Product

Lo-PRO®file Collet Socket with Solder Tail Pins

Series 513

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Aries

Series 513 - Aries

LO-PROfile Collet Sockets with Solder Tail Pins. Features: LO-PRO file Collet Sockets are available with solder tail or wire wrap pins. Consult Data Sheet No. 12012 for wire wrap pins. Choose from several size and plating options

Product

Socket with Bifurcated Contact Solder Tail Pins

Series 0511

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Aries

Series 0511 - Aries

Strip-Line Sockets with Bifurcated Contact Solder Tail Pins. Features: For mounting liquid crystal displays and other high pin count or odd centered components. Available in several sizes with bifurcated contacts in solder tail or wire wrap pins. Consult Data Sheet No. 12009 for wire wrap pins. Optional spacer available for mounting on .300 [7.62], .600

Product

Ball Pressure Tester

CX-Q02

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Shenzhen Chuangxin Instruments Co., Ltd.

CX-Q02 - Shenzhen Chuangxin Instruments Co., Ltd.

IEC60695 Ball Pressure Tester is used for testing parts of non-metallic materials for resistance to heat.

Product

Reflow Soldering Machines

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Shenzhen Leadsmt Technology Co.,Ltd

Shenzhen Leadsmt Technology Co.,Ltd

Used to attach surface-mount components to printed circuit boards (PCBs). It involves applying solder paste to specific locations on a PCB, placing the components on the paste, and then heating the assembly in a reflow oven.

Product

Replacement Solder tip lead set for D420/D620

Dx20-SI

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Teledyne LeCroy

Dx20-SI - Teledyne LeCroy

- Choice of 4 GHz or 6 GHz bandwidth models- Up to 5 Vpk-pk dynamic range with low noise- ±3 V offset range- Low loading and high impedance for minimal signal disturbance- Ideal for DDR2, DDR3, LPDDR2- Deluxe soft carrying case- Innovative QuickLink architecture- Wide variety of tips and leads-- Solder-In Lead-- Optional Positioner (Browser) Tip-- Quick Connect Lead-- Square Pin Lead-- HiTemp Solder-In Lead

Product

LVDT Displacement Sensors With Ball Swivel Heads

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INELTA Sensorsysteme GmbH & Co. KG

INELTA Sensorsysteme GmbH & Co. KG

This LVDT Series is made for a rough, industrial use. The housing having a diameter of 20mm is fastened "floating" to the application using two ball swivel heads. There is a diversity of displacements up to 200m possible.

Product

Ball Pressure Test

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Premier Electrosystems

Premier Electrosystems

Premier Electrosystems' Ball Pressure Test is used to determine dimensional stability under stress at elevated temperatures. It analyses the relationship between the degree of deformation and the temperature when the test specimen is subjected to a constant load.

Product

Solderability Tester

ZHX-35

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Shanghai Dean Electrical Co., Ltd

ZHX-35 - Shanghai Dean Electrical Co., Ltd

Executive standard: GB/T4074.4-2008/IEC60851-4; Inspection standard: JB/T4279.14-2008Used to detect the self-solderability of enameled round wires and wire harness;Set variable temperature range and automatically maintain constant temperature;Under mechanical driven, samples would be withdrawn by the action of automatic insertion and lateral movement, free from vibration and noise;