SoC
A complete computer "System on a Chip".
-
Product
Advanced SoC/Analog Test System
3650
Test System
Chroma 3650 is an SoC tester with high throughput and high parallel test capabilities to provide the most cost-effective solution for fabless, IDM and testing houses.
-
Product
SoC Test Systems
Test System
SoC (System on Chip) devices integrate multiple different functions into a single chip. Our SoC test systems can test all the integrated circuits in SoC devices, including logic, analog, RF, DC and imagers by flexible configuration of the cards/modules used in the test system.
-
Product
SoC Test Systems
Test System
Specifically designed for high-throughput and high parallel test capabilities to provide the most cost-effective solution for fabless, IDM and testing houses. With the full functions of test capability, high accuracy, powerful software tools and excellent reliability, 3650-EX is ideal for testing consumer devices, high-performance microcontrollers, analog devices and SoC devices.
-
Product
SoC Test System
V93000 SoC / Smart Scale
-
Advantest’s V93000 Smart Scale generation incorporates innovative per-pin testing capabilities. Each pin runs it own sequencer program for maximum flexibility and performance, for example in multisite applications. Full test processor control ensures time synchronization between all card types, like digital, Power, RF, mixed signal and so on. The user benefits are reduced test time, best repeatability and simplified program creation. The system design makes it easy to extend your configuration with new modules and instrumentation, as your test needs change.
-
Product
SoC Test System
T2000
-
SoC devices require small-lot high-mix manufacturing methods in the present era of rapid generation change. Semiconductor makers struggle with requirements to replace their testers on a 2-3 year cycle. The T2000 addresses their needs by enabling rapid response to market needs with minimum capital investment.
-
Product
PCIe/104 OneBank Carrier for Trenz SoC Modules
EMC²-DP
-
Sundance Multiprocessor Technology Ltd.
The EMC²-DP is a PCIe/104 OneBank™ Carrier for a Trenz compatible SoC Module and has expansion for a VITA57.1 FMC™ LPC I/O board and also has I/O pins, using a 100-way Samtec RazorBeam connectors system. The add-on board, called “Sundance External Interface Connector – SEIC” contains LEDs, RS232, USB2.0, HDMI, 1Gb Ethernet and SATA . The “SEIC” can be customize for individual applications and bespoke connectors.
-
Product
COM-HPC Server Type Development Kit based on Ampere® Altra® SoC
Ampere Altra Dev Kit
Software Development Kit
Ampere Altra Dev Kit consists of a COM-HPC Server Base carrier paired with a COM-HPC Server Type Size E module and heatsink with fan. The module features Ampere® Altra® SoC (Arm Neoverse N1-based architecture) harnessing 32/64/96/128 Arm v8.2 64-bit cores for up to 1.7/2.2/2.8/2.6 GHz and providing support for up to 768GB DDR4 memory, offering unprecedented performance and power per watt with exceptional scalability.
-
Product
SMARC Short Size Module with Qualcomm® QRB5165 Series octa-core SoC
LEC-RB5
Computer on Module
The ADLINK LEC-RB5 is a SMARC module powered by the Qualcomm® QRB5165 SoC with 8 Arm Cortex-A77 cores and up to 15 TOPS Qualcomm® Hexagon™ Tensor Accelerator. The module is designed for robotics and drone applications and integrates several IoT technologies in a single solution. The LEC-RB5 SMARC module provides on-device artificial intelligence (AI) capabilities, support for up to 6 cameras, and low power consumption. It is capable of powering robots and drones in consumer, enterprise, defense, industrial and logistics sectors.
-
Product
COM Express Basic Size Type 7 Module with Intel® Xeon® D SoC and 4 SODIMMs
Express-BD74
Computer on Module
- 4 SO-DIMMs, up to 128GB dual channel DDR4 at 1866/2133/2400MHz ECC (dependent on SoC SKU)- Intel® Xeon® D SoC (up to 16 cores)- Two 10G Ethernet and NC-SI support- Up to 32 PCIe lanes (24x Gen3, 8x Gen2)- GbE, two SATA 6 Gb/s, four USB 3.0/2.0- Supports Smart Embedded Management Agent (SEMA®) functions
-
Product
SoC Tester
UltraFLEXplus
-
The UltraFLEXplus combines new instrument and software capability with a revolutionary tester infrastructure that provides a step-function improvement in throughput and engineering efficiency – all while leveraging the cumulative test IP developed over the UltraFLEX’s 15 year history .
-
Product
Qseven V1.2 SoM Evaluation Kit With I.MX287 454 MHz (Industrial) SoC, 128MB Memory, 4GB EMMC, Gigabit Ethernet, Audio, CAN And BSP
Q7M100-100-EVK
-
*Ultra low power consumption ARM9*High flexibility Qseven v1.2 compliant design*5 UART*2 CAN*24-bit TTL LCD*10/100 Mbps Ethernet*Linux 2.6.35
-
Product
Automotive System-on-Chip (SoC)
R-Car
-
"R-Car" is the nickname for Renesas' system-on-chip (SoC) family for car information systems designed for the next-generation of automotive computing for the age of autonomous vehicles.
