Solder Ball
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Product
Replacement Solder tip lead set for D420/D620
Dx20-SI
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- Choice of 4 GHz or 6 GHz bandwidth models- Up to 5 Vpk-pk dynamic range with low noise- ±3 V offset range- Low loading and high impedance for minimal signal disturbance- Ideal for DDR2, DDR3, LPDDR2- Deluxe soft carrying case- Innovative QuickLink architecture- Wide variety of tips and leads-- Solder-In Lead-- Optional Positioner (Browser) Tip-- Quick Connect Lead-- Square Pin Lead-- HiTemp Solder-In Lead
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Product
Solder Paste Analysis
SPA1000
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The SPA 1000 also introduces new process control capability by accurately measuring the suitability of the solder paste prior to its implementation on the production line. It achieves this by determining the "Open-Time" for the paste. It also performs the Slump Test and both of these methods provide a "Go/No Go" answer in less than 30 minutes to ensure minimum delay for the production line.
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Product
Solder Paste Inspection System
KY8030-3
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The new KY8030-3 delivers 3x fasterinspection without compromisingperformance and accuracy.Using patented dual projection,the system eliminates the criticalShadow problem that all 3D SPI systemscan be vulnerable to.Additionally, the new KY8030-3 has solvedthe PCB Warp problem that seriouslyimpacts inspection accuracyand reliability of result.
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Product
37-Pin D-Type Female Solder Bucket
92-960-037-F
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Accessory allows a user to create their own PCB based termination solution mounted directly on the front of the product or on the end of a cable. Interfacing PCBs should be designed with suitable clearances for the voltage the application requires. 37-Pin Female connectors can be directly mated to a corresponding Pickering Switching Module while Male versions can be used to interface to a Female cable assembly termination.
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Product
Replacement Solder Tip Leadset for Use with D420/620
Dx20-SI-HiTEMP
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The 90 cm HiTemp cables and Solder-In lead can be used for controlled situations where the differential amplifier module needs to be removed from the extreme temperature environment. Ideally suited for testing scenarios where the temperature can fluctuate from -40 °C to +105 °C.
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Product
04 With Soldering Eyelets | 3 Wafers | 24 Positions
04-3xx3-00/30-xx
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Very robust, multi wafer selector with 15° detent angle, switching torque up to 20 Ncm and a rotational life up to 25'000 cycles
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Product
3D Solder Paste Inspection (SPI)
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Systems designed for solder paste inspection (SPI) quickly and reliably check the solder paste deposits on the circuit board.
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Product
04 With Soldering Eyelets | 2 Wafers | 24 Positions
04-2xx3-00/30-xx
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Very robust, multi wafer selector with 15° detent angle, switching torque up to 20 Ncm and a rotational life up to 25'000 cycles
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Product
Heat-Resistant Test Equipment Ball Pressure Tester
CX-Q002
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Shenzhen Chuangxin Instruments Co., Ltd.
Ball Pressure Tester is used for testing parts of non-metallic materials for resistance to heat. It is applicable to electrotechnical equipment, its subassemblies and components, and to solid electrical insulating materials except ceramics.
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Product
04 With Soldering Eyelets | 4 Wafers | 12 Positions
04-4xx4-00/30-xx
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Very robust, multi wafer selector with 30° detent angle, switching torque up to 20 Ncm and a rotational life up to 25'000 cycles
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Product
Ball Pressure Tester
CX-Q02
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Shenzhen Chuangxin Instruments Co., Ltd.
IEC60695 Ball Pressure Tester is used for testing parts of non-metallic materials for resistance to heat.
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Product
20" Ball Bearing Slides Pair
DRS-20
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20"D ball bearing slides ship complete with brackets and all hardware for attachment to cabinet
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Product
Socket with Bifurcated Contact Solder Tail Pins
Series 0511
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Strip-Line Sockets with Bifurcated Contact Solder Tail Pins. Features: For mounting liquid crystal displays and other high pin count or odd centered components. Available in several sizes with bifurcated contacts in solder tail or wire wrap pins. Consult Data Sheet No. 12009 for wire wrap pins. Optional spacer available for mounting on .300 [7.62], .600
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Product
Surface Mount Ball & Socket Test Point
SMOX
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SMOX is a unique select on test terminal which provides accurate line tests in PCB assembly. Supplied loose or on tape and reel for ease of assembly, its unique retention mechanism enhances reliability through low stress contact.
