3D SPI
checks form, height, surface area, bridges, volume, x/y offset and coplanarity of solder.
See Also: 3D Solder Paste Inspection
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3D SPI
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Omron’s advanced inspection systems help manufacturers meet the requirements of today’s SMT applications while improving throughput and sharpening their competitive edge.
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3D SPI Series
MS-11e
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- Exclusive15MP / 25MP CoaXPress Camera System- Dual Projection Shadow Free Moiré Technology- Precision Compound Telecentric Camera Lens- Automated Z-Height Calibration System- Automated PCB Under Board Support System- Precision PCB Warpage Compensation- Closed Loop Communication With Screen Printer- Absolute Repeatability and Reproducibility- INTELLISYS® Industry 4.0 Intelligent Factory Automation System
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3D Solder Paste Inspection Machine (3D-SPI)
3Si Series
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Saki's 3D SPI identifies critical defects and assists with process improvement.
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Solder Paste Inspection System
KY8030-3
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The new KY8030-3 delivers 3x fasterinspection without compromisingperformance and accuracy.Using patented dual projection,the system eliminates the criticalShadow problem that all 3D SPI systemscan be vulnerable to.Additionally, the new KY8030-3 has solvedthe PCB Warp problem that seriouslyimpacts inspection accuracyand reliability of result.
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5D SPI
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On Mek Solder Paset Inspection systems, items which are better inspected in 2D, such as area offset and bridging, are viewed in full colour. Using colour inspection the ISO-Spector S2 SPI can tell the difference between paste, solder mask, silk screen and other PCB features and the SPI system can intelligently give you accurate results. Volume and height measurement in 3D are combined with the 2D inspection in Real-time, to give a True colour 3D image. Other 3D SPI systems only inspect in the 3rd dimension, (Z axis) and make extrapolated assumptions about the 2D image.
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Dual Projection 3D In-Line Solder Inspection System
KY8030-2
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The new KY8030-2 delivers 2x fasterinspection without compromising performanceand accuracy.Using patented dual projection, the systemeliminates the critical Shadow problem thatall 3D SPI systems can be vulnerable to.Easy UI and SPC Plus are included in the systempackage in order to help users achieve faster& easier printer process optimization
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Solder Paste Inspection Machine
3D SPI
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The 6500 series is the measurement equipment provided by Jiezhi Technology for the small pads of solder paste printed on the PCB board. It will cause defects such as sharpness, offset, more tin, and less tin printing during solder paste printing. Causes defects in the later stage of production, this equipment can find problems in advance
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3D SPI Series
MS-15
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- Exclusive 15MP / 25MP CoaXPress Camera System- Dual Projection Shadow Free Moiré Technology- Precision Compound Telecentric Camera Lens- Automated Z-Height Calibration System- Automated PCB Under Board Support System- Precision PCB Warpage Compensation- Closed Loop Communication With Screen Printer- Absolute Repeatability and Reproducibility- INTELLISYS® Industry 4.0 Intelligent Factory Automation System
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Solder Paste Inspection
3D SPI
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Checking all the relevant points in the production process is essential, especially in terms of analyzing the causes of defects, fixing them, and – most importantly – preventing them in the future. That’s why solder paste printing is of fundamental importance for manufacturing complex assemblies: If paste printing isn’t performed correctly, the defect can impact the subsequent assembly and the soldering process, resulting in a tilted component or a poor or missing solder joint.
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Product
Solder Paste
MVP Versa (3D SPI)
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The first part of any SMT process is Paste. MVPs Versa and 900 Series platforms provide high accuracy paste inspection. High accuracy paste measurements are made using a choice of 10um or 5um 3D measurement systems.
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3D Solder Paste Inspection (SPI)
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Systems designed for solder paste inspection (SPI) quickly and reliably check the solder paste deposits on the circuit board.
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3D AOI
Zenith2
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Zenith 2 AOI platform, which provides the AI-driven Auto Programming for rapid job programming. The Zenith 2 also combines Koh Young’s advanced vision algorithms with innovative high-resolution optics. The latest platform expands inspection capabilities, delivering best-in-class performance, functionality, and accessibility. Koh Young’s side-view solution allows Zenith 2 to quickly detect and analyze defects on a wide range of mounted components and chips.
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3D Profilers
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AEP Technology offers different kinds of 3D profilers. Rugged platform, advanced electronic equipment, clean test space, low carbon emission, low machine noise, high-end lens, etc., make our surface profiler unique in the imaging world. In addition to providing stand-alone contact 3D profilers and optical 3D profilers, we also provide the world's only cross-platform, dual-mode 3D profiler that is compatible with both tactile and optical profilometers.
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USB/RS232/SPI Programmable Attenuator
RUDAT-13G-90
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Mini-Circuits’ RUDAT-13G-90 is a general purpose programmable RF attenuator supporting frequencies from 10 to 13000 MHz with attenuation from 0 to 90 dB in 0.5 dB steps. Its unique design maintains linear attenuation change per dB, even at the highest attenuation and frequency settings. The attenuator is controlled via USB, RS232 or SPI. It comes housed in a compact, shielded metal case with SMA(F) input/ output RF ports (RF ports are interchangeable), a USB type Mini-B socket, and a 9-pin D-sub(F) RS232 and SPI port. Power can be supplied via either USB or the D-sub port. The RUDAT-13G-90 is supplied with our easy-to-install, user-friendly GUI software, API objects for Windows® environments, and complete programming instructions for 32 and 64 bit Windows® and Linux® operating systems. See p. 9 for a complete list of included accessories.
