SoC
A complete computer "System on a Chip".
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Product
3U VPX 1/10/40 Gigabit Ethernet Switch
ComEth4081e
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Powered by a Marvell highly integrated System-on-a-Chip (SoC) with programmable packet processors, and controlled by Switchware, the field-proven Interface Concept network management application, the ComEth4080e offers a high density of 1GbE/10GbE and 40GbE ports on a 3U footprint.
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Product
SMARC® Short Size Module with Intel® Pentium™ and Celeron™ Processor N3000 Series SoC (codename: Braswell)
LEC-BW
Computer on Module
The LEC-BW Computer-On-Module (COM) combines the SMARC® 1.1 standard with the Intel® Pentium® and Celeron® N-series System-on-Chip (SoC), providing an ideal solution for low power consumption and high performance requirements. The module provides the high integration, high performance, low power, and ruggedness favored by Internet-of-Things (IoT) applications such as retail transactional clients, digital signage, and in-vehicle infotainment systems.
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Product
Rugged Conduction Cooled 3U CompactPCI Processor Blade with Quad-Core Intel® Atom™ Processor
CT-3620
Processor Blade
The ADLINK CT-3620 Series is a Rugged Conduction-Cooled 3U CompactPCI processor blade in single-slot (4HP) width form factor featuring a quad-core Intel® Atom™ SoC and soldered DDR3L-1333 ECC memory up to 4GB. Graphics is integrated graphics on the CPU and storage is provided by an onboard 32GB SSD. Rear IO signals include 2x GbE, 1x USB 2.0, VGA, 2x COM, and 1x SATA 3Gb/s, providing for expansion with an optional Rear Transition Module (RTM).
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Product
Fanless Embedded System With Intel® Celeron® 2980U/ Core™ I5-4300U/i3-5010U ULT SoC, HDMI/DisplayPort, 2 GbE LANs, 4 USB 3.0, 2 COM And PCIe Mini Card
eBOX560-880-FL
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The eBOX560-880-FL, a palm-sized, fanless embedded computing system utilizes high performance Intel® Haswell ULT multi-core SoC. The ultra-compact, ultra-lightweight eBOX560-880-FL adopts an IP40-rated rugged aluminum cold-rolled steel enclosure to withstand vibration of up to 3 Grms (with SSD) and has a unique thermal solution to support the temperature range from -20°C to +50°C (-4°F to +122°F). Supporting 4K2K resolution via HDMI interface, the outstanding embedded box computer is ideal for passenger information system, Kiosk, entry-level gaming, video surveillance, and other automation & embedded applications.
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Product
PCIe/104 OneBank SBC w. Dual 1GHz ARM9 & 1Gbyte DDR3
EMC²-Z7015
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Sundance Multiprocessor Technology Ltd.
The EMC²-Z7015 is a PCIe/104 OneBank™ SBC with a Xilinx Zynq SoC, Artix-7 FPGA fabric and a VITA57.1 FMC™ LPC I/O board. The main processing power of the EMC²-Z7015 is a Dual Core ARM9 and combined with traditional FPGA fabrics/gates + High-Speed I/O interfaces, like USB2.0, HDMI, 1Gb Ethernet and SATA and provide an total solution for any Embedded Application.
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Product
SMARC
ROM-6881
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The Advantech ROM-6881 SMARC 2.1 Computer-on-Module is powered by a Rockchip RK3588 SoC which includes Quad Arm Cortex-A76 and Quad Cortex-A55 processors, 6Tops NPU and a high-performance Arm Mali-G610 3D graphics engine. ROM-6881 supports 8K @ 60 fps H.265/VP9 video decoding, and 8K @ 30 fps H.265/H.264 video encoding.
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Product
Signal Board Computers
PX1-C415
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WINSYSTEMS’ PX1-C415 single board computer (SBC) is a PC104 form factor SBC with PCIe/104™ OneBank™ expansion featuring the latest generation Intel® Atom™ E3900 series SOC processors (formerly known as Apollo Lake-I). Its small size, rugged design and extended operational temperature make it a great fit for Industrial IoT applications and embedded systems in the industrial control, transportation, Mil/COTS, and energy markets.
