3D SPI
checks form, height, surface area, bridges, volume, x/y offset and coplanarity of solder.
See Also: 3D Solder Paste Inspection
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3D Video Microscope
BVM-20102B
High-resolution CCD sensor, built-in analog/digital converter, analog and digital signal directly display on the screen, can also simultaneously display on TV and computer through corresponding interfaces; taking photo and video through software; easy operation, reducing user's fatigue and injury.
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3D Imaging Sensor
The GS 3D sensors, can be used in applications such as bin picking, robotic manipulation, sorting products, mold clearance checking, and space monitoring and object recognition. In addition, the 3D technology will aid in determining spatial positions and measurements.The GS 3D images larger objects at longer distances and does so in milliseconds without the cycle time and motion required by scanning-based methods.
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3D Laser Imager
Vector-DD
The Vector 3D laser imager offers multi wavelength, full waveform data capture, coupled with the flexibility of an all-sky scanner. The Vector-DD is a direct detection (DD) 3D (range, angle, angle) active imager with an all-sky full hemisphere scanner. It employs a nodal point design so that all the lines-of-sight converge to a single point at the instrument*. In addition, two wavelengths can be transmitted so that differential reflectivity information can be derived. The unit is compact and portable and operates from 24V DC.
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Non-contact 3D Optical Profilers
LuphoScan platforms are interferometric, scanning metrology systems. They are designed to perform ultra precision non-contact 3D form measurements mainly of rotationally symmetric surfaces such as aspheric lenses.
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Affordable 3D Scanner
Metron E
Professional desktop 3D scanner for generating digital 3D models from physical objects at an affordable price. Metron E 3D scanner is the perfect solution if you are looking for a practical desktop 3D scanner. It’s effective at getting the job done to make you more productive.
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3D Sensors
*Up to 38500 distance values per measurement for a detailed assessment of the application*Configurable outputs*Visual assessment of distance, level or volume*Predefined function blocks*Time-of-flight measurement principle
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High-Resolution 3D Seismic Solution
PIKSEL
PIKSEL is an integrated and compact solution that enables high-resolution seismic data acquisition in targeted areas for offshore construction and field development.
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Process Improvement Software for SPI & AOI
SIGMA Link
SIGMA Link software suite links altogether solder paste inspection (SPI), automated optical inspection (AOI) and manufacturing execution system (MES). For Smart Factories, SIGMA Link is the essential element to connect inspection machines to Manufacturing Execution System. This real-time interface ensures full traceability and enables interlocking of machines to automate SMT lines while driving yield to new levels.
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Desktop 3D AOI Series
MV-3 OMNI
- Exclusive 15MP / 25MP CoaXPress Camera System- OMNI-VISION® 3D Digital Tri-Frequency Moiré Technology- Leading-Edge 12 Projection Blue DLP Technology- Precision Compound Telecentric Camera Lens- Eight Phase Color Lighting System- 10MP / 18MP SIDE-VIEWER® Camera System- Programmable Z-Axis Multi-Focus System- INTELLI-PRO® Automatic Programming Software- Multi-Functional AOI-SPI Fusion Technology- INTELLISYS® Industry 4.0 Intelligent Factory Automation System
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Dimensional Inspection (3D Inspection)
The 3D measurement data from our scanners and PCMMs offers a comprehensive definition of a physical object that is used for measurement, inspection, comparison and reporting. When a part is defined by millions of points, you can see subtle deviations, slight variations and fine details, which gives you the confidence that a part (or mold) meets your specifications. To deliver the best of both worlds, we combine 3D scanning with our contact, touch-probe measurement tools to deliver precise dimensions on geometric shapes.
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Simple 3D Measurement & Inspection
XG-X Series Vision System
Abundant processing power is available even with multiple camera connections, including the 21 megapixel color camera, line scan cameras, or 3D cameras. XG-X Series offers high-speed, high-resolution cameras for high-accuracy inspection, providing powerful solutions for a variety of problems that arise in manufacturing.
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3D Multibeam Scanning Sonar
ProScan™
Teledyne BlueView's 3D Multibeam Scanning Sonar user interface software. ProScan connects to the sonar and pan/tilt unit, configures each scan, generates full 3D point clouds, and optionally streams output to third party hydrographic software for fusion with other sensors. Data is recorded in multiple file formats: .son (raw acoustic data file for ProScan reprocessing), .txt (plain text record of all point locations and positional data) and .xyzi (industry standard xyzi data for 3D point cloud viewers, registration software, etc.). In playback mode, users can review and reprocess scans to modify sound speed, intensity threshold, multidetect and range settings as needed. ProScan coupled with Teledyne PDS MotionScan, pitch, roll heading and position sensors provides the capability to scan areas to collect 3D point clouds while correcting for motion.
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3D Scanning System
CyberGage360
Unprecedented combination of speed, accuracy and one-button simplicity for non-contact automated 3D scanning inspection.CyberGage360 dramatically Speeds Up Quality Assurance of Incoming Parts Inspection & In-Process Inspection of components on the manufacturing floor; Lowers Cost of Quality & Speeds Up Product Time-to-Market. Designed for use in general purpose metrology, the CyberGage360 has a range of potential industrial applications from automotive to aerospace to consumer electronics, where high accuracy and high speed throughput are important.
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3D Bundle
Cost effective bundle of eVision's 3D librariesIncludes Easy3D, Easy3DLaserLine, Easy3DObject and Easy3DMatch
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3D Flexible Scanner
HDI Advance
The HDI Advance 3D scanner offers the flexibility of scanning objects of different shapes and sizes. Simply move the camera positions to change the scanner’s field of view (FOV). The 3D scanner comes with three preset camera slots to quickly modify the field of view from 165mm up to 600mm, depending on the scanner model.
