3D SPI
checks form, height, surface area, bridges, volume, x/y offset and coplanarity of solder.
See Also: 3D Solder Paste Inspection
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3D Automated Optical Inspection Systems
New 3Di Series
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To handle today’s rapidly changing market trends, the system can handle complex inspection challenges such as high component mounting density areas containing highly miniaturized parts placed near much larger and taller component. With our new 3D AOI system, you can strengthen quality assurance and increase production efficiency.
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3D Sensor (Shiny Surfaces)
reflectCONTROL
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reflectCONTROL is designed specifically to meet the high quality requirements that ensure high quality for shiny surfaces. The system based on deflectometry projects a striped pattern onto the measurement object. Defects on the surface cause deviations from the striped pattern which are recorded by cameras and evaluated by software.
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3D Geo-Magnetometer
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For the measurement of magnetic equilibria such as the earth's magnetic field, for the determination of anomalies and biologically active location factors. Three highly sensitive magnetic field sensors, as well as a dedicated microprocessor, are integrated into the measuring probe. The sensitive magnetic field sensor is connected to a PC, notebook or laptop (not included). The main features in brief:
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Borehole 3D Geophones
GFA 50/100
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3D borehole geo-phone is realized with 3x high sensitive geophones (nat.freq.10 Hz- 1 vertical and 2 horizontal sensors) oriented according to a triad of orthogonal Cartesian axes XYZ. Delivered with a cleat assembly to sustain its weight at the requested depth (GFA cable is graduated in meters), this borehole geophone has a pneumatic-mechanical clamping system.
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ATD 3D Layout Machine
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ATD Model is consisted of 2 main body and one cast iron surface plate for marking work and 3D measruing.
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3D Electromagnetic Simulation Software
XFdtd®
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A full-featured simulation solver, XFdtd outpaces other methods in efficiency as the number of unknowns increases. XF includes full-wave, static, bio-thermal, optimization, and circuit solvers to tackle a wide variety of applications, including antenna design and placement, biomedical and SAR, EMI/EMC, microwave devices, radar and scattering, automotive radar, and more. It also works with Remcom's ray-tracing products to provide thorough simulation capability at the low-, middle-, and high-end of the electromagnetic spectrum.
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3D Scanning Services
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The 3D scanning services provided by our 3D scanning facilities can capture 3D measurements from objects as small as a pin head or as large as a nuclear power generation facility. When we remove the constraints imposed by conventional measurement technologies, the scope of applications becomes virtually limitless with 3D digital data in hand.
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3D Optical Profilometers
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The Profilm3D® benchtop optical profiler and Zeta™ optical profilometers provide fast, easy, non-contact solutions for 3D surface topography measurements. Our portfolio of 3D optical profilers supports a variety of measurement techniques, including white light interferometry, True Color imaging and ZDot™ confocal grid structured illumination. KLA Instruments can help guide you to the right 3D optical profiler solution for your unique measurement needs.
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3D CT Micro Or Nano Tomography And Digital Radioscopy Compact System
EasyTom
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Versatility for a wide variety of applications and analysable products. 6 motion axis. Large volume Inspection.
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DIgital 3D Image Correlation System
Q-400
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The Digital 3D Image Correlation System Q-400 is an optical measuring device for true full-field, non-contact, three-dimensional measurement of shape, displacements and strains on components and structures made from almost any material.The Q-400 system is used for determination of three-dimensional material properties in tensile, torsion, bending or combined tests. In addition, deformation and strain analysis can be applied to fatigue tests, fracture mechanics, FEA validation, and much more.
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USB/RS232/SPI Programmable Attenuator
RUDAT-13G-90
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Mini-Circuits’ RUDAT-13G-90 is a general purpose programmable RF attenuator supporting frequencies from 10 to 13000 MHz with attenuation from 0 to 90 dB in 0.5 dB steps. Its unique design maintains linear attenuation change per dB, even at the highest attenuation and frequency settings. The attenuator is controlled via USB, RS232 or SPI. It comes housed in a compact, shielded metal case with SMA(F) input/ output RF ports (RF ports are interchangeable), a USB type Mini-B socket, and a 9-pin D-sub(F) RS232 and SPI port. Power can be supplied via either USB or the D-sub port. The RUDAT-13G-90 is supplied with our easy-to-install, user-friendly GUI software, API objects for Windows® environments, and complete programming instructions for 32 and 64 bit Windows® and Linux® operating systems. See p. 9 for a complete list of included accessories.
