Solder Ball
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Product
01 With Soldering Eyelets | 6 Positions | M8
01-1xxx-00/30xx-6-0
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Multi wafer compact selector with 60° detent angle, 4 mm shaft diameter, 25'000 switching cycles and with up to 6 Ncm switching torque
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Product
37-Pin D-Type Male Solder Bucket
92-960-037-M
D-Sub Male Connector
Accessory allows a user to create their own PCB based termination solution mounted directly on the front of the product or on the end of a cable. Interfacing PCBs should be designed with suitable clearances for the voltage the application requires. 37-Pin Female connectors can be directly mated to a corresponding Pickering Switching Module while Male versions can be used to interface to a Female cable assembly termination.
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Product
30" Ball Bearing Slides Pair
DRS-30
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30"D ball bearing slides ship complete with brackets and all hardware for attachment to cabinet
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Product
3D Solder Paste Inspection Machine (3D-SPI)
3Si Series
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Saki's 3D SPI identifies critical defects and assists with process improvement.
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Product
04 With Soldering Eyelets | 1 Wafer | 24 Positions
04-1xx3-00/30-xx
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Very robust, multi wafer selector with 15° detent angle, switching torque up to 20 Ncm and a rotational life up to 25'000 cycles
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Product
37-Pin D-Type Female Solder Pin HV
40-960-037-F-HV
D-Sub Female Connector
This connector is designed to allow users to directly terminate cables with soldered connections.
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Product
Replacement Solder Tip Leadset for Use with D420/620
Dx20-SI-HiTEMP
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The 90 cm HiTemp cables and Solder-In lead can be used for controlled situations where the differential amplifier module needs to be removed from the extreme temperature environment. Ideally suited for testing scenarios where the temperature can fluctuate from -40 °C to +105 °C.
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Product
Solder Paste Wetting Tester
SP-2
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SP-2 is wettability testing machine forsolder paste, parts electrode and PC board,adopted SP-Tension-Method (Temperature Profile Method).
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Product
25-Pin D-Type Male Solder Bucket
92-960-025-M
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This accessory is designed to allow users to directly terminate a cable with soldered connections to the connector. When the product is used without a backshell users should make their own cable strain relief arrangements and ensure appropriate electrical precautions are observed.
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Product
Open-Frame Collet Socket with Solder Tail Pins
Series 518
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Open Frame Collet Sockets with Solder Tail Pins. Features: Open frame allows for more efficient utilization of board space and better cooling. Choose from several pin styles. Compatible with automatic insertion equipment. Side-to-side and end-to-end stackable.
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Product
Ball Anvil Type Gear Micrometer
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Used for "over-pin diameter measurement" of gears A ball anvil is selected according to the gear.
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Product
Solder Test Pallet
WaveRIDER® NL 2
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The wave soldering process is one of the most challenging procedures to set up. The ECD WaveRIDER NL 2 greatly simplifies wave solder set up and ensures perfect repeatability, time after time. Board recipe preheat temperatures, conveyor speed, wave height, contact times and parallelism are all measured and monitored using the WaveRIDER NL 2 process pallet.
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Product
Solder Cup Connector Kit
Y1142A
D-Sub Male Connector
Used to build custom cables for 34950A – 78-pin Dsub male – 60 V.
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Product
Lo-PRO®file Collet Socket with Solder Tail Pins
Series 513
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LO-PROfile Collet Sockets with Solder Tail Pins. Features: LO-PRO file Collet Sockets are available with solder tail or wire wrap pins. Consult Data Sheet No. 12012 for wire wrap pins. Choose from several size and plating options
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Product
Portable Strain Gage Welding and Soldering Unit
700
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A battery-operated capacitive discharge spot welder for attaching and wiring weldable strain gages and temperature sensors.
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Product
04 With Soldering Eyelets | 4 Wafers | 12 Positions
04-4xx4-00/30-xx
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Very robust, multi wafer selector with 30° detent angle, switching torque up to 20 Ncm and a rotational life up to 25'000 cycles
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Product
3D Inline Solder Paste Inspection System
TROI 7700 SERIES
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Using Moire' pattern, Pemtron's three-dimensional lead applicationdosage tester combines 2D color images with 3D measurement data toprovide more detailed, near-real PCB images, unlike traditionalcolor maps. We will also provide you with the best solution forhigh-quality and high-precision PCB production with a varietyof statistical programs, along with information you need toquickly and accurately judge positive/failure.
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Product
Pin-Line™ Collet Socket with Solder Tail Pins
Series 0513
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Pin-Line Collet Sockets with Solder Tail Pins. Features: Rows of socket strips may be mounted on any centers and are end-to-end or side-by-side stackable for .100 [2.54] grid or matrix patterns. Available with solder tail or wire wrap pins. Consult Data Sheet No. 12014 for wire wrap pins. Break feature allows strips to be cut to the number of positions desired.
