Discrete Semiconductor Testers
check connected individual semiconductor components.
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Product
Semiconductor Laser
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Fibre coupling semiconductor laser. The product range of wavelengths is 450nm~1550nm. The product range of power is 2mW~300W. A Variety of package coupling form,can be integrated indicator light,a photoelectric detector, a semiconductor refrigerator, optical switch function. Solution of flexible and diverse, providing customized service sub system.
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Product
Semiconductor
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Scientific Computing International
Materials which have a conductivity between conductors (generally metals) and nonconductors or insulators
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Product
Semiconductor
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PackageFunctionSMV(2.9mm*2.8mm)AND GateUSV(2.0mm*2.1mm)NAND GateFM8(5.0mm*4.5mm)NOR GateSM8(2.9mm*4.0mm)OR GateUS8(2.0mm*3.1mm)INVERTER
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Product
Semiconductor Inspection (SEMI)
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A process for detecting any particles or defects in a wafer.
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Product
Semiconductor ATE Systems
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Our testers allow for the high-volume production of electronics that touch people’s lives in communication, safety, entertainment, and much more.
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Product
ABex PXI to Analog Bus Bridge with Digital IOs
ABex AM-300 Controller
BUS Tester
The ABex system controller ABex AM-300 is required to control the analog bus of a ABex chassis. It is used as an interconnection bridge between PXI and ABex backplane.In addition it features a whole bunch of additional functionality. Despite the 96 open drain outputs it has galvanically isolated IOs, and communication interfaces.
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Product
Semiconductor Curve Tracer
CS-5000 Series
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*Max. Peak Voltage : 5,000V(HV mode)*Max. Peak Current : 1,500A(HC mode)*Equipped all models with LEAKAGE mode (Cursor resolution 1pA)*USB port for display hardcopy, waveform data (CSV format) and measurement setup SAVE/RECALL*LAN interface for Remote Control
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Product
Semiconductor Test Software
Test System
Easily create and run robust test programs in semiconductor automated test systems with ActivATE™ test management software. Designed by test engineers for test engineers, ActivATE™ tames automated test complexities with elegant simplicity.
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Product
Semiconductor Technology, Micro Scriber
Precision Micro Diamond Scriber MR200
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Optik Elektronik Gerätetechnik GmbH
Precision micro diamond scriber MR 200 for exact manual scribing for defined cutting of structured silicon wafers.
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Smartchem Discrete Analyzers
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Fully automated, multi-parameter, direct read discrete analyzers, available in bench-top or floor-stand models, for simple and automated chemistries. Up to 200 samples and up to 600 tests/hour.
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Product
Semiconductor Test
Ismeca NY20
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20-position turret platform for semiconductor test, inspection and packaging, provides the highest quality yield and throughput. It integrates innovative hardware and software technology such as Intelligent Features that enable extended autonomous operation and productivity.
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Product
PXI Semiconductor/IC Test System
Test System
A high-density 100MHz PXIe digital IO card designed for characterizing, validating, and testing a variety of digital and mixed-signal ICs. Each IO card consists of a Sequencer Pattern Generator (SQPG) and 32 channels of full ATE-like features. The 33010 IO card is expandable up to 256 channels. Some unique features of the 33010 include an on-board SQPG, per pin timing/levels/ PMU/TFMU, multiple time domains, and multithreaded testing for complex IC testing. Each channel is also equipped with 64M vector memory, 16 timing sets with on-the-fly timing change, and per pin timing and frequency measurements up to 400 MHz.
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Product
Semiconductor
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You can find Spring probes used for test process for production of semiconductor here. Spring probe is probe with spring inside and is also called Double-ended probe and Contact probe. It is assembled in IC socket and becomes electronic path, which vertically connects Semiconductor and PCB. By our excellent machining technique, we can provide spring probe with low contact resistance and long life. “MARATHON” series is our standard lineup of spring probe for testing semiconductor.
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Power Discretes
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Our power discrete products are high-quality solutions for a wide range of high-voltage and high-power applications. They include a variety of high-voltage Switch Mode Power Supply (SMPS) transistors—Insulated-Gate Bipolar Transistors (IGBTs) Silicon Carbide (SiC) MOSFETs and Silicon MOSFETs—Diodes and Radio Frequency (RF) MOSFETs. Many of our products are offered in single- and combi-packaged options across a variety of voltage ratings, currents, and package styles.
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Product
Semiconductor
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Engineered ceramics are used in the semiconductor industry because of their excellent material properties. Ultra-pure ceramics are often used in the whole cycle of semiconductor manufacturing including Semiconductor Wafer & Wafer Processing, Semiconductor Fabrication (Front End), and Semiconductor Packaging (Back End).
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Product
Discrete Input Event Recorder
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Wabtec M Series Recorders provide a compact recording solution for discrete electrical and pneumatic signals and provide compliance to FRA Crash Hardening requirements.
