3D
three dimensions.
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Product
PDS Multibeam Survey & Processing/Charting Software
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Teledyne PDS for Multibeam Surveys provides the functionality for survey planning, data acquisition, data processing, editing, volume calculations and chart production. This turnkey solution offers the surveyor and helmsman a strong tool to carry out the multibeam survey efficiently. Progress is shown real time in top, profile, and 3D views using a color-coded digital terrain model (DTM). Various filter settings can be applied to the multibeam data online, thus providing real-time data processing. Quality control displays reassure the operators that the data is of the desired quality.
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Product
DSP-Based 4/8-Axis Advanced Pulse-Train Motion Controllers
AMP-204C/AMP-208C
Motion Controller
ADLINK"s new AMP-204C/AMP-208C DSP-based 4/8-axis advanced pulse-train motion controllers incorporate up-to-date floating-point DSP and FPGA technology, enabling high pulse output and encoder input frequency up to 6.5 MHz and 20 MHz respectively. Leveraging ADLINK" s Softmotion technology, the AMP-204C/AMP-208C offer impressive comprehensive and application-oriented motion functionality to reduce development time while maintaining superior throughput and accuracy. Superior synchronous motion control performance combines with point-table function integrating multi-dimensional interpolation, such as 3D linear/circular/spiral interpolation with enhanced trajectory and velocity planning, for contouring applications in semiconductor, display and conventional manufacturing industries. The AMP-204C/AMP-208C also support PWM control with three different control modes for frequency or duty cycle, benefiting laser engraving/marking/cutting applications. Moreover, hardware-based position comparison and trigger output are applicable in AOI applications.
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Product
3D Electromagnetic Simulation Software
XFdtd®
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A full-featured simulation solver, XFdtd outpaces other methods in efficiency as the number of unknowns increases. XF includes full-wave, static, bio-thermal, optimization, and circuit solvers to tackle a wide variety of applications, including antenna design and placement, biomedical and SAR, EMI/EMC, microwave devices, radar and scattering, automotive radar, and more. It also works with Remcom's ray-tracing products to provide thorough simulation capability at the low-, middle-, and high-end of the electromagnetic spectrum.
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Product
Optical Coherence Tomography (OCT) systems
dOCTor™
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dOCTor™ Optical Coherence Tomography (OCT) systemsoffer very high quality non-invasive tissue imaging in 2D and 3D. They are ideal for: In-Vivo Imaging Small Animal Imaging Tissue Engineering and Visualization Developmental BiologydOCTor systems are available in Swept-Source(SS) OCT and Time-Domain (TD) OCT configurations to satisfy different application imaging needs.
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Product
Automotive Infotainment SoCs
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ST’s portfolio of infotainment systems on chips (SOCs) includes a complete offer of automotive-grade devices for a wide range of infotainment systems ranging from turnkey Accordo2 processors for car radio applications and Display Audio systems, featuring smartphone mirroring and support of rear-view cameras, up to powerful Accordo5 multi-core processors with best-in class 3D graphics and video decoding capabilities, to address multi-standard smartphone replication technology as well as Digital Instrument Cluster applications.
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Product
PCI Express Graphic Card with NVIDIA® Quadro® RTX5000
Quadro PEG RTX5000
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- DisplayPort 1.4 x4- VirtualLink x1- DisplayPort with Audio- 3D Stereo Support- Quadro Sync II Compatibility- NVIDIA nView® Desktop Management Software- HDCP 2.2 Support- NVIDIA Mosaic
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Product
Easy3D
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Point cloud processing and managementFlexible ZMap generation3D processing functions for cropping, decimating, fitting and aligning point cloudsCompatible with many 3D sensorsInteractive 3D display with the 3D Viewer
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Product
Microtomography
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Bruker microCT micro-tomography is available in a range of easy-to-use desktop instruments, which generate 3D images of your sample’s morphology and internal microstructure with resolution down to the sub-micron level. Software for visualization and analysis in 3D is included with all SkyScan systems.
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Product
3D Automated Optical Inspection System
EAGLE 3D 8800 SERIES
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EAGELE 3D 8800 AOI applies 8-way projection for 3Dmeasurements to all models, minimizing shadow effectserrors and performing 100% 2D&3D examinations simultaneouslyin all FOV areas.
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Product
Scanning Probe Microscopy/Atomic Force Microscopy (SPM/AFM Analysis)
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Rocky Mountain Laboratories, Inc.
Scanning probe microscopy (SPM) refers to a family of measurement techniques that utilize a scanning probe. The most common measurement is Atomic Force Microscopy (AFM Analysis), which measures surface topography. Imaged areas can be from the nm scale to as large as 100 µm X 100 µm. Heights and depths of features can be measuredand many surface roughness parameters, e.g Ra, can be calculated. 3-D images can also be produced for dramatic data presentation. Magnetic and electrical response can also be measured with SPM.
