SoC
A complete computer "System on a Chip".
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Product
SoC Tester
UltraFLEXplus
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The UltraFLEXplus combines new instrument and software capability with a revolutionary tester infrastructure that provides a step-function improvement in throughput and engineering efficiency – all while leveraging the cumulative test IP developed over the UltraFLEX’s 15 year history .
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Product
SoC Verification
TrekSoC
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TrekSoC automatically generates self-verifying C test cases to run on the embedded processors in SoCs. This verifies your chips more quickly and more thoroughly than an external testbench, hand-written C tests, or running only production code on the processors. TrekSoC's generated test cases target all aspects of full-SoC verification and work in a variety of different environments.
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Product
SoC Integration At RTL
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Before logic synthesis, STAR enables full implementation capabilities towards IP and connectivity insertion with a real-time monitoring of the integration progress. This enables SoC creation in minutes and maximize design reuse from existing projects.
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Product
Qseven Module with 4th Generation Intel Atom® Processor E3800 Series SoC (formerly codename: BayTrail)
Q7-BT
Computer on Module
The Q7-BT Computer-On-Module (COM) combines the Qseven® 2.0 standard with the Intel® Atom™ E3800 series System-on-Chip (SoC), providing an ideal solution for mid-range power and high, pin/area density requirements. The module provides the high integration, high performance, low power, and ruggedness favored by Internet-of-Things (IoT) applications such as retail transactional clients, digital signage, and in-vehicle infotainment systems.
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Product
COM-HPC Server Type Size E Reference Development Platform based on Ampere® Altra® SoC
Ampere Altra Developer Platform
Software Development Kit
Backed by a broad Arm® ecosystem with an Ampere® Altra® SoC at its core, using the Arm® Neoverse™ N1 platform, the Ampere Altra Developer Platform provides premium performance from a cloud-to-edge infrastructure, keeps an extremely low thermal envelope, lower TCO, and significantly lower power consumption than x86 designs. It supports the open source EDKII as bootloader with UEFI, so customers can just download a stock AArch64 (arm64) ISO such as Ubuntu and install it through booting a live ISO directly on the target. The same convenience we have become used to by using x86 / amd64 target systems.
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Product
SMARC Short Size Module With Qualcomm® QRB5165 Series Octa-Core SoC
LEC-RB5N
Computer on Module
- Qualcomm® Kryo™ 585 CPU (8x Arm Cortex-A77 cores)- Qualcomm® Hexagon™ Tensor Accelerator (HTA) running up to 15 TOPS- 4K HDMI/MIPI DSI display, MIPI CSI cameras- 2x PCIe x2 Gen3- 2x GbE Ethernet- 2x USB 3.1/2.0 and 4x USB 2.0- GPIO/SD and UFS- 5VDC +/-5% voltage input
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Product
SMARC Short Size Module with Qualcomm® QRB5165 Series octa-core SoC
LEC-RB5
Computer on Module
The ADLINK LEC-RB5 is a SMARC module powered by the Qualcomm® QRB5165 SoC with 8 Arm Cortex-A77 cores and up to 15 TOPS Qualcomm® Hexagon™ Tensor Accelerator. The module is designed for robotics and drone applications and integrates several IoT technologies in a single solution. The LEC-RB5 SMARC module provides on-device artificial intelligence (AI) capabilities, support for up to 6 cameras, and low power consumption. It is capable of powering robots and drones in consumer, enterprise, defense, industrial and logistics sectors.
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Product
COM Express Compact Size Type 6 Module Intel Atom® E3900 series, Pentium®, and Celeron® SoC (formerly Apollo Lake)
cExpress-AL
Computer on Module
The cExpress-AL is a COM Express® COM.0 R3.0 Type 6 module supporting the Intel Atom® processor, Intel® Pentium® processor and Intel® Celeron® processor system-on-chip (SoC). The cExpress-AL is specifically designed for customers who need optimized processing and graphics performance with low power consumption in a long product life solution.
