Product

Solder Past Inspection

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Aprotec Instrumentation Ltd

Aprotec Instrumentation Ltd

From the innovative Z-Check 3D through to the entry level Z-Check 100 the entire range has been designed to provide accurate pad specific measurement of solder paste deposits, adhesives and component placement. Amongst its other features the Z check software comes with the convenience of a full SPC package as standard.

Product

Ball Probe Moisture Meter with Bluetooth®

FLIR MR59

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Teledyne FLIR

FLIR MR59 - Teledyne FLIR

The FLIR MR59 is a pinless meter with wireless connectivity, which offers the convenience to view live readings from a mobile device via the FLIR Tools® Mobile app. Thanks to the ball-shaped sensor, users can cover a large area in a short time without making a mark; measure into corners and around baseboards easily; and detect problems below the surface.

Product

Ball Rebound Resilience Tester

UI-FT95

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Unuo Instruments

UI-FT95 - Unuo Instruments

Ball Rebound Resilience Tester is used to test foam resilience by vertically dropping a steel ball on foam from required height.

Product

Solder Paste Inspection System

LaserVision SP3D Mini

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ASC International, Inc.

LaserVision SP3D Mini - ASC International, Inc.

The LaserVision SP3D Mini offers the same level of overall measurement capabilities as the VisionPro SP3D. Utilizing a lower cost microscope platform and the ability for customers to supply their own PC if needed, the SP3D Mini sets the "affordable" boundary on reliable, low cost SPI solutions.

Product

Open-Frame Collet Socket with Solder Tail Pins

Series 518

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Aries

Series 518 - Aries

Open Frame Collet Sockets with Solder Tail Pins. Features: Open frame allows for more efficient utilization of board space and better cooling. Choose from several pin styles. Compatible with automatic insertion equipment. Side-to-side and end-to-end stackable.

Product

Replacement Solder Tip Lead Set for D410/D610

Dx10-SI

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Teledyne LeCroy

Dx10-SI - Teledyne LeCroy

- Choice of 4 GHz or 6 GHz bandwidth models- Up to 5 Vpk-pk dynamic range with low noise- ±3 V offset range- Low loading and high impedance for minimal signal disturbance- Ideal for DDR2, DDR3, LPDDR2- Deluxe soft carrying case- Innovative QuickLink architecture- Wide variety of tips and leads-- Solder-In Lead-- Optional Positioner (Browser) Tip-- Quick Connect Lead-- Square Pin Lead-- HiTemp Solder-In Lead

Product

Solder Wettability Tester

5200ZC

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Rhesca Co., Ltd.

5200ZC - Rhesca Co., Ltd.

The current machine (5200TN) was developed as a comprehensive machine that covers solderability test standards around the world, but we have added a high cost performance machine to the lineup that has realized the request of "single function + low price", which many people who are using the successive machines of SAT2000-5000-5100 type.

Product

Small, High-Energy Ball Mill for Sample Sizes 0.2 - 1.5 Grams

Mixer/Mill 5100*

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HORIBA, Ltd.

Mixer/Mill 5100* - HORIBA, Ltd.

Small high-energy ball mill that accommodates sample sizes ranging from 0.2 - 1.5 grams. Ideal for grinding and pulverizing brittle samples, slurry grinding, and mixing powders.

Product

Pin-Line™ Collet Socket with Solder Tail Pins

Series 0513

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Aries

Series 0513 - Aries

Pin-Line Collet Sockets with Solder Tail Pins. Features: Rows of socket strips may be mounted on any centers and are end-to-end or side-by-side stackable for .100 [2.54] grid or matrix patterns. Available with solder tail or wire wrap pins. Consult Data Sheet No. 12014 for wire wrap pins. Break feature allows strips to be cut to the number of positions desired.

Product

24" Ball Bearing Slides Pair

DRS-24

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ELMA Electronic, Inc.

DRS-24 - ELMA Electronic, Inc.

24"D ball bearing slides ship complete with brackets and all hardware for attachment to cabinet

Product

IEC60950 50mm Impact Test Balls

CX-15

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Shenzhen Chuangxin Instruments Co., Ltd.

CX-15 - Shenzhen Chuangxin Instruments Co., Ltd.

The Impact Test Ball is a specially machined ball to test impact resistance according to IEC, CSA and UL Standards. It is made of chrome-plated-steel for durability, and is fitted with an eyelet to facilitate testing for pendulum applications. Eyelet is threaded to the ball to allow attachment of a handle or force gauge. Weights are closely controlled.

Product

SparkFun Solder-able Breadboard

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SparkFun Electronics

SparkFun Electronics

This is the SparkFun Solderable Breadboard. A bare PCB that is the exact size as our regular breadboard with the same connections to pins and power rails. This board is especially useful for preserving a prototype or experiment you just created on a solderless breadboard by soldering all the pieces in place.

Product

3D Solder Paste Inspection Machine (3D-SPI)

3Si Series

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Saki Corporation

3Si Series - Saki Corporation

Saki's 3D SPI identifies critical defects and assists with process improvement.