3D
three dimensions.
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Bond Alignment Systems
With the invention of the world’s first double sided alignment system in 1985, EV Group has revolutionized MEMS technology and set worldwide industry standards in aligned wafer bonding by separating the alignment and bonding process. This process separation results in higher flexibility and universal application of the wafer bonding equipment. The EVG bond alignment systems offer highest precision, flexibility, ease of use and modular upgrade capability and have been qualified in numerous high throughput production environments. The precision of EVG bond aligners accommodates most demanding alignment processes in MEMS production and in emerging fields like 3D integration applications.
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WAFERMAP
WAFERMAP is an award winning software package used to collect, edit, analyze and visualize measured physical parameters on semiconductor wafers. WAFERMAP can import data files from various metrology tools such as ellipsometers, thickness gauges and four point probes. The imported data can then be visualized or printed as line scans, contour plots, 2D or 3D plots or as a histogram.
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Eyepiece-less Stereo Microscopes
Vision Engineering’s eyepiece-less stereo microscopes are better for users and for business. Their ergonomic design lets the operator sit back in a comfortable position, and the expanded pupil technology delivers an enhanced 3D view of the subject. The relaxed natural posture makes it easy and to work with tools and to manipulate the subject. Greater comfort and ease of use directly translate into greater productivity and quality.
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Video Signal Generator
NSPG-4500
MSPG-4500 is Video Signal Generator for testing Display device such as TV (3D), Monitor (Displayport), and ETC.
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BIM Consulting Services
Being Revit BIM outsourcing company, our consultants facilitate 3D Modeling (Architectural, Structural, and MEP), 4D BIM Construction Scheduling, 5D Cost Estimation, Clash Coordination, Scan/PDF/CAD to BIM Conversion, Shop drawing, Construction Documentation . Tejjy Integrated project delivery with Autodesk Revit software for Architecture, Structure, MEP workflow allows smooth execution through a quality assured BIM Management lifecycle.
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All-in-one Software Product
Merlic
MVTec MERLIC is an all-in-one software product for quickly building machine vision applications without any need for programming. MERLIC provides powerful tools to design and build complete machine vision applications with a graphical user interface, integrated PLC communication, and image acquisition based on industry standards. All standard machine vision tools such as calibration, measuring, counting, checking, reading, position determination, as well as 3D vision with height images are included in MVTec MERLIC.
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Semi-auto 4 Point Probe System for Solar Cell Substrate
RG-100PV
*Measurement system for thin film on substrate samples for multi-points measurement*Even pitch and random pitch for Max.1,000 points*2-D/3-D square mapping software for even pitch
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Solder Paste Inspection
3D SPI
Checking all the relevant points in the production process is essential, especially in terms of analyzing the causes of defects, fixing them, and – most importantly – preventing them in the future. That’s why solder paste printing is of fundamental importance for manufacturing complex assemblies: If paste printing isn’t performed correctly, the defect can impact the subsequent assembly and the soldering process, resulting in a tilted component or a poor or missing solder joint.
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Pin-Pointing System
Protrac®
BAUR Prüf- und Messtechnik GmbH
Fast and precise cable fault pin-pointing with protrac The BAUR protrac pin-pointing system is used for the precise pin-pointing ofcable and cable sheath faults. Combining acoustic and electromagnetic faultpin-pointing with sheath fault location in one system, it is ideal for universal application.* Unique operating convenience thanks to wireless Bluetooth® connections* Precise 3D user guidance to the fault* Excellent acoustic quality and range* Saves time thanks to use of cable route data and the pre-located fault position from the BAUR Fault Location App
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Universal Automated Programming System
4900
The 4900 is powered by the newest BPM 9th generation technology, which delivers the fastest programming speeds in the industry for MCU’s, eMMC HS400, NAND, NOR and Serial Flash devices. BPM 9th generation technology produces 200 MHz signals, allowing each byte of data to transfer in up to 2.5 ns. Up to 9 times faster than competing programmers. 3D Vision option inspects BGA, CSP, QFP, TSOP, SOIC and J-Lead devices for coplanarity, bent lead, pitch, width, diameter, standoff and XY errors.
