Solder Ball
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Product
Surface Mount Ball & Socket Test Point
SMOX
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SMOX is a unique select on test terminal which provides accurate line tests in PCB assembly. Supplied loose or on tape and reel for ease of assembly, its unique retention mechanism enhances reliability through low stress contact.
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Product
30" Ball Bearing Slides Pair
DRS-30
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30"D ball bearing slides ship complete with brackets and all hardware for attachment to cabinet
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Product
Heat-Resistant Test Equipment Ball Pressure Tester
CX-Q002
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Shenzhen Chuangxin Instruments Co., Ltd.
Ball Pressure Tester is used for testing parts of non-metallic materials for resistance to heat. It is applicable to electrotechnical equipment, its subassemblies and components, and to solid electrical insulating materials except ceramics.
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Product
Standard DIP Socket with Solder Tail Bifurcated Contacts
Series 511
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Standard DIP Sockets with Wire Wrap Bifurcated Contacts. Features: Standard DIP sockets are available with solder tail or wire wrap pins, all with bifurcated contacts. Consult Data Sheet No. 12005 for wire wrap pins. Aries offers these standard DIP sockets in more sizes than any other manufacturer.
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Product
UL1989, UL1418 535g 2 Inch Steel Ball
CX-02
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Shenzhen Chuangxin Instruments Co., Ltd.
UL1989, UL1418 535g 2 inch Steel Ball
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Product
SparkFun Solder-able Breadboard
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This is the SparkFun Solderable Breadboard. A bare PCB that is the exact size as our regular breadboard with the same connections to pins and power rails. This board is especially useful for preserving a prototype or experiment you just created on a solderless breadboard by soldering all the pieces in place.
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Product
Mini Coax, Contact, ITA, RG316 & 178, Solder Sleeve
610103158
Coax Contact (ITA)
Contact, ITA, Mini Coaxial, RG316 & 178, 50 MAU, Solder Sleeve
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Product
Solder Cup Connector Kit
Y1139A
D-Sub Female Connector
Used to build custom cables for 34921/23/25/31/32/33/37/38 –50-pin Dsub female – 125 V
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Product
Solder Paste Inspection System
KY8030-3
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The new KY8030-3 delivers 3x fasterinspection without compromisingperformance and accuracy.Using patented dual projection,the system eliminates the criticalShadow problem that all 3D SPI systemscan be vulnerable to.Additionally, the new KY8030-3 has solvedthe PCB Warp problem that seriouslyimpacts inspection accuracyand reliability of result.
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Product
Soldering Test
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The soldering tests are conducted to determine if materials can withstand soldering effects, such as resistance to soldering heat, as well as the solderability of components during the manufacturing process.
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Product
Laboratory Vacuum Oven, Laboratory Drying Oven For Ball Pressure Tester
CX-HTC
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Shenzhen Chuangxin Instruments Co., Ltd.
laboratory vacuum oven,Laboratory Drying Oven for ball pressure tester
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Product
High Speed Solder Paste Inspection
VisionPro HSi
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The VisionPro HSi offers high speed solder paste inspection. Utilizing the most advanced high resolution staging and sensor technologies, the VisionPro HSi provides the accuracy and reliability needed to compliment your overall screen print process improvement strategy.
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Product
Solderability Tester
LBT210
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Microtronic Microelectronic Vertriebs GmbH
Microtronic's LBT-210 solderability tester has software that offers statistical information such as mean value, standard deviation, etc. A camera option offers video of the test cycle and storage in memory with the appropriate test measurements and data. Additionally, it has the feature to test under nitrogen. This function can be switched on in the software. An enclosure that is flooded with nitrogen lowers and rises with the device under test.
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Product
IEC60950 Ball Drop Impact Test Apparatus
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Shenzhen Chuangxin Instruments Co., Ltd.
It is mainly used for mechanical strength testing equipment enclosure, test equipment enclosure should be able to ensure that the structure can be expected to withstand the operation does not produce within the provisions of the standard risk for damage to the outer surface of the enclosure will touch dangerous parts of the apparatus.
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Product
2.3KG Steel Impact Test Ball
CX-325
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Shenzhen Chuangxin Instruments Co., Ltd.
