Product

Switch Probes (Rolling Ball Head) H888S2

1009650

-

FEINMETALL GmbH

1009650 - FEINMETALL GmbH

The Switch Probes (Rolling ball head) H888S2 with order code 1009650 is a precision instrument designed for a wide range of application environments. This innovative probe features a rolling ball head, which allows for smooth and accurate contact even on uneven surfaces. Engineered from high-quality materials, its design ensures durability and reliability in demanding conditions, making it an essential tool for engineers and technicians alike.

Product

04 With Soldering Eyelets | 4 Wafers | 24 Positions

04-4xx3-00/30-xx

-

ELMA Electronic, Inc.

04-4xx3-00/30-xx - ELMA Electronic, Inc.

Very robust, multi wafer selector with 15° detent angle, switching torque up to 20 Ncm and a rotational life up to 25'000 cycles

Product

Replacement Solder Tip Lead Set for D410/D610

Dx10-SI

-

Teledyne LeCroy

Dx10-SI - Teledyne LeCroy

- Choice of 4 GHz or 6 GHz bandwidth models- Up to 5 Vpk-pk dynamic range with low noise- ±3 V offset range- Low loading and high impedance for minimal signal disturbance- Ideal for DDR2, DDR3, LPDDR2- Deluxe soft carrying case- Innovative QuickLink architecture- Wide variety of tips and leads-- Solder-In Lead-- Optional Positioner (Browser) Tip-- Quick Connect Lead-- Square Pin Lead-- HiTemp Solder-In Lead

Product

Switch Probes (Rolling Ball Head) F88890S0003U100S08

1009589

-

FEINMETALL GmbH

1009589 - FEINMETALL GmbH

The Switch Probes (Rolling Ball Head) F88890S0003U100S08 stands out in precision applications with its robust design and versatile usability. With a pitch of 6.50 mm and a temperature tolerance ranging from -45°C to +200°C, it is ideal for various environments while ensuring reliable performance. The probe features a continuous current handling capacity of up to 5.00 A, complemented by a low typical contact resistance of just 25.00 mOhm, making it an excellent choice for applications that demand high electrical efficiency and minimal loss.

Product

Reflow Soldering Machines

-

Shenzhen Leadsmt Technology Co.,Ltd

Shenzhen Leadsmt Technology Co.,Ltd

Used to attach surface-mount components to printed circuit boards (PCBs). It involves applying solder paste to specific locations on a PCB, placing the components on the paste, and then heating the assembly in a reflow oven.

Product

Ball Probe Moisture Meter with Bluetooth®

FLIR MR59

-

Teledyne FLIR

FLIR MR59 - Teledyne FLIR

The FLIR MR59 is a pinless meter with wireless connectivity, which offers the convenience to view live readings from a mobile device via the FLIR Tools® Mobile app. Thanks to the ball-shaped sensor, users can cover a large area in a short time without making a mark; measure into corners and around baseboards easily; and detect problems below the surface.