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Product
Solder Past Inspection
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From the innovative Z-Check 3D through to the entry level Z-Check 100 the entire range has been designed to provide accurate pad specific measurement of solder paste deposits, adhesives and component placement. Amongst its other features the Z check software comes with the convenience of a full SPC package as standard.
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Product
2.3KG Steel Impact Test Ball
CX-325
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Shenzhen Chuangxin Instruments Co., Ltd.
UL858 2.3KG Steel Impact Test Ball
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Product
37-Pin D-Type Female Solder Pin HV
40-960-037-F-HV
D-Sub Female Connector
This connector is designed to allow users to directly terminate cables with soldered connections.
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Product
SparkFun Solder-able Breadboard
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This is the SparkFun Solderable Breadboard. A bare PCB that is the exact size as our regular breadboard with the same connections to pins and power rails. This board is especially useful for preserving a prototype or experiment you just created on a solderless breadboard by soldering all the pieces in place.
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Product
9-Pin D-type Female, Solder Bucket, HV
92-960-009-F-HV
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9-Pin Female D-type Connector, High Voltage, Solder Bucket - Without Backshell
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Product
Flexible Captured Ball Bearing Control Cables
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Roller bearing controls, delivering linear motion between two points thru complex Airframe.
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Product
SparkFun Solder-able Breadboard
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This is the SparkFun Solderable Breadboard. A bare PCB that is the exact size as our regular breadboard with the same connections to pins and power rails. This board is especially useful for preserving a prototype or experiment you just created on a solderless breadboard by soldering all the pieces in place.
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Product
3D Solder Paste Inspection system
PI Series
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PI Series is a new generation 3D Solder Paste Inspection system that overcomes the limitations of traditional SPIs and satisfy all your inspection needs. The PI Series allows to easily implement Solder Paste Inspection in any PCBA line. These new generation systems are very intuitive to use, allowing non-experienced persons to get expected results.
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Product
3D Solder Paste Inspection
aSPIre 3
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Industry-leading measurement accuracy and inspection reliability- Perfect solution to eliminate shadow problems, base plane settings, and problems with projection direction- Full 3D foreign material inspection solution for the entire PCB- High productivity through the highest accuracy
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Product
Connector, 104-Pin D-Type Male, Solder Bucket, 5A
92-960-104-M
D-Sub Male Connector
This 104-pin male D-type connector allows users to create their own cable assemblies. Cable connection is via solder buckets - supplied without backshell. This connector is not compatible with Pickering modules that use the 104-pin D-type connector.
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Product
3D Solder Paste Inspection (SPI)
TR7007 SII
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Offering inspection speeds of up to 200 cm2/sec, the TR7007 SII is the fastest solder paste inspection system in the industry. This highly accurate inline shadow-free solder paste inspection solution offers full 3D inspection at resolutions of 15 µm or 10 µm. Built on a high precision linear motor platform, the system's hallmark features include closed loop function, enhanced 2D imaging, auto-warp compensation and fringe pattern technology. Increase capacity without sacrificing additional space with an available dual-lane configuration.
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Product
Ball Bearing Linear Stage,13mm Travel, Sensitivity 3um
PSM13(A)-34
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Model：PSM13(A)-34 Ball Bearing Linear Stage,13mm Travel, Sensitivity 3um
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Product
Ball Anvil Type Gear Micrometer
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Used for "over-pin diameter measurement" of gears A ball anvil is selected according to the gear.
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Product
01 With Soldering Eyelets | 6 Positions | M8
01-1xxx-00/30xx-6-0
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Multi wafer compact selector with 60° detent angle, 4 mm shaft diameter, 25'000 switching cycles and with up to 6 Ncm switching torque
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Product
01 With Soldering Eyelets | 10 Positions | M8
01-1xxx-00/30xx-10-0
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Multi wafer compact selector with 36° detent angle, 4 mm shaft diameter, 25'000 switching cycles and with up to 6 Ncm switching torque
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Product
Ball Rebound Resilience Tester
UI-FT95
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Ball Rebound Resilience Tester is used to test foam resilience by vertically dropping a steel ball on foam from required height.
