Single Board Computers
Whole computer on one PCB.
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Product
Computer-On-Module
ETX®
Computer on Module
ETX is one of the earliest successful computer-on-module form factors. Today it is still widely used in applications such as industrial automation, transportation and medium and low level medical appliances. While high-end Intel® Core™ applications have mostly migrated to COM Express, ETX is still very much alive in the lower power segment, mostly notably using Intel Atom® SoCs.
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Product
PC/104-based Analog Input, Analog Output, and Digital I/O Board
PCM-MIO-A-1
Digital I/O Board
The PCM-MIO-A-1 is a versatile, PC/104-based analog input, analog output, and digital I/O board designed for high-accuracy and high-channel-count analog and digital I/O. The board is based upon Linear Technology’s precision converters and voltage references which require no external calibration. The digital I/O utilizes WINSYSTEMS’ versatile WS16C48 Universal I/O controller functionality, also available on many of our SBCs and other I/O products.
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Product
COM Express Basic Size Type 7 Module with Intel Atom® C3000 SoC
Express-DN7
Computer on Module
The Express-DN7 is a COM Express® COM.0 R3.0 Basic Size Type 7 module supporting the 64-bit Intel Atom® C3000 processor (formerly “Denverton-NS”) system-on-chip (SoC). 16 CPU cores with 31W TDP and integrated 10G Ethernet make the Express-DN7 especially suited for customers who need excellent computing performance with low power consumption, such as edge computing applications, in a long product life solution.
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Product
SMARC Short Size Module, Intel® Atom® X7000 Series (Amston Lake) Processors
LEC-ASL
Computer on Module
The ADLINK LEC-ASL is a SMARC module that supports 2/4/8 cores Intel® Atom® x7000RE (x7211RE, x7213RE, x7433RE, x7835RE) and x7000C (x7203C, x7405C, x7809C) Processors (formerly Amston Lake) with integrated Intel® UHD graphics and high-speed interfaces. LEC-ASL modules support up 16GB LPDDR5 memory, up to 256GB eMMC storage (build option) and are also available with rugged operating temperature range and low power envelope, making them a perfect match for mission critical fanless edge computing applications that run 24/7.
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Product
Carrier Boards
ROM-DB7501
Carrier Board
ROM-DB7501 is an Referenced Carrier Board designed for Advantech's RISC Qseven 2.0 module. It i provides a thorough environment for module board evaluation with its completefunction support. It also supports 12V power input through AC/DC power adapter and with smart battery design, it's more easier for the end user to design portable devices by referring ROM-DB7501 design.
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Product
34945A Distribution Board, With Generic Screw Terminals For Driving 16 Switch Coils
Y1155A
Distribution Board
The Y1150A-Y1155A distribution boards enable simple connections to the external switches. The distribution boards plug onto the 34945EXT and are used to route the power and control signals from the driver module to the switches using standard cables.
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Product
4x 3U OpenVPX MOSA Mission Computer
SIU34-MCVARM-01
Mission Computer
SIU34-MCVARM-01 is a Modular Open Systems Approach (MOSA) DO-178C & DO-254 Certifiable Mission Computers (MC) with low power high performance OpenVPX Xilinx UltraScale+ SBC with Quad Core ARM Cortex -A53, 8 GB DDR4 SDRAM, 32 GB SATA Flash, 2 x 10/100/1000Base-T Ethernet, USB 3.0, FIPS-140-3 Level 3 Cyber Security, and Single Event Upset support.
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Product
Value Family 9th Generation Intel® Core™ i7/i5/i3 & 8th Gen Celeron® Processor-Based Embedded Fanless Computer
MVP-5100 Series
Industrial Computer
ADLINK MVP-5100 Series of fanless embedded computing platforms, incorporating the 9th Generation Intel® Core™ processor, is optimized for edge computing applications. The MVP-5100 Series consolidates high performance computing, scalable function and I/lO enhancements, and industrial-grade reliability onto a compact fanless platform, providing reliable long-time operation for performance-critical applications in industrial automation, logistics, transportation, and smart city segments.