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Product
Qseven V1.2 SoM With I.MX287 454 MHz (Industrial) SoC, 128MB Memory, 4GB EMMC, Gigabit Ethernet, Audio And CAN
Q7M100
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*Ultra low power consumption ARM9*High flexibility Qseven v1.2 compliant design*2 CANBus 2.0B compliant ports*24-bit TTL LCD*Dual 10/100 Base-T Ethernet*Audio
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Product
COM Express Compact Size Type 6 Module with Next Generation Intel Atom® Processor SoC
cExpress-EL
Computer on Module
ADLINK cExpress-EL supports next generation Intel Atom x6000 processors (Elkhart Lake) combined with Intel UHD graphics at low power envelope and high speed interfaces. cExpress-EL modules support In-Band ECC dual channel DDR4 memory up to 32GB, and are also available in rugged operating temperature range and low power envelope, making them a perfect match for mission critical fanless edge computing applications that require safety and reliability at all times.
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Product
Fanless Embedded System With Intel® Celeron® 2980U/ Core™ I5-4300U/i3-5010U ULT SoC, HDMI/DisplayPort, 2 GbE LANs, 4 USB 3.0, 2 COM And PCIe Mini Card
eBOX560-880-FL
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The eBOX560-880-FL, a palm-sized, fanless embedded computing system utilizes high performance Intel® Haswell ULT multi-core SoC. The ultra-compact, ultra-lightweight eBOX560-880-FL adopts an IP40-rated rugged aluminum cold-rolled steel enclosure to withstand vibration of up to 3 Grms (with SSD) and has a unique thermal solution to support the temperature range from -20°C to +50°C (-4°F to +122°F). Supporting 4K2K resolution via HDMI interface, the outstanding embedded box computer is ideal for passenger information system, Kiosk, entry-level gaming, video surveillance, and other automation & embedded applications.
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Product
Intel® Atom™ SoC E3825/ J1900 Pico-ITX SBC, DDR3L, 24-Bit LVDS, VGA Or HDMI, 1 GbE, Half-Size Mini PCIe, 4 USB, 2 COM, SMBus, MSATA & MIOe
MIO-2263
Single Board Computer
Embedded Intel® Atom™ SoC E3825 & Celeron J1900 up to Quad-Core processor design, DDR3L 1333MHz support up to 8GBIntel Gen 7 DirectX®11.1 support, dual independent display by 24-bit LVDS + VGA or 24-bit LVDS + HDMIFlexible design using integrated multiple I/O: MIOe to approach vertical applications & keep domain knowhowRich I/O interface with 2 COM, 1 SATA, USB3.0, PCIe Mini Card and mSATASupports iManager, SUSI APIs, WISE-DeviceOn and Edge AI Suite
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Product
Mini-ITX SBC With Intel® Celeron® Processor N3160 (up To 2.24 GHz) SoC, VGA/HDMI/LVDS, USB 3.0, Mini PCIe Card, MSATA And HD Audio
MANO300
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The MANO300 mini-ITX motherboard built with the latest Intel® Celeron® processor N3150 (codename: Braswell) with integrated Intel® Gen 8 graphics supporting up to 4K resolution. Two SO-DIMM sockets are provided to support up to 8GB of DDR3L-1600 memory. The 12V single voltage DC power jack or ATX power makes the power input selection more flexible for different automation and embedded industries. Its friendly fanless cooling system design and compact form factor aimed at space-limited applications as well as harsh environments.
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Product
Intel® Celeron N3160/N3060 SoC, Intel® Atom E8000 SoC, 3.5" SBC, DDR3L, VGA, HDMI, 48-Bit LVDS, 2GbE, Mini PCIe, MSATA, SUSI API
PCM-9310
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Intel® Celeron QC/DC SoC, Intel® Atom QC, DDR3L-1600MHz SODIMM up to 8GBDirectX11.1, OpenGL4.2, OpenCL1.2, 3 independent display: VGA + HDMI + LVDS/eDP*Rich I/O: 4 x COM, 2 x SATA, 2 x USB3.0, 4 x USB2.0, TPM2.0, SMBus/I2C, GPIO, full-size Mini PCIe w/ SIM holder, full-size mSATASupports iManager, SUSI APIs, WISE-DeviceOn and Edge AI Suite
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Product
PCIe/104 OneBank Carrier for Trenz SoC Modules
EMC²-DP
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Sundance Multiprocessor Technology Ltd.
