3D SPI
checks form, height, surface area, bridges, volume, x/y offset and coplanarity of solder.
See Also: 3D Solder Paste Inspection
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Product
3D Micro Coordinate Measurement Machine and Surface Roughness Measurement Device
InfiniteFocusSL
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With the InfiniteFocusSL you are able to measure form and roughness of your components with only one system. In addition, color images with high contrast and depth of focus are achieved. The robust frame and the intelligent illumination technology provide fast and high-resolution measurement in the laboratory and a production near environment. The measurement system is particularly attractive due to its cost effectiveness, measurement speed and usability. The long working distance in combination with the above average measurement field allows a wide range of applications. Measurements are achieved within seconds, and features, such as a coaxial laser for quick and easy focusing, enhance its usability.
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Product
Sapphire 3D Microscope
WDI-2000
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The Sapphire 3D Microscope: HS-WDI-2000 was designed with high quality lighting parts and a good optical system design,can get a very clear image.with the digital camera,it can provide the image in time, widely used in LED,Solar,SEMI…
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Product
3D Electromagnetic Simulation Software
XFdtd®
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A full-featured simulation solver, XFdtd outpaces other methods in efficiency as the number of unknowns increases. XF includes full-wave, static, bio-thermal, optimization, and circuit solvers to tackle a wide variety of applications, including antenna design and placement, biomedical and SAR, EMI/EMC, microwave devices, radar and scattering, automotive radar, and more. It also works with Remcom's ray-tracing products to provide thorough simulation capability at the low-, middle-, and high-end of the electromagnetic spectrum.
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Product
USB-8451, 250 kHz I2C, 12 MHz SPI I2C/SPI Interface Device
779553-50
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The NI USB‑8451 is a master interface for connecting to and communicating with inter-integrated circuit (I2C), System Management Bus (SMBus), and serial peripheral interface (SPI) devices. With plug‑and‑play USB connectivity, the USB‑8451 is a portable solution to communicate with consumer electronics and integrated circuits. It also includes eight general-purpose digital I/O lines for a variety of applications, such as configuring the address of I2C devices or toggling LEDs. The USB‑8451 can be physically located more closely to I2C/SPI devices than PCI interfaces, reducing I2C bus length and minimizing noise problems. Additionally, the interface provides +5 V and GND to power circuits with no external power supply.
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Product
3D Sensing
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The rapidly growing field of 3D sensing is currently addressed by the following 3D camera technologies: stereoscopic imaging, time-of-flight (ToF) sensing, and structured light.
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Product
Time-of-Flight 3D Camera with IP67 Protection Class, Sub-Millimeter Precision
LUCID Helios2
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Time-of-flight camera with IP67 protection class;Dust and water resistant; HDRmodel available ! Sony DepthSense IMX556 CMOS sensor; Resolution 0.3 MP 640 x 480; Frequency: 30 frames / s; Price: $ 1,645.00.
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Product
Revopoint MetroX: Blue Laser Line and Full-field Structured Light 3D Scanner
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4 Flexible Scanning Modesꔷ Metrology-grade Accuracy: Up to 0.03 mmꔷ Volumetric Accuracy: Up to 0.03 mm + 0.1 mm × L(m)ꔷ Up to 7,000,000 Points/s in Full-field Structured Light Modeꔷ Up to 800,000 Points/s in Multi-line Laser Mode
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3D Laser Scanning Systems
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3D laser scanning is a construction, engineering, and architectural tool often used to document the existing conditions (as-builts) of any structure.
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Product
Desktop 3D Scanners
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Automated 3D Scanning for small to medium sized parts. Desktop scanners offer a more compact solution with great accuracy.
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Product
High-speed 3D Solder Inspection Machine
YSi-SP
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a high-speed 3D solder paste inspection machine that enables high-speed high-accuracy inspections based on our “1-head solution” concept for using a single type of head to handle various inspections. It is used to inspect the printing quality (volume, height, area, misalignment) of solder paste after it has been printed onto PCBs. Available April '18.
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Product
3D Measuring Laser Microscope
LEXT OLS5000
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The OLS5000 laser confocal microscope precisely measures shape and surface roughness at the submicron level. Data acquisition that's four times faster than our previous model delivers a significant boost to productivity. Measure samples that are up to 210 mm tall. Capture the shape of any surface. Total magnification: 54x - 17,280x
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Product
3D Scanning Coordinate Measurement Machine
CUBE-R™
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CUBE-R™ is a fast, reliable, and efficient complete turnkey solution for automated quality control applications. This automated 3D measuring machine features MetraSCAN 3D-R, a powerful robot-mounted optical 3D scanner that can be integrated into factory automation systems without compromising on accuracy. It is the perfect alternative to solve any productivity issues caused by bottlenecks at the traditional coordinate measuring machine (CMM).
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Product
FieldMaster 3D
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Field analyzer for low-frequency fields, selective and wide-band measurement simultaneously on all three axes. The sensor plates have a high-quality GOLDSCHICHTUNG, so that the calibration is guaranteed as long as possible despite harmful environmental influences.
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Product
ROBOT-MOUNTED OPTICAL CMM 3D SCANNERS
METRASCAN-R
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Part of the MetraSCAN 3D line-up, the robot-mounted MetraSCAN-R optical CMM 3D scanning systems are fast and accurate scanning solutions designed for 3D automated inspection of parts on the production line and on the shop floor. In combination with industrial robots, the MetraSCAN-R series increases the reliability, speed and versatility of on-line inspection and quality control (QC) process.
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Product
Cutting-edge 3D GPR array solution for efficient subsurface imaging cart solutions
Raptor
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The Raptor system covers a wide range of applications and can be configurated with 450 MHz or 800 MHz antennas. Raptor 3D Arrays are based on Real-Time sampling (RTS) technology and the unique antenna design is a milestone in the evolution of the GPR. A Raptor Antenna can be arranged in different ways, which allows for both standard and more advanced GPR measurements. These include common mid-point (CMP), wide-angle reflection and refraction (WARR) and Tomography.
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Product
3D Optical Profiler
Nexview™ NX2
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Designed for the most demanding applications, the Nexview™ NX2 3D optical profiler combines exceptional precision, advanced algorithms, application flexibility, and automation into a single package that represents ZYGO's most advanced Coherence Scanning Interferometric (CSI) profiler.
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Product
Digital Image Correlation System for Complete 3D Warpage, Thermal Expansion, and Strain Analysis of Materials and Components in the Heating and Cooling Phase
Q-400 TCT
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The Q-400 TCT system is designed for complete three-dimensional and highly sensitive warpage, thermal expansion measurement and strain analysis of materials and components in the heating and cooling phase. Areas from 50 mm x 70 mm down to 2 mm x 3 mm can be investigated. Measurements can be done from room temperature up to 300°C and down to -40°C. The system is specially suited for thermal expansion measurement of electronic components and is frequently used in the development and testing of complex anisotropic materials, components, and structures in electronic applications.