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Product
COM Express Compact Size Type 6 Module with Mobile 7th Gen Intel® Core™ and Celeron® Processors (formerly codename: Kaby Lake)
cExpress-KL
Computer on Module
The cExpress-KL is a COM ExpressR COM.0 R2.1 Type 6 Compact size module featuring the 64-bit 7th Generation Intel® Core™ i7/i5/i3 and IntelR CeleronR Ultra-Low TDP processors (formerly "Kaby Lake U") with CPU, memory controller, graphics processor and I/O hub on a single chip.
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Product
Digital Input Board
VME-1182A
Digital Input Board
A multifunctional intelligent controller allows COS, SOE, pulse accumulation, debounce times and time tagging control on a per-channel basis.
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Product
Printed Circuit Board
RISER-PPM-1
Printed Circuit Board
WINSYSTEMS’ RISER-PPM-1 boards are designed to provide extra space in a PC/104-Plusstack. They are printed circuit boards (PCBs) with PCI-104 mounting holes and bus connectors. They allow a board with either tall components or heat sinks to be placed in a stack of boards in a location other than only at the top. The additional separation is 0.60 inches using standard PC/104-type spacers.
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Product
COM Express Compact Size Type 6 Module with Intel Pentium, Celeron N3000 Series and Atom x5 E8000 SoC (formerly codename: Braswell)
cExpress-BW
Computer on Module
ADLINK cExpress-BW provides two DDI channels (with up to 4K resolution) and one eDP or DDI3 channel supporting three independent displays, enabling it to drive multiple HD screens without the need for a discrete graphics card. In addition, LVDS is optionally available to support next generation displays. The cExpress-BW offers up to five PCI Express lanes x1. A wide range of operating systems are supported, including Linux, Windows 7 and 8.1u, Windows Embedded Standard 7, Windows Embedded Industry 8.1 and VxWorks.
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Product
Printed Circuit Board
RISER-PCM-1
Printed Circuit Board
WINSYSTEMS’ RISER-PCM-1 boards are designed to provide extra space in a PC/104 stack. They are printed circuit boards (PCBs) with PC/104 mounting holes and bus connectors. They allow a board with either tall components or heat sinks to be placed in a stack of boards in a location other than only at the top. The additional separation is 0.60 inches using standard PC/104-type spacers.
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Product
3 Function Slot MOSA Nano Aircraft Interface Computer (AIC)
NIU3A-AIC-01
Aircraft Interface Computer
NIU3A-AIC-01 is a Modular Open Systems Approach (MOSA) Aircraft Interface Computer with low power high performance ARM Cortex -A53 processing. 8 GB RAM, 32 GB SATA Flash, 2 x 10/100/1000Base-T Ethernet.
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Product
SMARC 2.1 Reference Carrier Board with M.2 Extension
I-Pi SMARC Plus
Carrier Board
The I-Pi SMARC Plus is small (110mm x 110mm) SMARC reference carrier board based on SGeT SMARC (Smart Mobility ARChitecture) 2.1 hardware specification. Together with the SMARC short size module of your choice and off the shelf add-on cards, you can quickly emulate the functionality of your desired end product for software development and hardware verification.
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Product
Carrier Boards
ROM-DB7503
Carrier Board
ROM-DB7503 is the Referenced Carrier Board designed for Advantech's Qseven 2.1 module. It i provides a thorough environment for module board evaluation with its completefunction support. it's more easier for the end user to design portable devices by referring ROM-DB7503 design.
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Product
14-slot PICMG 1.3 Bus Passive Backplane
FAB101
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The FAB101 features one CPU card slot and thirteen 32bit/33MHz PCI slots, and built in a 24-pin ATX power connector and 8-pin connector for thermal detected board. Furthermore, the FAB101 delivers outstanding system performance through high-bandwidth interfaces such as Serial ATA and USB 2.0 high speed peripheral (optional function). It is designed for all of PICMG 1.3 single board computers, and is a perfect fit for AXIOMTEK's SHB100 & SHB110, which are built around the PICMG 1.3 form factor. We also have various 4U-high enclosures, AX6156E, AX6156LE, AX6156LLE, AX6156LLES, AX61400, AX61491, and AX6145, to house the FAB101 and any customer's industrial integrations flexibly.