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X6 Optical Fiber Fusion Splicer
Smart-connected APP, Splicing record management, Intelligent burglary-resisting system 1 sec. topspeed boot time, 6 sec. splicing time, 12 secs. Heating time. 3D protection cover reduce risk and unpredictability. Handy, lightweight, anti-dropping solid and durable.Hi-Speed USB connection internet remote control.
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Solder Paste Inspection System
KY8030-3
The new KY8030-3 delivers 3x fasterinspection without compromisingperformance and accuracy.Using patented dual projection,the system eliminates the criticalShadow problem that all 3D SPI systemscan be vulnerable to.Additionally, the new KY8030-3 has solvedthe PCB Warp problem that seriouslyimpacts inspection accuracyand reliability of result.
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Wafer Flatness Measurement System
FLA-200
*Measures Thickness, TTV, Bow, Warp and site and global Flatness (ASTM compliance)*Measures all materials including Si, GaAs, Ge, InP, SiC*Full 500 micron thickness measurement range without re-*calibration2-D /3-D Mapping software
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Electrical Tomography Software
Res3dinv
In areas with complex geology, there is no substitute for a fully 3D surveys. The arrays supported include Pole-Pole, Pole-Dipole, inline Dipole-Dipole, equatorial Dipole-Dipole, Wenner-Schlumberger and also non-conventional arrays.RES3DINV uses the smoothness-constrained least squared inversion technique to produce a 3D model of the subsurface starting from the data of apparent resistivity.
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ATD 3D Layout Machine
ATD Model is consisted of 2 main body and one cast iron surface plate for marking work and 3D measruing.
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AATCC Wrinkle Recovery Tester
M272
To determine a fabric's ability to recover after wrinkling under a predetermined load for a set period of time. Set of 3-D plastic replicas are available to grade fabrics.
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Solder Paste Inspection Machine
3D SPI
The 6500 series is the measurement equipment provided by Jiezhi Technology for the small pads of solder paste printed on the PCB board. It will cause defects such as sharpness, offset, more tin, and less tin printing during solder paste printing. Causes defects in the later stage of production, this equipment can find problems in advance
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Software Module for Analyzing Measured Data to any CAD Model
Verisurf Analysis
Simplifies part inspection through the comparison of measured points, clouds, and meshes, to all CAD file formats. Check part characteristics such as position and profile quickly and easily using a variety of alignment, analysis, and reporting techniques.Analyze to CAD with imported data sets or directly from measured points, clouds, or meshes from 3D measuring devices including portable probing and scanning systems and both manual and CNC CMMs to analyze part tolerance compliance.
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Unified PLM Environment
3D Experience
Design Rule Manufacturing Solutions
Combining the core applications from the Dassault Systèmes software brands, the 3DEXPERIENCE platform is a simple, unified PLM environment that enables businesses to reach operational excellence.
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3D Measuring Laser Microscope
LEXT OLS5000
The OLS5000 laser confocal microscope precisely measures shape and surface roughness at the submicron level. Data acquisition that's four times faster than our previous model delivers a significant boost to productivity. Measure samples that are up to 210 mm tall. Capture the shape of any surface. Total magnification: 54x - 17,280x
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PANELMAP
PANELMAP is a software package used to collect, edit, analyze and visualize measured physical parameters on rectangular semiconductor panels. PANELMAP can import data files from various metrology tools such as ellipsometers, thickness gauges and four point probes. The imported data can then be visualized or printed as line scans, contour plots, 2D or 3D plots or as a histogram.