The EMC²-DP is a PCIe/104 OneBank™ Carrier for a Trenz compatible SoC Module and has expansion for a VITA57.1 FMC™ LPC I/O board and also has I/O pins, using a 100-way Samtec RazorBeam connectors system. The add-on board, called “Sundance External Interface Connector – SEIC” contains LEDs, RS232, USB2.0, HDMI, 1Gb Ethernet and SATA . The “SEIC” can be customize for individual applications and bespoke connectors.
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Product
JAMMA (J-Series)
DPX-J100
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High performance AMD Embedded V & R SOC APUs. Quad and dual core APUs up to 2.6 (3.5) GHz, 25W. Radeon™ VEGA GPU with up to 8 compute units. Up to three independent monitors supported.
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Product
STANAG3910/EFEX Modules
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AIM’s STANAG3910/EFEX test, simulation, monitoring and analysis modules use our field proven Common Core hardware design giving you the best performance, best feature set and highest functional integration on the market. The use of SoC (System on Chip) based core designs with multiple processors for real time bus protocol and application support, massive memory and IRIG-B time code encoder/decoder functions are standard. The latest versions also support avionics discrete I/O. Configurations with dual redundant concurrent HS/LS Bus Controller (BC), Multiple Remote Terminals, and Chronological/Mailbox Bus Monitor operation with full HS/LS protocol error injection/detection, multi-level triggering, advanced capture/filtering and real time bus recording, time stamping and physical bus replay ensure your bus integrity. Support for EFAbus Direct Digital Links (DDL), Fibre Optic DDL (FODDL) and EFAbus Express extensions (Mixed Mode and Dual Mode operation) are available. To support the French ‘Rafale’ aircraft, modules are available with an Electrical Front End. Single Function variants support cost effective solutions. Each module is delivered with a Board Support Package (BSP) containing the onboard driver software, a full Application Programming Interface (API) and detailed getting started and programming guides. Powerful PBA.pro databus test and analysis software is optionally available for all our STANAG3910 modules.
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Product
Bluetooth PCIe Combo Module
SX-PCEAX
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The Silex’s SX-PCEAX is one of the industry’s first Tri-band Wi-Fi 6E modules. This Wi-Fi 6E module extends the benefits that Wi-Fi 6 already provides in the 2.4 and 5 GHz bands to 6 GHz and helps increase overall capacity and performance. SX-PCEAX is a tri-band IEEE 802.11 abgn/ac/ax WLAN module plus Bluetooth 5.2 BR/EDR/LE combo module based on Qualcomm’s QCA2066 SoC.
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Product
PC/104 OneBank Carrier
EMC²-SoM
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Sundance Multiprocessor Technology Ltd.
The EMC²-SoM is a PCIe/104 OneBank™ Carrier for a Trenz compatible FPGA and SoC Module and has expansion for a VITA57.1 FMC™ LPC I/O board. It also has I/O pins, using a 100-way Samtec RazorBeam connectors system, the “Sundance Expansion Interface Connector” (SEIC) can be customize for individual applications and bespoke connectors.
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Product
SMARC V2.0 SoM With I.MX8M Quad/Dual 1.5 GHz/1.3 GHz (Industrial) SoC, 4GB RAM, 64GB EMMC, CAN, MIPI CSI/DSI And HDMI 2.0
SCM180
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The SCM180 is a SMARC v2.0 system on module with a choice of quad- or dual-core Arm® Cortex®-A53 processors. The ultra low power, high performance, RISC-based module measures only 82 x 50 mm and utilizes the powerful i.MX 8M processor. Its scalability, optimized pinout schematic and low profile design offers high level of versatility to help system integrators drive their important projects forward. The SCM180 is unique among other SMARC modules of its kind because it features Trusted Platform Module (TPM) for optimum security. With a discrete, dedicated microcontroller designed to support hardware encryption and decryption, the SCM180 delivers enhanced security for an added layer of protection. It also offers a choice of operating temperature ranges and can operate reliably in harsh environments. The SCM180 is suitable for a wide range of smart, portable/mobile-integrated IoT applications including robotics, automotive, factory automation, smart agriculture, casino gaming, medical, retail, surveillance and more. With its NXP artificial intelligence core technologies-enabled capabilities, the SMARC module can be programmed to support smart automation and machine-learning application requirements.