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Product
PDS Motionscan Software
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Allows a 3D Scanning sonar user to collect motion compensated 3D point clouds from a moving platformTeledyne PDS MotionScan system allows a 3D Scanning sonar user to collect motion compensated 3D point clouds from a moving platform. The MotionScan system is comprised of: an RTK capable dual antenna GPS with precision heading output, a heave, pitch and roll sensor, a topside control console. In combination with a BlueView 3D Multibeam Scanning Sonar this creates a full survey package.
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Product
Semiconductor Technology, Micro Scriber + Flatness, Bow, Warp, Curvature, Glass Thickness
FLATSCAN
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Optik Elektronik Gerätetechnik GmbH
Non contact automated 2D- or 3D measurement of warp, bow, slope and surface curvature with software module for calculation of thin film stress (wafer stress) of wafers and glass substrates.
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Product
Permanent Bonding Systems
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The introduction of EVG's wafer-bonding approach, which separates the bond alignment from the bonding step, immediately revolutionized the market. Utilizing high-contact forces under elevated temperatures and a controlled atmosphere, this novel approach is today's process standard, with EVG holding the dominant market share for both semi- and fully automated wafer bonders and a growing installed base of more than 1500 chambers. EVG's wafer bonders offer optimal total cost of ownership (TCO), as well as multiple design features to optimize bonding yield. Multiple modules for bond alignment are optimized for different market requirements in MEMS, 3D integration or advanced packaging. Industry-leading alignment accuracies of less than 100 nm and a high-volume-proven modular platform enables the combination of EVG’s wafer bonding technologies in various applications.
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Product
Mini Array+
DORC's ZX-1
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Direct Optical Research Company
Used primarily to measure multi fiber (MT/MPO and MT-RJ) connectors, DORC's fourth generation "ZX-1 mini Array+" is the result of 18 years of hardware and software product development. Although optimized for mutifiber connectors, the ZX-1 mini Array plus also does an excellent job of measuring single fiber PC and APC connectors. DORC's patented design is based on a variant of the Michelson configuration, and provides BOTH 2D and 3D high resolution images of the sample under test in approximately 45 seconds for multi fiber connectors and just 3-4 seconds for single fiber connectors - from the time the connector is inserted.
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Product
Software for Current & Water Quality Monitoring Data Analysis
DataStudio 3D
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Aanderaa, a Xylem brand, is a technology provider of oceanographic sensors, instruments and systems which are able to measure environmental parameters such as wave, current andwater quality (Dissolved Oxygen, Salinity, Temperature, Depth and Turbidity) over long deployments, several years.Data analysis is an important stage in all environmental monitoring campaigns. In many situations, users have to download and filter through large data quantities for analyses. DataStudio3D is a free data analysis software available to Aanderaa SeaGuard and SmartGuard users.To aid in data analysis, Aanderaa has developed their own propriety software, DataStudio3D which allows users to download field data and plot them on different graphical plots. This mode of data analysis can be carried out within minutes to help user to compare parameters, view trends, anomalies, and to control the data quality.
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Product
Atomic Force Microscope
3DM Serirs
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Park Systems has introduced the revolutionary Park 3DM Series, the completely automated AFM system designed for overhang profiles, high-resolution sidewall imaging, and critical angle measurements. With the patented decoupled XY and Z scanning system with tilted Z-scanner, it overcomes the challenges of the normal and flare tip methods in accurate sidewall analysis. In utilizing our True Non-Contact Mode™, the Park 3DM Series enables non-destructive measurement of soft photoresist surfaces with high aspect ratio tips.
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Product
Sapphire 3D Microscope
WDI-2000
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The Sapphire 3D Microscope: HS-WDI-2000 was designed with high quality lighting parts and a good optical system design,can get a very clear image.with the digital camera,it can provide the image in time, widely used in LED,Solar,SEMI…
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Product
3D Optical Profiler
Nexview™ NX2
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Designed for the most demanding applications, the Nexview™ NX2 3D optical profiler combines exceptional precision, advanced algorithms, application flexibility, and automation into a single package that represents ZYGO's most advanced Coherence Scanning Interferometric (CSI) profiler.
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Product
ARMS
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Is a 3D measuring arm, convenient in use whether for touch-probing or with the non-contact Kreon laser scanners.
