
OM Series
Industrial Monitor
We team up with AUO® to ensure delivering the products with solid-build quality, which is protected with 7H hardness and an IP65 front panel. Our monitors can easily withstand the hazards of harsh environments, such as water, dust ingress, scratches, abrasions, and metallic dust. On average, these monitors have a mean time before failure (MTBF) of up to 50,000 hours, minimizing maintenance costs.
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Verification And Diagnostic Tools
Y1131A
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Provides module-specific tests to troubleshoot relay failures and predict maintenance requirements.
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Optical Fiber Cable Testing Equipment
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Optical fiber consists of a core and a cladding layer, selected for total internal reflection due to the difference in the refractive index between the two. In practical fibers, the cladding is usually coated with a layer of acrylate polymer or polyimide. This coating protects the fiber from damage but does not contribute to its optical waveguide properties. Individual coated fibers then have a tough resin buffer layer and/or core tube(s) extruded around them to form the cable core. Several layers of protective sheathing, depending on the application, are added to form the cable. Rigid fiber assemblies sometimes put light-absorbing ("dark") glass between the fibers, to prevent light that leaks out of one fiber from entering another. This reduces cross-talk between the fibers, or reduces flare in fiber bundle imaging applications Optical fibers are very strong, but the strength is drastically reduced by unavoidable microscopic surface flaws inherent in the manufacturing process. The initial fiber strength, as well as its change with time, must be considered relative to the stress imposed on the fiber during handling, cabling, and installation for a given set of environmental conditions. There are three basic scenarios that can lead to strength degradation and failure by inducing flaw growth: dynamic fatigue, static fatigues, and zero-stress aging.
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Insulating Oil Testing
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Insulating materials are the elixir of life of electrical equipment. These materials lose their insulating and cooling properties due to impuri ties and ageing. This damages equipment, causes failures and is consequently often accompanied by high costs. Precise and reliable measurement results.
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Combustible Gas Leak Detector
Model - KM 5540EX
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Kusam Electrical Industries Limited
• CNEX Ex ib IIB T4 GB approved.• High Quality Japanese sensor.• Anti-explosion 3.7V 1500mAH Li-ion battery equipped.• Instant sensor failure indication.• Easily check the status of alarm devices (buzzer, LEDs).• Built-in temperature compensation to provide excellent environment independency.• Audible ticker signal & visual leak size indicator.• Adjustable sensitivity, fast warm-up, low battery indicator.
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Continuous Emission Monitoring Systems
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TML has more than 50 years' experience designing, manufacturing, and supporting continuous emission monitoring systems (CEMS). We have a team of experienced CEMS air quality experts that will thoroughly review your process and operating permit and recommend the most cost effective and reliable solution for monitoring the gases of interest. TML's continuous emission monitoring systems are based on rugged, reliable equipment manufactured to exact standards. The result is products and systems with some of the highest mean time between failure rates in the industry. Whether it's a standard or custom solution, we stand behind our products 110%, guarantee CEMS certification, at least 95% uptime, replacement parts, and 24 x 7 support. We offer a total CEMS solution including data acquisition software for recordkeeping and reporting, lower cost of ownership, superior product reliability and designed for simple and easy maintenance.
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Adhesion Testers
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From the largest man-made structures to the smallest household appliances, most manufactured products have a protective or cosmetic coating. Premature failure of this coating can, at the very least, result in additional costs of rework. Adhesion testing after the coating process will quantify the strength of the bond between substrate and coating, or between different coating layers or the cohesive strength of some substrates. Routine adhesion tests are used as part of inspection and maintenance procedures to help detect potential coating failures.
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Circuit Breaker Endurance Test System
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Endurance testing involves operating – closing and opening – the circuit breaker repeatedly for a set number of cycles. This test is necessary to stabilize the circuit breaker mechanism and to identify “Early Infant Mortality” failures in the switchgear assembly.
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Reliability Testing
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ELES Semiconductor Equipment SpA
ELES designs and manufacturers reliability test solutions to verify the performance of integrated circuits from concept validation to high volume production during all the test phases. No other company can provide universal equipment for all the reliability tests, or can guarantee a seamless data flow between phases or can apply on chip embedded reliability engineering for data tracking and failure investigation. Clients use our functional test data to proactively analyse variations between lots, between temperature extremes and during lifetime (often these defects escape ATE). The improvements to products and processes needed to arrive at zero defects cannot be driven by the quantity of Big Data alone, the quality of reliability data is a strategic advantage that only ELES can provide.
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Fixturing
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Terotest specialises in providing test solutions specific to customers' test applications. We understand that the interfacing and fixturing of a particular test setup can determine whether the application is a success or a failure, and therefore we strive to deliver solutions that are cost effective and suitable to user requirements.
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SMARTsensing Suite
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Unlock the power of predictive maintenance with with the SMARTsensing hardware suite. Our rugged, scalable solutions provide the insights you need to detect failures before they happen.