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Simple 3D Measurement & Inspection
XG-X Series Vision System
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Abundant processing power is available even with multiple camera connections, including the 21 megapixel color camera, line scan cameras, or 3D cameras. XG-X Series offers high-speed, high-resolution cameras for high-accuracy inspection, providing powerful solutions for a variety of problems that arise in manufacturing.
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Metra Scan 3D
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The most accurate scanning and probing solutions, whether in lab or on the shop floor.Highly accurate measurementDynamic referencingComplete metrology solution
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Revopoint MetroX: Blue Laser Line and Full-field Structured Light 3D Scanner
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4 Flexible Scanning Modesꔷ Metrology-grade Accuracy: Up to 0.03 mmꔷ Volumetric Accuracy: Up to 0.03 mm + 0.1 mm × L(m)ꔷ Up to 7,000,000 Points/s in Full-field Structured Light Modeꔷ Up to 800,000 Points/s in Multi-line Laser Mode
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Robust RISC-based DIN-rail Fanless Embedded System With I.MX 6UL Processor, COM, SPI, I2C, 2 LANs And DIO (2-in/1-out)
IFB125
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The IFB125 is powered by the low-power Freescale i.MX6UL processor in the ARM® Cortex™-A7 micro architecture. It supports extended operating temperature ranging from -40°C to 70°C, and can withstand vibration up to 5G. Its flexible wide voltage range 9V - 48V DC power input with a lockable terminal block type connector also enhances its reliability in harsh environments. To meet most of Industrial IoT needs, the IFB125 supports multiple communication interfaces for maximum flexibility, including LAN, serial, USB, and digital I/O ports. The Industrial IoT gateway has 256MB onboard memory that features data transfer rates of DDR3-1600, as well as 4GB eMMC flash memory onboard for storage. This embedded IoT gateway platform is equipped with one PCI Express Mini Card slot and one SIM card slot. Additionally, it supports DB9 connectors with both SPI and I2C function as communication protocols to suit for specific applications
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3D Design
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Rapid Design Exploration. Created for design engineering workflows, our intuitive product design software generates a fast user experience. Rapid design exploration includes detailed insight into real-world product performance. Live physics and accurate high-fidelity simulation combine into an easy-to-use interface that supports faster-time-to-market.
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Digital Image Correlation System for Complete 3D Warpage, Thermal Expansion, and Strain Analysis of Materials and Components in the Heating and Cooling Phase
Q-400 TCT
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The Q-400 TCT system is designed for complete three-dimensional and highly sensitive warpage, thermal expansion measurement and strain analysis of materials and components in the heating and cooling phase. Areas from 50 mm x 70 mm down to 2 mm x 3 mm can be investigated. Measurements can be done from room temperature up to 300°C and down to -40°C. The system is specially suited for thermal expansion measurement of electronic components and is frequently used in the development and testing of complex anisotropic materials, components, and structures in electronic applications.
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3D CMOS Image Sensors
Flash
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High-resolution in a rectangular format, specifically designed for 3D laser triangulation - Very high frame rate and throughput combined with high power efficiency, delivering outstanding sampling resolution and speed with a high Gbps/W ratio - HDR feature embedded on-chip, to measure all kinds of surfaces - Feature-rich sensors, to perfectly meet application challenges.
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Precise 3D Profilometry
µscan
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Using the NanoFocus µscan technology, you can measure up to 100 times faster than with conventional probe systems. Various µscan sensors are available for the different application areas. The optical profilometers of the µscan series are suitable for the fast scanning of surface profiles with precision in the low nanometer range.
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3D inversion geophysical software for Resistivity and Induced Polarization Data
RES3DINV
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This program is designed to invert data collected with a rectangular grid of electrodes. The arrays supported include the pole-pole, pole-dipole, inline dipole-dipole, equatorial dipole-dipole and Wenner-Schlumberger. The RES3DINV program uses the smoothness-constrained least-squares inversion technique to produce a 3D model of the subsurface from the apparent resistivity data alone.