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Product
Custom Sensor Development
X4M03 | X4M06
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Kickstart your sensor product development with the XeThru development platform, and quickly develop a prototype using certified radar sensors and your programming language of choice, be it MATLAB, Python or C++. All embedded functionality for your radar sensor project is included; access to parametric control of the XeThru X4 UWB radar SoC, the back-end data processing it demands, and communcation stacks that connects to the host software running on Windows, Mac, Linus and embedded targets.
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Product
Xeon D-15xx SoC Processor AMC
AMC754
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The AMC754 is a Processor AMC in a single module, mid-size, based on the Intel® 5th generation Xeon 4-core, 8-core or 16-core Processors (Broadwell). The efficient SoC design has low power consumption and integrated PCH technology. The module follows the AMC.1, AMC.2 and the AMC.3 specifications.
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Product
SMARC V2.0 SoM Evaluation Kit With I.MX8M Quad/Dual 1.5 GHz/1.3 GHz (Industrial) SoC, 4GB Memory, 64GB EMMC, CAN, MIPI CSI/DSI, And HDMI 2.0
SCM180-180-EVK
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*Ultra-Low Power i.MX8M Dual/Quad A53 Core*Single M4 Core*HDMI 2.0a up to 4K*Dual Channel LVDS*MIPI CSI*10/100/1000 Mbps Ethernet*USB3.0, USB OTG*PCIe 2.0*CAN 2.0B*Audio
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Product
ETX Module with Intel Atom® Processor E3800 Series SoC (formerly codename: Bay Trail)
ETX-BT
Computer on Module
The ETX-BT is based on the latest Intel Atom® processor E3800 SoC series, adopting the latest 22nm process technology with 3-D Tri-Gate transistors featuring significant improvements in computational performance and energy efficiency. The E3800 SOC series integrates processor and GPU cores and all I/O on a single chip. Processor performance is scalable from a single-core Intel Atom® processor E3815 at 1.4GHz to a quad-core Intel Atom® processor E3845 at 1.9GHz. Two quad-core Intel® Celeron® processors, based on the same microarchitecture, are also available.
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Product
Hybrid Verification Platform
HES-DVM
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HES-DVM™ is a fully automated and scalable hybrid verification environment for SoC and ASIC designs. Utilizing the latest co-emulation standards like SCE-MI or TLM and newest FPGA technology, hardware and software design teams obtain early access to the hardware prototype of the design. Working concurrently with one another they develop and verify high-level code with RTL accuracy and speed-effective SoC emulation or prototyping models reducing test time and a risk of silicon re-spins.
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Product
Single Board Computers
PX1-C441
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WINSYSTEMS’ PX1-C441 single board computer (SBC) is a PC/104 form factor SBC with PCIe/104™ OneBank™ expansion featuring the latest generation Intel Apollo Lake-I Dual-core or Quad-core SOC processors for processing graphics. It includes up to 8 GB of soldered down LPDDR4 system memory and a non-removable eMMC device for solid-state storage of an operating system (OS) and applications. In addition, the board supports M.2 and SATA devices.
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Product
Smart Lighting
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The AS721x/AS722x are complete System-on-Chip (SoC) sensor-integrated IoT smart lighting managers for color-tunable white lighting applications. They also support daylight harvesting and color/lumen maintenance lighting applications. 0-10V control and network-enabled high-level command inputs are combined with industry-standard PWM and 0-10V outputs for direct control of LED power systems.
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Product
PC/104 OneBank Board
EMC2-ZU3EG
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Sundance Multiprocessor Technology Ltd.
The EMC²-ZU3EG is a PCIe/104 OneBank™ SBC with a Xilinx Zynq SoC and a VITA57.1 FMC™ LPC I/O board. The main processing power of the EMC²-ZU3EG is a Dual Core ARM9 and combined with traditional FPGA fabrics/gates + High-Speed I/O interfaces, like USB2.0, HDMI, 1Gb Ethernet and SATA and provide an total solution for any Embedded Application.
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Product
Gate-Level Design Optimization
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After logic synthesis, STAR helps reaching power, performance and area (PPA) requirements for complex SoCs is becoming a real challenge. Large design netlists are restructured and optimized to reach aggressive PPA requirements, cost-effectively.