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Product
SparkFun GPS-RTK Dead Reckoning Breakout
ZED-F9R (Qwiic)
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The SparkFun ZED-F9R GPS Breakout is a high precision, sensor fusion GPS board with equally impressive configuration options and takes advantage of u-blox's Automotive Dead Reckoning (ADR) technology. The ZED-F9R module provides a highly accurate and continuous position by fusing a 3D IMU sensor, wheel ticks, a vehicle dynamics model, correction data, and GNSS measurements.
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Product
Ultra High 4.18 (119.00) 11.70 (332.00) General Purpose Probe
EPA-3D-2
General Purpose Probe
Current Rating (Amps): 6Average Probe Resistance (mOhm): 35Test Center (mil): 125Test Center (mm): 3.18Full Travel (mil): 250Full Travel (mm): 6.35Recommended Travel (mil): 167Recommended Travel (mm): 4.24Mechanical Life (no of cyles): 2,000,000Overall Length (mil): 1,300Overall Length (mm): 33.02
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Product
Unified PLM Environment
3D Experience
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Design Rule Manufacturing Solutions
Combining the core applications from the Dassault Systèmes software brands, the 3DEXPERIENCE platform is a simple, unified PLM environment that enables businesses to reach operational excellence.
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Product
3D Profile Sensor
Z-Trak2
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Z-Trak™2 is a new family of 3D profile sensors built on Teledyne Imaging’s 3D image sensor technology, ushering in a new era of 5GigE 3D profile sensors for high-speed, in-line 3D applications.
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Product
PDS Slope Protection Software
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A number of special features are implemented in Teledyne PDS for underwater slope protection purposes.Guidance features are used to position a work vessel and monitor the laying of slope protection material. 3D images and 3D views display all movements of the vessel, crane, and the slope protection system.
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Product
Transformer Turn Ratio Instrument
ART-3D
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The ART-3D is high precision instrument designed to measure ratios, magnetization currents, phase-shifting in power transformers, distribution transformers, potential and current transformers, in conformity to IEEE C57.12.90 and CEI/IEC 60076.
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Product
High-Speed Digital Image Correlation System
Q-450
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The 3D High-Speed Image Correlation System Q-450 allows the full-field, non-contact and three-dimensional dynamic measurement of shape, displacements and strains on components and structures made from almost any material. Based on the digital image correlation technique, the Q-450 system is designed for full-field vibration analysis and high speed transient events. This makes it ideal for ballistics testing, fracture mechanics, shock excitations, the Hopkinson Bar test, or Impact Testing.
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Product
Quality Planning Environment Software
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Siemens Digital Industries Software
The Quality Planning Environment portfolio of software from Siemens PLM Software standardizes and automates these quality engineering process tasks by enabling the direct consumption of data directly from the 3D CAD model. Manual tasks are reduced or, in many cases, completely eliminated. Quality Planning Environment helps you transform commercial 3D CAD systems into specialized systems for managing the quality engineering process and the development of 3D model-based inspection plans.
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Product
Standard 1.60 (45.00) - 4.50 (128.00) General Purpose Probe
EPA-3D
General Purpose Probe
Current Rating (Amps): 6Average Probe Resistance (mOhm): 35Test Center (mil): 125Test Center (mm): 3.18Full Travel (mil): 250Full Travel (mm): 6.35Recommended Travel (mil): 167Recommended Travel (mm): 4.24Mechanical Life (no of cyles): 2,000,000Overall Length (mil): 1,300Overall Length (mm): 33.02
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Product
Solder Paste Inspection
3D SPI
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Checking all the relevant points in the production process is essential, especially in terms of analyzing the causes of defects, fixing them, and – most importantly – preventing them in the future. That’s why solder paste printing is of fundamental importance for manufacturing complex assemblies: If paste printing isn’t performed correctly, the defect can impact the subsequent assembly and the soldering process, resulting in a tilted component or a poor or missing solder joint.
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Product
COM Express Type 10 Mini Module With Intel® Pentium® & Celeron® N3000 Series Processors
CEM300
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The CEM300, a COM Express® Type 10 module, supports Intel® Pentium® N3710 and Celeron® N3160/N3060 quad-core/dual-core processors (codename: Braswell) with support for 4 GB DDR3L memory onboard. Integrated with Intel® Gen 8 graphics, the COM Express® Type 10 computer-on-module provides excellent graphic performance including support for DirectX 11.1, OpenGL 4.2, and 3D features and resolution up to 4K (3840 x 2160 @ 30 Hz). The ultra-small mini module comes with 4 to 6 watts low power consumption, and provides wide range voltage power input of 4.75V to 20V for harsh industrial environments. The Axiomtek CEM300 is ideal for IoT-connected industrial controls, medical imaging, retail equipment, MMK (Multi Media Kiosk), industrial gateway, automation and POS terminals related applications.