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SPI | AOI | AXI
Suitable for a wide variety of SMT applications, Omron’s automated inspection solutions are designed to ensure the highest degree of quality and consistency in PCB production.
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Universal 3D Measurement Software
Metrolog
Get a real performance accelerator for your 3D measuring devices and more.Not only does Metrolog X4 architecture benefit from current computer and OS technologies significantly increasing the performances and metrology software throughput, but it also simplifies your day-to-day measurement workflow.
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3D Inspection Software
Metrolog X4
Metrolog X4 architecture is designed not only to benefit from current computer and OS technologies (Windows 64-bit, and multiprocessor PCs) that significantly increase the performances and throughput of your Metrology software, but is also aimed at simplifying your day-to-day measurement work. Metrolog X4 is a perfect Point Cloud software able to analyze large data size. High Performances in Point Cloud analysis: Large Data file import (CAD files, Point clouds, ...)
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3D AOI Series
MV-6 OMNI
- Exclusive 15MP / 25MP CoaXPress Camera System- OMNI-VISION® 3D Digital Tri-Frequency Moiré Technology- Leading-Edge 12 Projection Blue DLP Technology- Precision Compound Telecentric Camera Lens- Eight Phase Color Lighting System- 10MP / 18MP SIDE-VIEWER® Camera System- Programmable Z-Axis Multi-Focus System- INTELLI-PRO® Automatic Programming Software- Multi-Functional AOI-SPI Fusion Technology- INTELLISYS® Industry 4.0 Intelligent Factory Automation System
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DIgital 3D Image Correlation System
Q-400
The Digital 3D Image Correlation System Q-400 is an optical measuring device for true full-field, non-contact, three-dimensional measurement of shape, displacements and strains on components and structures made from almost any material.The Q-400 system is used for determination of three-dimensional material properties in tensile, torsion, bending or combined tests. In addition, deformation and strain analysis can be applied to fatigue tests, fracture mechanics, FEA validation, and much more.
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3D Optical Microscopy
Bruker is the worldwide leader in 3D surface measurement and inspection, offering fast, non-contact analyses for samples ranging in size from microscopic MEMS to entire engine blocks. Our microscopes are the culmination of ten generations of proprietary Wyko® Technology advances that provide the high sensitivity and stability necessary for precision 3D surface measurements in applications and environments that are challenging for other metrology systems.
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3D Scanner
Raptor3DX
Raptor3DX is a hybrid type optical scanner, enabling both the automatic and stationary modes for users. The compact, detachable scanning sensor acts as a powerful sensor engine when as automatic mode; a flexible scanner itself when used as stationary mode, providing three FOV in one.
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3D Video Microscope
BVM-20104
The microscope is configured with 1.3M HD industrial camera. VGA image output interface, can be connected to the computer and monitor directly. clear and vivid image, taking photos, SD card storage, auto exposure. Camera is equipped with remote control panel, which makes the operation much easier. Optical lens keep parfocal under zoom, there is no deviation for center; 3D rotary observation
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SPI Flammability Tester (Vinyl Material)
TF318
TESTEX Testing Equipment Systems Ltd.
SPI Flammability Tester (Vinyl Material), to determine the ignition properties of vinyl plastic film material according to CFR 16 Part 1611 U.S.A. Flammable Fabrics Act for flammability of apparel vinyl plastic film.The rate of burning shall not exceed 1.2 in./s as judged by the average of five determinations lengthwise and five determinations transverse to the direction of processing, when specimen is placed at an angle of 45 degree and expose to the standardized flame (22# fire nozzle, 1/2 inch. In length).
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AOI & SPI Test Systems
Xceed AOI
Most defects in the circuit-board assembly are due to the solder paste or the process of printing solder paste. Since the transition to lead-free soldering, a whole new spectrum of problems has emerged in older paste printing and its due processes. Incomplete coalescence of ball grid array (BGA) spheres and solder paste deposits are failure modes that have increased in frequency since the transition to lead-free soldering. The Xceed enables true 3D measurement and provides the most accurate and repeatable inspection results with the minimum false calls. It’s designed with Advanced Signal Processing which gives results in noise-less, clear, and accurate 3D images.
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Metra Scan 3D
The most accurate scanning and probing solutions, whether in lab or on the shop floor.Highly accurate measurementDynamic referencingComplete metrology solution
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High-speed 3D Solder Inspection Machine
YSi-SP
a high-speed 3D solder paste inspection machine that enables high-speed high-accuracy inspections based on our “1-head solution” concept for using a single type of head to handle various inspections. It is used to inspect the printing quality (volume, height, area, misalignment) of solder paste after it has been printed onto PCBs. Available April '18.
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Software Module for Efficient and Accurate 3D Measurement
Verisurf Measure
Measure part features and complex profile geometries informed by real-time deviation display between CAD and measured data for real-time decisions. Produce one-click inspection reports in standard or custom, shareable formats that feed to your quality management system.The Measure module’s device interface operates and optimizes most popular measurement systems making them more productive and ensuring a better return on your investment. You can also import externally captured data and process it against the nominal CAD model and tolerances. Even run datasets offline with feature extraction and pre-defined datums and constraints.
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High-Speed Multi-IO SPI Host Adapter
BusPro-S™
The BusPro-S High-Speed Multi-IO SPI Host is designed with speed, versatility, and value in mind. Featuring a 60 MHz clock rate with up to 200 Mb/s throughput and support for standard, dual, quad, and 3-wire modes, the BusPro-S is the right tool for all SPI debugging applications-present and beyond.
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3D Scanner Software
3DX Engine
*Easy step-by-step user interface, low learning curve, suitable even for first time users*Recovery mode always protects all your scan project and data from computer crash and power outage.*Texture Scanning (OBJ format)