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Product
SoC/Analog Test System
3650-S2
Test System
The Chroma 3650-S2 is specifically designed for high-throughput and high-parallel testing to provide the most cost-effective solution for fabless, IDM and testing houses.
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Product
Fanless Embedded System With Intel® Celeron® J1900 2.0 GHz, HDMI, VGA, 2 GbE LAN, 4 USB And 2 COM
eBOX625-842-FL
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The eBOX625-842-FL industrial-grade, extreme slim, fanless embedded system is powered by quad cores Intel® Celeron™ J1900 2.0GHz SoC (system-on-a-chip). Through the use of Intel® Bay Trail-D type quad-core SoC and one 8 GB DDR3L-1066/1333 SO-DIMM socket, the energy-efficient embedded box computer offers outstanding performance, yet remarkably power efficient experience. Dramatically lighter and rugged enclosure enables the compact system to fit into limited space and withstand any harsh industry environment. The eBOX625-842-FL features dual displays and rich connection capability, including VGA, HDMI, 2 LAN ports, 2 COM ports, 4 USB 2.0 and 8-channel DI/DO, providing an ideal solution for variety applications from digital signage, transportation, kiosk, industrial control automation, medical equipment and IoT & M2M applications.
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Product
3U CompactPCI Quad-Core Intel Atom® Processor X Series Blade
cPCI-3630
Processor Blade
The ADLINK cPCI-3630 Series is a 3U CompactPCI® 2.0 processor blade featuring the 64-bit Intel Atom® Processor X Series SoC (formerly Apollo Lake I) and soldered DDR3L-1600 MHz ECC memory up to 8GB.
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Product
Open Standard Module (OSM)
ROM-2620
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Advantech ROM-2620 OSM 1.1 Computer-on-Module is powered by NXP i.MX 8ULP SoC which includes up to 2 Arm Cortex-A35 cores in combination with one Cortex-M33 real timeprocessor and Vivante GC7000 nanoULTRA/GC328 graphics engine. It provides USB2.0, Fast Ethernet, MIPI-CSI, I2C, SPI, GPIO, PWM and MIPI DSI display for embedded applications
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Product
Quad-Core Intel® Atom™ Processor 3U CompactPCI® Card
MIC-3329
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The Advantech MIC-3329 is based on Intel® Atom™ technology, previously codenamed Baytrail and is designed to provide balanced performance and power efficiency. The MIC-3329 is a 3U CompactPCI® processor blade designed for dual-core Intel® Atom E3826/E3827 and quad-core Intel® Atom E3845 processors, and up to 4GB soldered DDR3L-1066/1333 ECC memory. It is available in single and dual slot form factor, offering a range of I/O functionality by XTM (8HP) & Rear I/O extensions. Front panel I/O on the single slot (4HP) provides 2 x RJ45 GbE ports (Switchable with RIO 4HP),1 x VGA port (Switchable with RIO 4HP), 1 x USB2.0 port and 1 x USB3.0 port. Front panel I/O on the second layer (XTM) provides 2 x COM ports (RS232/422/485), 1 x PS/2 KB/MS and 1 x Audio ports or 2 x M12 GbE ports, 1 x COM ports (RS232/422/485). The MIC-3329 provides an ideal solution for transportation, railway and factory automation applications. Its robust design from a layout and thermals perspective allows it to meet or exceed EN50155 and EN50121-4 using a very low TDP selection of 7W/8W/10W processors. Its low power consumption and industrial SoC features make the MIC-3329 a perfect fit for all fanless system applications.
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Product
6U VME 1/10/40 GbE Switch
ComEth4070e
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The ComEth 4070e is a cutting-edge 6U Layer 2/3 Ethernet switch for VME64x systems. Powered by the newest Marvell highly integrated system-on-chip (SoC) with programmable packet processors.
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Product
FRAMOS SLVS-EC RX IP CORE
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Sony’s SLVS-EC interface standard has emerged as the best high speed interface to Sony’s best image sensors, enabling higher throughput, greater signal integrity, and simpler designs. Engineers developing solutions using Xilinx FPGAs and SoCs can take advantage of FRAMOS’s SLVS-EC RX IP Core, Evaluation Board and tested source code examples. Device builders and camera vendors can de-risk the design while reaping the benefits of Sony’s latest high-speed interface.