-
Product
High Soeed CMOS System on Chip (SoC) Line Scan Image Sensor
LS4k
-
The LS4k is a high speed CMOS System on Chip (SoC) line scan image sensor optimized for applications requiring short exposure times and high accuracy line rates. It incorporates on chip two pixel arrays consisting of 2 rows with 4,096 7µm pitch pixels and 4 rows with 2,048 14µm pitch pixels respectively, a high accuracy (12-bit) high speed (84MHz) analog-to-digital conversion (ADC), and sophisticated on chip optical calibration for PRNU, DSNU, and lens shading correction.
-
Product
Pico-ITX SBC With Intel® Pentium® N3710 & Celeron® N3060 Processor, HDMI (VGA)/LVDS, LAN And Audio
PICO300
-
The PICO300, an extreme-compact fanless pico-ITX motherboard, is built with the Intel® Pentium® N3710 or Celeron® N3060 processor (codename: Braswell SoC). One SO-DIMM socket is provided to support up to 8GB of DDR3L-1600 memory. The PICO300 is supported in dual display configurations along with one 18/24-bit single/dual-channel LVDS and a choice of VGA or HDMI. Furthermore, the tiny 2.5” pico-ITX embedded board features Intel® integrated Gfx graphic engine to build excellent media and graphics performance capability. In addition, the compact size of the pico-ITX form factor also makes the PICO300 suitable for space-constrained embedded applications. It runs fanless operation, and supports -20°C to +60°C operating temperature. Combined all features as above, the PICO300 is ideal for any media editing, imaging, graphics and video intensive applications that be applied for a wide array of industrial IoT industries.
-
Product
3U CompactPCI Quad-Core Intel Atom® Processor Blade
cPCI-3620
Processor Blade
The ADLINK cPCI-3620 Series is a 3U CompactPCI® processor blade featuring a quad-core 4th generation Intel® Atom SOC and soldered DDR3L-1333 ECC memory up to 4GB.
-
Product
SMARC V1.0 SoM With IMX6 Quad/DualLite 800 MHz (Industrial) SoC, 1GB RAM, 4GB EMMC, GbE LAN, Audio, CAN, MIPI And PCAM
SCM120
-
*SMARC 1.0 (82 x 50 mm)*Ultra low power consumption Cortex™-A9*2 CAN 2.0B*24-bit TTL signal*LVDS/HDMI 1080P*10/100/1000 Mbps Ethernet*Linux3.0.35/Android 4.3*Audio
-
Product
Open Standard Module (OSM)
ROM-2820
-
Advantech ROM-2820 OSM 1.1 Computer-on-Module is powered by NXP i.MX 93 SoC which includes Cortex-A55 Dual-core in combination with one Cortex-M33 real time processor, Ethos®-U65 Neural Processing Unit (NPU) and 2D graphics engine. It provides USB2.0, Gigabit Ethernet, MIPI-CSI, I2C, SPI, GPIO, CAN-FD and MIPI DSI display for embedded applications
-
Product
6U cPCI 1/10/40 GbE Switch
ComEth4050e
-
The ComEth 4050e is a cutting-edge 6U cPCI Layer 2/3 Ethernet switch for PICMG 2.16 & VITA 31.1 systems and is powered by the newest Marvell highly integrated system-on-chip (SoC) with programmable packet processors.
-
Product
SMARC
ROM-5420 B1
-
ROM-5420 SAMRC v1.1 Module integrates ARM Cortex-A9 NXP i.MX6 series ultra low power SoC and I/O solution chips to be OS support ready. NXP i.MX6 supports 2D, 3D graphics acceleration, full HD 1080P video decoding and an HD 1080p video encoding hardware engine.
-
Product
3U OpenVPX Module Xilinx Zynq UltraScale
VPX3-ZU1
-
Sundance Multiprocessor Technology Ltd.
PanaTeQ’s VPX3-ZU1 is a 3U OpenVPX module based on the Zynq UltraScale+ MultiProcessor SoC device from Xilinx. The Zynq UltraScale+ integrates a Quad-core ARM Cortex-A53 based Application Processing Unit (APU), a Dual-core ARM Cortex-R5 based Real-Time Processing Unit (RPU), a ARM MALI-400 based Graphic Processing Unit (GPU) and an UltraScale+ Programmable Logic (PL) in a single device. It also includes on-chip memory, external memory interfaces, and a rich set of peripheral connectivity interfaces.
-
Product
3U OpenVPX Module
VPX3-ZU1B
-
Sundance Multiprocessor Technology Ltd.
PanaTeQ’s VPX3-ZU1B is a 3U OpenVPX module based on the Zynq UltraScale+ MultiProcessor SoC device from Xilinx. This upgraded version provides a dual Ethernet 1000BaseT interfaces on the VPX P2 connector.