UL858 2.3KG Steel Impact Test Ball
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Product
Ball Bearing Linear Stage,13mm Travel XYZ, Sensitivity 3um
APSM13(A)-34
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Model:APSM13(A)-34 Ball Bearing Linear Stage,13mm Travel XYZ, Sensitivity 3um Details&Spec: Please refer to PSM13(A)-34 Specification,It is combinated by 2pcs PSM13(A)-34 (C,SR,SL) and 1pc PSM13(A)-34CZ
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Product
Alternate 2.39 (68.00) - 6.00 (170.00) High Performance Bias Ball Probe
POGO-1UN-6-S
ICT/FCT Probe
Current Rating (Amps): 6Average Probe Resistance (mOhm): 10Test Center (mil): 75Test Center (mm): 1.91Full Travel (mil): 250Full Travel (mm): 6.35Recommended Travel (mil): 167Recommended Travel (mm): 4.24Mechanical Life (no of cycles): 1,000,000Overall Length (mil): 1,300Overall Length (mm): 33.02
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Product
Light 0.83 (24.00) - 2.00 (57.00) High Performance Bias Ball Probe
POGO-1Z-2
ICT/FCT Probe
Current Rating (Amps): 6Average Probe Resistance (mOhm): 10Test Center (mil): 75Test Center (mm): 1.91Full Travel (mil): 250Full Travel (mm): 6.35Recommended Travel (mil): 167Recommended Travel (mm): 4.24Mechanical Life (no of cycles): 1,000,000Overall Length (mil): 1,300Overall Length (mm): 33.02
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Product
Standard 0.62 (18.00) - 4.00 (114.00) High Performance Bias Ball Probe
POGO-1UN-4-S
ICT/FCT Probe
Current Rating (Amps): 6Average Probe Resistance (mOhm): 10Test Center (mil): 75Test Center (mm): 1.91Full Travel (mil): 250Full Travel (mm): 6.35Recommended Travel (mil): 167Recommended Travel (mm): 4.24Mechanical Life (no of cycles): 1,000,000Overall Length (mil): 1,300Overall Length (mm): 33.02
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Product
High 1.73 (49.00) - 8.00 (227.00) High Performance Bias Ball Probe
POGO-1Z-8
ICT/FCT Probe
Current Rating (Amps): 6Average Probe Resistance (mOhm): 10Test Center (mil): 75Test Center (mm): 1.91Full Travel (mil): 250Full Travel (mm): 6.35Recommended Travel (mil): 167Recommended Travel (mm): 4.24Mechanical Life (no of cycles): 1,000,000Overall Length (mil): 1,300Overall Length (mm): 33.02
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Product
37-Pin D-Type Male Solder Pin HV
40-960-037-MHV
D-Sub Male Connector
This connector is designed to allow users to directly terminate cables with soldered connections.
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Product
Light 0.83 (24.00) - 2.00 (57.00) High Performance Bias Ball Probe
POGO-1UN-2-S
ICT/FCT Probe
Current Rating (Amps): 6Average Probe Resistance (mOhm): 10Test Center (mil): 75Test Center (mm): 1.91Full Travel (mil): 250Full Travel (mm): 6.35Recommended Travel (mil): 167Recommended Travel (mm): 4.24Mechanical Life (no of cycles): 1,000,000Overall Length (mil): 1,300Overall Length (mm): 33.02
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Product
Elevated 1.68 (48.00) - 7.00 (198.00) High Performance Bias Ball Probe
POGO-1T30-7-S
ICT/FCT Probe
Current Rating (Amps): 6Average Probe Resistance (mOhm): 10Test Center (mil): 75Test Center (mm): 1.91Full Travel (mil): 250Full Travel (mm): 6.35Recommended Travel (mil): 167Recommended Travel (mm): 4.24Mechanical Life (no of cycles): 1,000,000Overall Length (mil): 1,300Overall Length (mm): 33.02
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Product
25-Pin D-Type Male Solder Bucket
92-960-025-M
D-Sub Male Connector
This accessory is designed to allow users to directly terminate a cable with soldered connections to the connector. When the product is used without a backshell users should make their own cable strain relief arrangements and ensure appropriate electrical precautions are observed.
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Product
High 1.73 (49.00) - 8.00 (227.00) High Performance Bias Ball Probe
POGO-1L24-8
ICT/FCT Probe
Current Rating (Amps): 6Average Probe Resistance (mOhm): 10Test Center (mil): 75Test Center (mm): 1.91Full Travel (mil): 250Full Travel (mm): 6.35Recommended Travel (mil): 167Recommended Travel (mm): 4.24Mechanical Life (no of cycles): 1,000,000Overall Length (mil): 1,300Overall Length (mm): 33.02
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Product
Elevated 1.68 (48.00) - 7.00 (198.00) High Performance Bias Ball Probe
POGO-1UN-7-S
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Current Rating (Amps): 6Average Probe Resistance (mOhm): 10Test Center (mil): 75Test Center (mm): 1.91Full Travel (mil): 250Full Travel (mm): 6.35Recommended Travel (mil): 167Recommended Travel (mm): 4.24Mechanical Life (no of cycles): 1,000,000Overall Length (mil): 1,300Overall Length (mm): 33.02
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Product
9-Pin D-Type Male, Solder Bucket, HV
40-960-009-M-HV
D-Sub Male Connector
9-Pin Male D-Type Connector, High Voltage, Solder Bucket - With Backshell
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Product
Ball Pressure Test Device
ZBP-T
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Made up by the related item according to IEC60695, IEC884-1, GB/T5169.21-2006, GB4706.1-2005, GB2099.1-2008, etc. • R = 2.5mm Pressure: 20N • Base with thermocouple hole • Material: 304 stainless steel
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Product
Elevated 1.68 (48.00) - 7.00 (198.00) High Performance Bias Ball Probe
POGO-1T24-7-S
ICT/FCT Probe
Current Rating (Amps): 6Average Probe Resistance (mOhm): 10Test Center (mil): 75Test Center (mm): 1.91Full Travel (mil): 250Full Travel (mm): 6.35Recommended Travel (mil): 167Recommended Travel (mm): 4.24Mechanical Life (no of cycles): 1,000,000Overall Length (mil): 1,300Overall Length (mm): 33.02
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Product
GENERAL INSPECTION MACHINE AFTER SOLDER MASK
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DVI is a technology of automated optical inspection, which can inspect deep to the difference from semi-transparent layers or semi-reflective layers.





