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Product
Solderability Tester
ZHX-35
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Shanghai Dean Electrical Co., Ltd
Executive standard: GB/T4074.4-2008/IEC60851-4; Inspection standard: JB/T4279.14-2008Used to detect the self-solderability of enameled round wires and wire harness;Set variable temperature range and automatically maintain constant temperature;Under mechanical driven, samples would be withdrawn by the action of automatic insertion and lateral movement, free from vibration and noise;
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Product
Standard DIP Socket with Solder Tail Bifurcated Contacts
Series 511
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Standard DIP Sockets with Wire Wrap Bifurcated Contacts. Features: Standard DIP sockets are available with solder tail or wire wrap pins, all with bifurcated contacts. Consult Data Sheet No. 12005 for wire wrap pins. Aries offers these standard DIP sockets in more sizes than any other manufacturer.
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Product
Switch Probes (Rolling Ball Head) F88890S0003U100S05
1024113
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The Switch Probes (Rolling Ball Head) F88890S0003U100S05 is engineered for precision applications, offering a robust design that is ideal for various electronic testing and measurement needs. With a pitch of 6.50 mm and a broad temperature range from -45°C to +200°C, this probe ensures adaptability in diverse environments. The probe's structure consisting of a brass barrel and a steel plunger enhances its durability, while the gold plating on the barrel provides excellent conductivity and resistance against corrosion.
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Product
Ball Rebound Resilience Tester
UI-FT95
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Ball Rebound Resilience Tester is used to test foam resilience by vertically dropping a steel ball on foam from required height.
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Product
160-Pin DIN41612 Connector, Solder Pin, Male
92-960-160-M
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Suitable for users to create their own cable assemblies, this product can be supplied with or without the backshell. For applications in LXI products where 4 connectors are used in a horizontal row if the user requires all connectors to have a second fixing then the connector can be fitted with an optional screwlock assembly.
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Product
3D Solder Paste Inspection (SPI)
TR7007 SII
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Offering inspection speeds of up to 200 cm2/sec, the TR7007 SII is the fastest solder paste inspection system in the industry. This highly accurate inline shadow-free solder paste inspection solution offers full 3D inspection at resolutions of 15 µm or 10 µm. Built on a high precision linear motor platform, the system's hallmark features include closed loop function, enhanced 2D imaging, auto-warp compensation and fringe pattern technology. Increase capacity without sacrificing additional space with an available dual-lane configuration.
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Product
POGO-62 High Performance Bias Ball Probe
POGO-62
ICT/FCT Probe
Current Rating (Amps): 3Average Probe Resistance (mOhm): 15Test Center (mil): 50Test Center (mm): 1.27Full Travel (mil): 250Full Travel (mm): 6.35Recommended Travel (mil): 167Recommended Travel (mm): 4.24Mechanical Life (no of cycles): 500,000Overall Length (mil): 1,300Overall Length (mm): 33.02
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Product
Ball Pressure Apparatus
BP-20
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Is designed to perform tests specified in many standards where resistance of insulating materials to elevated operating temperatures is to be determined. It is used to test insulation materials used in Electrical Appliances, Electrical wiring accessories, luminaires, motors, connectors, etc. The test ensures that external parts of insulating material, the deterioration of which might cause the appliance to fail to comply with the relevant standards, are sufficiently resistant to heat.
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Product
Solder Paste Analysis
SPA1000
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The SPA 1000 also introduces new process control capability by accurately measuring the suitability of the solder paste prior to its implementation on the production line. It achieves this by determining the "Open-Time" for the paste. It also performs the Slump Test and both of these methods provide a "Go/No Go" answer in less than 30 minutes to ensure minimum delay for the production line.
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Product
Standard 1.02 (29.00) - 4.00 (114.00) High Performance Bias Ball Probe
POGO-62I8-4-S
ICT/FCT Probe
Current Rating (Amps): 3Average Probe Resistance (mOhm): 15Test Center (mil): 50Test Center (mm): 1.27Full Travel (mil): 250Full Travel (mm): 6.35Recommended Travel (mil): 167Recommended Travel (mm): 4.24Mechanical Life (no of cycles): 500,000Overall Length (mil): 1,300Overall Length (mm): 33.02
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Product
Standard 0.62 (18.00) - 4.00 (114.00) High Performance Bias Ball Probe
POGO-1Z-4-S
ICT/FCT Probe
Current Rating (Amps): 6Average Probe Resistance (mOhm): 10Test Center (mil): 75Test Center (mm): 1.91Full Travel (mil): 250Full Travel (mm): 6.35Recommended Travel (mil): 167Recommended Travel (mm): 4.24Mechanical Life (no of cycles): 1,000,000Overall Length (mil): 1,300Overall Length (mm): 33.02
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Product
Small, High-Energy Ball Mill for Sample Sizes 0.2 - 1.5 Grams
Mixer/Mill 5100*
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Small high-energy ball mill that accommodates sample sizes ranging from 0.2 - 1.5 grams. Ideal for grinding and pulverizing brittle samples, slurry grinding, and mixing powders.