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3D Software
Geomagic Freeform
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Geomagic Freeform is the best solution for the design and manufacturing of organic shapes, giving you the real sensation of clay modeling but with all the added benefits of digital design. Now combined with Artec’s precise 3D scanners, you can effortlessly capture a large variety of objects in high detail directly into Geomagic Freeform software in order to easily solve any design and manufacturing challenges.
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3D Cameras
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*Visual assessment of distance, level or volume*Time-of-flight measurement principle*Illumination, measurement and evaluation in one unit*Output of distance and grey values*Integration by means of intuitive parameter setting software
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3D AOI with Revolutionary New 3D Measurement
Zenith
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The Zenith 3D AOI system measures the true profilometricshape of components, solder joints, patterns and even foreignmaterial on assembled PCBs with true 3 dimensional measurement, overcoming the shortcomings and vulnerabilities of 2D AOI.
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3D Smart Sensors
Gocator Family
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Scan, measurement and control within a single device. Optimize manufacturing processes and improve quality control decisions at production speed with 3D non-contact inspection.
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Direct 3D RightMark
D3D RM
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D3DRightMark is an independent non-commercial open-source graphics card benchmarking project developed by iXBT.com. It's called to help users estimate graphics cards performance and quality in synthetic tests and real apps, e.g. games. Synthetic tests allow estimating performance and capabilities of separate graphics cards subsystems in order to forecast their behavior in either applications, both existing (that is overall estimation of suitability and prospects for an entire application range) and developing, provided that a given accelerator demonstrates peculiar behavior under such applications.
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3D Digital Inspection
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Digital stereo 3D imaging is a unique, advanced, stereo image presentation system designed to provide fully interactive real time natural 3D viewing and visualisation with outstanding depth perception.
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TTL/I2C/SPI* Expansion Kit
OP-SB5GL
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OP-SB5GL is the interface expansion kit that has a port to measure RS-232C(V.24) and a port to measure the TTL / CMOS signal level communications. The port for TTL / CMOS supports the measurement of TTL / CMOS level communications that power supply system is from 1.8V to 5V. It is suitable for monitoring the communications between the LSI and the interface IC on the printed circuit board by directly probing into the lines. It supports the protocol of not only UART and HDLC but also I2C and SPI* on monitoring and simulating.
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3D Audio Servers
GoldSeries
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AuSIM offers a growing number of prepackaged configurations, designed to meet a broad spectrum of R&D and deployment needs. These standard packages are generically called GoldSeries, and have a range of options to tune them to the needs of a specific project. If none of these are appropriate to your application, AuSIM will gladly develop a custom package for your specialized needs.
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Ensenso 3D Cameras
X Series
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Imaging Development Systems GmbH
The Ensenso X series is a modular and ultraflexible 3D camera system. The projector module with 100 W LED projector power is equipped with an integrated Gigabit Ethernet switch and can be combined with selected GigE uEye camera models to a customised 3D camera system.
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3D Optical Profilers
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ZYGO's 3D Optical Profiler instruments enable precise, quantitative, ISO-compliant, non-contact surface measurement and characterization of micro- and nano-scale surface features, capturing up to two million data points in just seconds. Applications range from topography and waviness to roughness and microstructure characterization on samples as that vary from ultra-smooth sub-angstrom optical surfaces, to extremely rough and diffuse 3D printed surfaces.
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3D Imaging Sensor
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The GS 3D sensors, can be used in applications such as bin picking, robotic manipulation, sorting products, mold clearance checking, and space monitoring and object recognition. In addition, the 3D technology will aid in determining spatial positions and measurements.The GS 3D images larger objects at longer distances and does so in milliseconds without the cycle time and motion required by scanning-based methods.
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Metra Scan 3D
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The most accurate scanning and probing solutions, whether in lab or on the shop floor.Highly accurate measurementDynamic referencingComplete metrology solution
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High-Resolution 3D Seismic Solution
PIKSEL
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PIKSEL is an integrated and compact solution that enables high-resolution seismic data acquisition in targeted areas for offshore construction and field development.
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3D Contact Profilometer
NanoMap-LS
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NanoMap-LS with large scanning range allows to generate high resolution 3D and 2D images with a press of a button.
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3D AOI
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Omron’s advanced inspection systems help manufacturers meet the requirements of today’s SMT applications while improving throughput and sharpening their competitive edge.
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Product
Relay Test Set Type SP-I
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Supreme Instrument Laboratories
Supreme make relay testing set is designed for site testing of protective relays which simulate in common fault conditions under which a protective relay will be called into positive function. Periodic field testing is the best way of ensuring the integrity of the protective relays. We offer our relay testing set with specific testing capacity to suit different group of protective relays. The testing set operates on single phase 230 V, A.C. 50Hz. Supply.