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Handheld 3D Laser Scanner
Freestyle3D Scanner
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The FARO Freestyle3D is a top-quality, high-precision, handheld scanner for professionals. It quickly and reliably documents rooms, structures and objects in 3D and creates high-definition point clouds. With unbeatable precision, it is suitable for all uses in which installations, properties or environments must be quickly measured from various perspectives. The applications of the FARO Freestyle3D include construction, industrial engineering, and forensics.
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Areal Confocal 3D Measurement
µsurf
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The measuring system of the µsurf-product line enable automated 3D surface measurements of roughness, topography, layer thickness and volume. µsurf-measuring systems are available in different designs: from compact mobile systems and laboratory solutions up to multisensor setups on granite portal for use near production lines.
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USB-8452, 3.3 MHz I2C, 50 MHz SPI I2C/SPI Interface Device
781964-03
Interface Module
The NI USB‑8452 is a master interface for connecting to and communicating with inter-integrated circuit (I2C) and serial peripheral interface (SPI) devices. With plug‑and‑play USB connectivity, the USB‑8452 is a bus-powered, portable solution to communicate with consumer electronics and integrated circuits. It also includes eight general-purpose digital I/O lines for a variety of applications, such as configuring the address of I2C devices, toggling LEDs, or strobing convert and data ready lines common to analog converter chips. You can physically place the USB‑8452 more closely than PCI interfaces to I2C/SPI devices, which reduces I2C bus length and minimizes noise problems. Additionally, the interface provides +5 V and GND to power circuits with no external power supply.
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3D Scanner
Raptor3DX
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Raptor3DX is a hybrid type optical scanner, enabling both the automatic and stationary modes for users. The compact, detachable scanning sensor acts as a powerful sensor engine when as automatic mode; a flexible scanner itself when used as stationary mode, providing three FOV in one.
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3D Sensor
C6 Series
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The new 3D C6 series by AT is built on a novel sensor platform that supports the latest industrial standard GigE Vision/GenICam 3D at 1 Gbit/s. These new laser profilers offer an impressive combination of extremely fast and highly precise resolution, reaching up to 4,096 points per profile, a profile speed of up to 200 kHz, and high dynamic range 3D image capture. They are available as compact sensors, MCS, and 3D cameras.
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Relay Test Set Type SP-I
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Supreme Instrument Laboratories
Supreme make relay testing set is designed for site testing of protective relays which simulate in common fault conditions under which a protective relay will be called into positive function. Periodic field testing is the best way of ensuring the integrity of the protective relays. We offer our relay testing set with specific testing capacity to suit different group of protective relays. The testing set operates on single phase 230 V, A.C. 50Hz. Supply.
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USB-8452, 3.3 MHz I2C, 50 MHz SPI I2C/SPI Interface Device
781964-02
Interface Module
The NI USB‑8452 is a master interface for connecting to and communicating with inter-integrated circuit (I2C) and serial peripheral interface (SPI) devices. With plug‑and‑play USB connectivity, the USB‑8452 is a bus-powered, portable solution to communicate with consumer electronics and integrated circuits. It also includes eight general-purpose digital I/O lines for a variety of applications, such as configuring the address of I2C devices, toggling LEDs, or strobing convert and data ready lines common to analog converter chips. You can physically place the USB‑8452 more closely than PCI interfaces to I2C/SPI devices, which reduces I2C bus length and minimizes noise problems. Additionally, the interface provides +5 V and GND to power circuits with no external power supply.
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3D Profile Sensor
Z-Trak2
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Z-Trak™2 is a new family of 3D profile sensors built on Teledyne Imaging’s 3D image sensor technology, ushering in a new era of 5GigE 3D profile sensors for high-speed, in-line 3D applications.
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3D AOI
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Omron’s advanced inspection systems help manufacturers meet the requirements of today’s SMT applications while improving throughput and sharpening their competitive edge.
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3D Machine Vision Systems
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Whether performing a single profile measurement or scanning an entire surface in 3D, Cognex has the most powerful and robust 3D machine vision tools. Manufacturers in all industries trust Cognex technology to deliver high accuracy surface feature measurements that go beyond the capabilities of 2D machine vision technology.