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Product
Edge AI Inference System
AIR-101
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Edge AI Inference System powered by Intel Atom® E3940 QC SoC and two Intel MA2485 VPUs. Intel Atom E3940 Quad Core SoC turbo burst up to 1.8 GHz. Intel® Movidius™ Myriad™ X VPU MA2485 x 2 Built-in.
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Product
Custom & ASSP
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Offering innovative SoC, SiP, ASIC, audio/video ASSP and other custom solutions and foundry services across a wide variety of applications in the automotive, industrial, medical, and aerospace & defense markets.
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Product
Lithium battery 128kWh Lifepo4 Battery pack 280Ah with BMS for Solar Energy Storage System
SPVLI-128kWh
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Zhejiang Sandi Electric Co., Ltd
ESS lithium battery system is composed of lithium battery modules, BMS system, PV charge controller, AC/DC Charger, central control unit CCU, temperature detector, integrated structure and other parts; the solar panels in the system are battery storage and power for output; BMS module completes the detection and control of voltage, current, temperature, SOC, SOH and charging and discharging related parameters of power battery pack; PV controller and inverter realize bidirectional AC/DC function to meet the charging and discharging conversion demand of power battery pack; each detector is used to monitor the ambient temperature in real time to ensure the safety of the system.
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Product
COM Express Mini Size Type 10 Module with Intel Atom® E3800 Series SoC or Celeron Processors (formerly Bay Trail)
nanoX-BT
Computer on Module
The nanoX-BT is a COM Express COM.0 R2.1 Type 10 module supporting Intel Atom® processor E3800 Series and Intel® Celeron® N2930/J1900 processor SoC (codename: Bay Trail).
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Product
Intel® Xeon™ SoC, PCIe Gen3 And 10GbE (XAUI), 6U VPX
VPX752
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The VPX752 is a processor module (VITA 46) for general purpose processing in demanding applications. Based on the Intel 5th generation Xeon-D processor, the efficient SoC design has low power consumption and integrated PCH technology.
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Product
Hybrid Verification Platform
HES-DVM
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HES-DVM™ is a fully automated and scalable hybrid verification environment for SoC and ASIC designs. Utilizing the latest co-emulation standards like SCE-MI or TLM and newest FPGA technology, hardware and software design teams obtain early access to the hardware prototype of the design. Working concurrently with one another they develop and verify high-level code with RTL accuracy and speed-effective SoC emulation or prototyping models reducing test time and a risk of silicon re-spins.
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Product
Advanced SoC/Analog Test System
3650
Test System
Chroma 3650 is an SoC tester with high throughput and high parallel test capabilities to provide the most cost-effective solution for fabless, IDM and testing houses.
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Product
Test System Optimized for High-Performance Digital and SoC
ULTRAWAVEMX44 and ULTRAWAVEMX20-D16
Test System
Teradyne is the leader in RF/wireless device testing and has a large installed base of UltraFLEX test systems with the UltraWave24 RF instrument. As new devices for handset and base station applications are introduced using mmWave technology, Teradyne’s mmWave instrumentation has expanded in anticipation of new testing demands.
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Product
Networking Solutions
Bluetooth Solutions
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Quickly introduce Bluetooth connectivity into sports and fitness, consumer electronics, beacons and smart home applications with easy-to-use and innovative Bluetooth SoCs, modules and software from Silicon Labs.
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Product
PANAVIA Modules
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AIM’s PANAVIA test, simulation, monitoring and analysis modules use our field proven Common Core hardware design giving you the best performance, best feature set and highest functional integration on the market. The use of SoC (System on Chip) based core design with one processor for real time bus protocol support, massive memory and IRIG-B time code encoder/decoder functions are standard. AIM delivers versions of our modules with extended temperature range and conformal coating. With 8 Tx and 8 Rx channels per module, functions include autonomous transmit sequencing, continuous clock and data transmissions, host controlled double buffering, programmable interrupts, data selection on specific tag identifier, selectable triggers on data and/or tags with full protocol error injection/detection, real time bus recording and time stamping to ensure your bus integrity. Each module is delivered with a Board Support Package (BSP) comaptible to the legacy PCI and cPCI hardware modules.