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Video Signal Generator
MSPG-8100S
MSPG-8100S various standard signal. (HDMI, DISPLAYPORT, DVI, VGA, COMPONENT, CVBS, S-VIDEO, SCART) So, It is a fundamental equipment of develop display. (LCD TV, LED TV, Monitor, Project) MSPG-8100S designed supports 4Kx2K/60Hz resolution by HDMI/DISPLAY ports and it can test 3D and ARC(Audio Return Channel) function.
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3D SPI Series
MS-11e
- Exclusive15MP / 25MP CoaXPress Camera System- Dual Projection Shadow Free Moiré Technology- Precision Compound Telecentric Camera Lens- Automated Z-Height Calibration System- Automated PCB Under Board Support System- Precision PCB Warpage Compensation- Closed Loop Communication With Screen Printer- Absolute Repeatability and Reproducibility- INTELLISYS® Industry 4.0 Intelligent Factory Automation System
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Micro ATX Motherboard With LGA1151 Socket 7th/6th Gen Intel® Core™ Processor, Intel® Q170, USB 3.0, SATA 3.0, Dual LAN, VGA, DisplayPort, DVI-D, And HDMI
MMB501
The MMB501 is powered by the LGA1151 socket 7th/6th generation Intel® Core™ i7/i5/i3, Pentium® and Celeron® processors (formally codename: Kaby Lake/Skylake) with Intel® Q170 chipset. The MMB501 supports four high bandwidth 288-pin DDR4-2133/2400 with a memory capacity up to 64GB. The industrial-grade micro ATX motherboard is expandable with one PCIe x16 slot, two PCIe x4 slots, one PCI slot and one full-size PCI Express Mini Card slot. Moreover, the embedded board supports triple-display via DisplayPort, HDMI, DVI-D and VGA interfaces. Furthermore, this outstanding multi-function embedded motherboard is integrated with the Intel® HD Graphics 530/510 to deliver stunning UHD 4K resolution and fast 3-D and video playback for graphics-intensive applications. To meet the distinct needs from users, there are six SATA-600 with RAID 0/1/5/10, six USB 3.0, five USB 2.0, four RS-232 ports, two RS-232/422/485 ports, one DisplayPort, one DVI-D, one HDMI and one VGA, as well as has two Gigabit Ethernet ports with Intel® i219LM and Intel® i211AT controllers. To ensure stable and reliable operation, the high-performance Intel® Core™-based industrial micro ATX motherboard supports a watchdog timer and hardware monitoring features. Furthermore, this new embedded board runs well with Windows® 7, and Windows® 10 operating systems.
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3D Software
Along with manufacturing professional 3D scanners, Artec develops smart 3D scanning software. Meticulously designed to meet the needs of both new and experienced users alike, it is the best choice for any application.
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Open-source CAD tool to simulate 2D and 3D-ICs.
IntSim v2.0
Simulate and optimize 2D and 3D-ICs. Pre-silicon estimates for die size, number of metal levels, size of each metal level and chip power.
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3D Optical Microscopy
Bruker is the worldwide leader in 3D surface measurement and inspection, offering fast, non-contact analyses for samples ranging in size from microscopic MEMS to entire engine blocks. Our microscopes are the culmination of ten generations of proprietary Wyko® Technology advances that provide the high sensitivity and stability necessary for precision 3D surface measurements in applications and environments that are challenging for other metrology systems.
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Functional Fixtures
Joule''s strength is in the design and manufacture of functional test fixtures. Using 3D modeling software to create the fixtures allows us to actuate pneumatics, open and close overclamps, actuate side access units - all before a single part has been machined for the fixture.
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Portable gear inspection- and 3D-measuring systems
ultimate independent measurement - on the production machine or on the shop-floor without rotary table
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Smart Factory Inspection System
API, recognizing manufacturing industry’s increasing demand for part measurement automation, with a higher degree of accuracy, has developed its Smart Factory Inspection System with true 6 Degrees of Freedom (6DoF) real-time 3D robotic measurement incorporating its proven metrology technology and calibration components.SFIS can be delivered as a customized integrated solution or as a standard production inspection cell.