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Product
SMARC
ROM-5820
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The Advantech ROM-5820 stands as a state-of-the-art SMARC 2.1 Computer-on-Module, incorporating the robust NXP i.MX95 System-on-Chip (SOC). This SOC features an impressive configuration, with up to six Arm Cortex-A55 cores, accompanied by a dedicated Cortex-M7 and M33 real-time processor, and an added Neural Network accelerator. The ROM-5820 provides extensive connectivity options, including USB 2.0, USB 3.2 Gen1By1, 10 Gigabit Ethernet, MIPI-CSI, PCI Express, as well as both a dual-channel LVDS and a 4-lane MIPI-DSI Display interface. These remarkable features position the ROM-5820 as an exceptional choice for a wide variety of embedded applications.
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Product
RTX
ROM-3310
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ROM-3310 RTX2.0 module integrates an ARM Cortex A8 single core 1 GHz TI AM3352 series ultra low power SoC and I/O solution with Linux. TI AM3352 supports multiple serial ports, 5V~24V wide range power inputs, and wide temperature -40 ~ 85 °C operation for data collection in industrial applications. Based on a thickness of 2 mm board, it uses an anti-oxidization golden finger design
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Product
Mini-ITX With Intel® Celeron® Processor J1900 (up To 2.42 GHz), VGA/HDMI/LVDS, USB 3.0, Mini PCIe Card And HD Audio
MANO842
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The MANO842 Mini-ITX motherboard features quad-core SoC, fanless design, advanced graphics performance, and 12VDC/STD ATX power input. The powerful MANO842 is equipped with a quad-core Intel® Celeron® J1900 processor with Intel® HD Graphics engine, delivering outstanding computing, graphics and media performance at a competitive price. The cost-effective industrial-grade motherboard utilizes high bandwidth DDR3L-1333 SO-DIMM with system memory up to 8 GB and a rich set of I/O features. With 12V single voltage DC power or STD ATX jack, the ultra-compact Mini-ITX mainboard can be widely applied to automation and embedded industries, including medical healthcare, in-vehicle infotainment, kiosk, digital entertainment, digital signage, POS and much more.
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Product
2-slot Fanless Industrial System With Intel® Celeron® Processor J1900, Front-access I/O, PCIe And PCI Slots
IPC922-215-FL
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The IPC922-215-FL is an energy-efficient fanless 2-slot industrial system with rugged mechanism and optimized expandability. The extreme compact IP30-rated IPC922-215-FL utilizes an onboard Intel® Celeron® quad core processor J1900 2.42GHz with one DDR3L 1333 up to 8 GB memory. To fulfill difference application needs, the rugged Intel® Bay Trail SoC barebone embedded system provides great expansion capability with two flexible PCI/PCIe slots that can be customized. Additionally, the Axiomtek IPC922-215-FL can withstand temperatures ranging from -10°C to 50°C, and is equipped with a wide range 10 ~ 30 VDC power input for industrial application.
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Product
Test And Product Engineering Services
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Tessolve provide Test & Product engineering Solutions & services from simple Logic ICs, high-speed digital, RF, Analog, PMIC, Mixed-signal, MCU/MPU, MEMS, Image Sensors, Memory to complex devices like ASIC/ASSP, SoC / SiP devices that go into Automotive, IoT, Wearable, Wireless, Computing, Network / Fiber optics and other consumer markets. We also engage ourselves in providing test solutions for emerging technologies in the 2.5D / 3D space.
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Product
Test System
UltraFLEX
Test System
The UltraFLEX test system delivers the power and precision you need for complex SoC devices built for mobile applications, networking, storage or high-end processing. Choose UltraFLEX when your device mix and throughput goals demand the highest speed, precision, coverage and site count.
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Product
Bluetooth PCIe Combo Module
SX-PCEAX
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The Silex’s SX-PCEAX is one of the industry’s first Tri-band Wi-Fi 6E modules. This Wi-Fi 6E module extends the benefits that Wi-Fi 6 already provides in the 2.4 and 5 GHz bands to 6 GHz and helps increase overall capacity and performance. SX-PCEAX is a tri-band IEEE 802.11 abgn/ac/ax WLAN module plus Bluetooth 5.2 BR/EDR/LE combo module based on Qualcomm’s QCA2066 SoC.
