Product

Ball Pressure Test Apparatus

CX-Q03

-

Shenzhen Chuangxin Instruments Co., Ltd.

CX-Q03 - Shenzhen Chuangxin Instruments Co., Ltd.

The Ball Pressure Apparatus is used to check the integrity of dielectric materials by exerting 20N force. The BPA10 is called out in IEC 60335, 60950, 61010, UL, CSA and European Norms. It is used to check the integrity of dielectric materials by exerting 20N force. The Ball Pressure Apparatus is made of stainless steel for long life. Since accelerated life procedures are used for this oven test, more than one apparatus may be useful for parallel testing.

Product

Solder Paste Inspection

3D SPI

-

Viscom AG

3D SPI - Viscom AG

Checking all the relevant points in the production process is essential, especially in terms of analyzing the causes of defects, fixing them, and – most importantly – preventing them in the future. That’s why solder paste printing is of fundamental importance for manufacturing complex assemblies: If paste printing isn’t performed correctly, the defect can impact the subsequent assembly and the soldering process, resulting in a tilted component or a poor or missing solder joint.

Product

Portable Strain Gage Welding and Soldering Unit

700

-

Micro-Measurements

700 - Micro-Measurements

A battery-operated capacitive discharge spot welder for attaching and wiring weldable strain gages and temperature sensors.

Product

160-Pin DIN41612 Connector, Solder Pin, Male

40-960-160-M

-

Pickering Interfaces Inc.

40-960-160-M - Pickering Interfaces Inc.

Suitable for users to create their own cable assemblies, this product can be supplied with or without the backshell. For applications in LXI products where 4 connectors are used in a horizontal row if the user requires all connectors to have a second fixing then the connector can be fitted with an optional screwlock assembly.

Product

IEC60950 Ball Drop Impact Test Apparatus

-

Shenzhen Chuangxin Instruments Co., Ltd.

Shenzhen Chuangxin Instruments Co., Ltd.

It is mainly used for mechanical strength testing equipment enclosure, test equipment enclosure should be able to ensure that the structure can be expected to withstand the operation does not produce within the provisions of the standard risk for damage to the outer surface of the enclosure will touch dangerous parts of the apparatus.

Product

Standard DIP Socket with Solder Tail Bifurcated Contacts

Series 511

-

Aries

Series 511 - Aries

Standard DIP Sockets with Wire Wrap Bifurcated Contacts. Features: Standard DIP sockets are available with solder tail or wire wrap pins, all with bifurcated contacts. Consult Data Sheet No. 12005 for wire wrap pins. Aries offers these standard DIP sockets in more sizes than any other manufacturer.

Product

Replacement Solder Tip Lead Set for D410/D610

Dx10-SI

-

Teledyne LeCroy

Dx10-SI - Teledyne LeCroy

- Choice of 4 GHz or 6 GHz bandwidth models- Up to 5 Vpk-pk dynamic range with low noise- ±3 V offset range- Low loading and high impedance for minimal signal disturbance- Ideal for DDR2, DDR3, LPDDR2- Deluxe soft carrying case- Innovative QuickLink architecture- Wide variety of tips and leads-- Solder-In Lead-- Optional Positioner (Browser) Tip-- Quick Connect Lead-- Square Pin Lead-- HiTemp Solder-In Lead

Product

Soldering Station

SM-943

-

MCH Instruments Co.,Ltd.

SM-943 - MCH Instruments Co.,Ltd.

*Module: 943*Display: LED*Power Rating: 220V/70W*Temperature: 200-480DEGREE*Noisy: <45dB