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Product
Semiconductor Wafer Microscope Inspection System
MicroINSPECT
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MicroINSPECT Semiconductor Wafer Defect Microscope Inspection System combines state-of-the-art robotics, intelligent microscopes and SITEview software to provide a flexible, easy-to-operate defect inspection platform for either micro or macro defect wafer inspection.
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Semiconductor Test
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Smiths Interconnect’s test socket and probe card solutions utilize IDI contact technology to ensure superior quality and reliability in semiconductor test applications. Our best-in-class engineering, development and technical expertise ensure support of automated, system level and development test platforms.
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Product
Hi-Speed Discrete Test System
QT-6000
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QT-6000 Test System, with built-in capacitance test (DC+CAP) and Scanbox etc, is applicable to devices like medium & small power transistors, MOS-FET, diodes and Wafer.
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Product
Semiconductor
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Semiconductor technology requirements often outpace the test coverage that traditional ATE provides for analog, mixed-signal, and RF test. Semiconductor test engineers need smarter solutions that address cost, scalability, design, and device challenges.
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Semiconductor Testing
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Teradyne’s semiconductor test portfolio is transforming the way you test chipsets for automotive, industrial, communications, consumer, smartphones, and computer and electronic game applications. Semiconductor devices span a broad range of functionality, from very simple low-cost devices such as appliance microcontrollers, operational amplifiers or voltage regulators to complex digital signal processors and microprocessors as well as memory devices.
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Product
Discrete C-Size Switch Cards
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Compatible for use on VXI platforms, these switch products were formerly sold under the Racal Instruments brand name.
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Product
Semiconductor Testing
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The integrated PXI platform and the open interfacing provides extension capabilities for additional testing requirements like DUT specific resistors-networks or temperature sensors. The Test System comes with the ready-to-run GTSoftware package and allows easy programming of test sequences (GTbuilder) and fast execution in production/test mode (GTengine).
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Product
Discrete Module for Multi Protocol 4000 Boards
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Discrete Module for Multi Protocol 4000 BoardsThe M4KDiscrete is an interface module for the multimode, multiprotocol Excalibur EXC-4000 family of carrier boards. The M4KDiscrete provides a complete solution for developing and testing discrete voltage-level interfaces.The module contains control I/O registers that may be accessed in real time. The module supports 20 discretes. The user can set each discrete:• Either as input or output.• Either to TTL (0 – 5V) or Avionics (0 – 32V) voltage levels and• Either enable or disable external debounceOutput discretes are open collector, capable of handling up to 32V with a maximum current of 100 mA each. There is a 4092 word FIFO, capable of storing 1023 Discrete entries containing the discrete data and Time tags.
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Product
Manual Semiconductor Metrology System
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Front USB port enables easy storage of measurements and other data to flash drivesMTI Instruments’ Proprietary Capacitance Circuitry for Outstanding Accuracy and DependabilityNon-contact measurements76-300 mm diameter wafer rangeOptional wafer measurement ringsWafer stops for exact centeringEthernet interfaceFull remote control software (Windows compatible)Optional calibration wafers
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Product
Protective Cover, 9050, VXI and Discrete Wiring, Receiver
310113285
Protective Cover
When the Receiver is not in use, the Protective Cover is used to protect the modules and contacts. The Protective Cover is made up of black anodized aluminum.
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Product
RTM Discrete Signal Conditioning Board
MS 3632I
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CPCI Rear IO Discrete Signal Conditioning Board is a signal conditioning and interface board for CPCI based Advance Compute & IO Module (MS3639i). This board primarily focusing on signal conditioning of TTL/CMOS DIO levels to required type of discrete input and output interface. Digital IO from ACIO board to discrete IO at Rear IO interface. Board takes 144 DIO from ACIO and does Open/Ground, 28V/Open, 28V/Ground configuration. In addition it shall generate additional 32 discrete input / output signals with signal conditioning and all IO interfaces are brought to two 96 Pin Euro Connector.
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Semiconductor
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The semiconductor industry faces continuous pressure to reduce device size and costs while improving performance and reliability. Semiconductor, test and assembly automation manufacturers demand the same improvements from the motion technology which drives it. Haydon Kerk Pittman continues to develop new technologies in motors, lead-screws, gears, encoders, actuators, slides, drives and complete sub-systems that increase operational speeds and accuracy while lowering the cost of ownership.
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Product
32-CH Discrete Input Modules with U Profile
HSL-DI32-UD
Digital Input Module
HSL U series is designed as compact & horizontal-placed slave module. For I/O module, ADLINK adopts three types of connectors to meet different users' requirements & habits. Compared with past models, U series brings compact size, easier-to-wire and cost-effective advantages for users. DI/O, AI/O and motion control module are supported
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Semiconductor Packaging System
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Inspects the quality of finished cells by measuring the gap between the battery electrode laminate and aluminum can.





