-
Product
COM Express Compact Size Type 6 Module Intel Atom® E3900 series, Pentium®, and Celeron® SoC (formerly Apollo Lake)
cExpress-AL
Computer on Module
The cExpress-AL is a COM Express® COM.0 R3.0 Type 6 module supporting the Intel Atom® processor, Intel® Pentium® processor and Intel® Celeron® processor system-on-chip (SoC). The cExpress-AL is specifically designed for customers who need optimized processing and graphics performance with low power consumption in a long product life solution.
-
Product
SMARC
ROM-5721
-
Advantech ROM-5721 SMARC 2.0/2.1 Computer-on-Module is powered by NXP i.MX8M Mini SOC which includes up to 4 Arm Cortex-A53 cores in combination with one Cortex-M4 real time processor and Vivante GC320 , GC NanoUltra 3D graphics engine. It provides USB2.0, Gigabit Ethernet, MIPI-CSI, PCI Express, Dual channel LVDS shared with MIPI-DSI for embedded applications.
-
Product
Software
-
Easy to use and intuitive software is fundamental in order to analyze complex embedded software challenges. With the increase in use of multi-core SoCs, complex operating system environments, such as AUTOSAR, and the need for hypervisors, iSYSTEM aims to deliver a user interface that provides fast and clear results so that development decisions can be made quickly. Our offering can be broken down into a few core elements:
-
Product
TySOM Embedded Prototyping Boards
-
TySOM™ is a family of embedded system prototyping boards. Depending on the board, one of three FPGAs will be at its heart: a Xilinx Zynq® UltraScale+™, a Xilinx Xilinx Zynq-7000 or a Microchip PolarFire SoC. The boards are compatible, through industry standard interfaces (FMC or BPX), with Aldec’s wide range daughter cards, making Aldec’s TySOM embedded prototyping boards ideal for the rapid development of applications that include automotive (and ADAS, in particular), artificial intelligence (AI), machine learning (ML), embedded vision, embedded-HPC (including edge-processing), IoT, IIoT and industrial automation.
-
Product
PANAVIA Modules
-
AIM’s PANAVIA test, simulation, monitoring and analysis modules use our field proven Common Core hardware design giving you the best performance, best feature set and highest functional integration on the market. The use of SoC (System on Chip) based core design with one processor for real time bus protocol support, massive memory and IRIG-B time code encoder/decoder functions are standard. AIM delivers versions of our modules with extended temperature range and conformal coating. With 8 Tx and 8 Rx channels per module, functions include autonomous transmit sequencing, continuous clock and data transmissions, host controlled double buffering, programmable interrupts, data selection on specific tag identifier, selectable triggers on data and/or tags with full protocol error injection/detection, real time bus recording and time stamping to ensure your bus integrity. Each module is delivered with a Board Support Package (BSP) comaptible to the legacy PCI and cPCI hardware modules.
-
Product
(IoT) Wireless Module
SX-59HLS
-
The SX-59HLS is an ultra-low power Hosted Dual Band 1x1 802.11a/b/g/n Internet-of-Things (IoT) wireless module based on the Qualcomm QCA4012-2 System-on-Chip (SoC). The SX-59HLS is a first in its class to provide enterprise security for today’s high performing networks.
-
Product
6U VPX Single Board Computer
VPX6-187
-
Curtiss-Wright Defense Solutions
The VPX6-187 VPX Single Board Computer (SBC) is based on the NXP QorIQ P4040/4080 SOC multi-core processor. Available in versions with 4 or 8 cores running up to 1.5 GHz, and up to 8 GB of high-bandwidth DDR3 SRAM, the VPX6-187 SBC provides high-performance processing and a long list of features and I/O interfaces to satisfy the most demanding requirements of embedded computing.
-
Product
COM Express Type 6 Compact Module With Intel® Atom™ Processor E3845
CEM843
-
The CEM843 Intel® Bay Trail SoC system-on-modules come with 6 PCI Express lanes, eight USB signals, double deck DDR3L SO-DIMM sockets supporting up to 8 GB of system memory, and two SATA-300. The CEM843 utilizes quad cores Intel® Atom™ processor E3845, featuring a wide operating temperature range from -40°C to 85°C. The power-efficient compact module is designed with all necessary components and offers the most updated bus interfaces targeting at POS and kiosk systems, gaming, medical PCs, human machine interface, IoT & M2M-related and industrial automation controllers.
-
Product
Intel Xeon D-15xx Processor, AMC
AMC763
-
The AMC763 is a Processor AMC in a single module, mid-size, based on the Intel® 5th generation Xeon 4-core, 8-core or 16-core Processors (Broadwell). The efficient SoC design has low power consumption and integrated PCH technology. The module follows the AMC.1, AMC.2 and the AMC.3 specifications.