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Product
SMARC® 2.1 Short Size Module With Intel® Core™ I3 Processors, Intel® Processors N Series And Intel® 7th Gen Atom® X7000E Processors
LEC-ALN
Computer on Module
The ADLINK LEC-ALN is a SMARC module that supports up to 8 cores Intel® Core™ i3 (i3-N305, i3-N300) Processors, Intel® Processors N Series (N97, N50) and Intel® Atom® x7000E (x7425E, x7213E, x7211E) Processors (formerly Alder Lake-N) with integrated Intel® UHD graphics and high-speed interfaces. LEC-ALN modules support up 16GB LPDDR5 memory, up to 256GB eMMC storage (build option) and are also available with rugged operating temperature range and low power envelope, making them a perfect match for mission critical fanless edge computing applications that require safety and reliability at all times.
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Product
3U CompactPCI Serial MXM GPU Carrier Card
cPCI-A3MXM
Carrier Board
- Follow PICMG® CompactPCI® Serial design guide- CompactPCI® Serial, 3U 4HP/8HP (100mm x 160mm)- Compatible with MXM Type A (82 mm x 70 mm) or Type B (82 mm x 105 mm)- Support NVIDIA A1000 with 2048 CUDA® cores, 16 RT Cores and 64 Tensor Cores or NVIDIA RTX™ A4500 with 5888 CUDA® cores, 46 RT Cores and 184 Tensor Cores- 4x DisplayPort 1.4, support 4K (3840x2160) resolution- Operating temperature: -40°C to +70°C- Designed to meet EN50155 standards
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Product
COM-HPC Server Type Modules
Computer on Module
The COM-HPC specification currently defines two server modules. The largest of the server modules, Size E (200mm x 160mm), offers up to eight on-board DIMM sockets. The power input is a single 12-volt supply that can deliver up to 358 watts of power, and there are 64x lanes PCIe Gen5 in total.
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Product
PC/104-Plus SBC with Intel E3800 CPU
ARIES
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The Aries PC/104-Plus single board computer from Diamond Systems uses the Intel “Bay Trail” E3800 series processor to deliver an unmatched combination of performance, price and power consumption. Packed with real-world features, Aries provides a complete solution for most embedded applications in a single board, saving you space, time, and money.
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Product
Value Family 9th Gen Intel® Core™ i7/i5/i3® Processor-Based Embedded GPU/AI Platforms
MVP-5100-MXM Series
Industrial Computer
- 9th Gen Intel® Core™ i7/i5/i3 LGA processor- Dual SODIMMs sockets for up to 32GB DDR4- Abundant I/O: Up to 4x additional DP 1.4 from MXM, 2x DP++, DVI, VGA, 3x GbE, 3x COM, TPM2.0- 3x USB 3.1 Gen 1, 3x USB 2.0- Rich storage options: 2x 2.5" SATA, M.2 2280
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Product
COM Express Rev. 3.1 Basic Size Type 6 Module with 13th Gen Intel® Core™ Mobile Processor
Express-RLP
Computer on Module
ADLINK’s Express-RLP COM Express Type 6 Basic size module is based on 13th Gen Intel® Core™ mobile processor (formerly codenamed Raptor Lake-P) and is the first COM Express utilizing Intel’s advanced hybrid architecture (with up to 6 Performance-cores and 8 Efficient-cores) offered with industrial-grade/real-time option to provide superior performance for edge IoT innovations across varied power ranges — at 15W/28W/45W TDP.
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Product
COM Express Compact Size Type 6 Module with 11th Gen Intel® Core™ and Celeron® Processors (formerly codename: Tiger Lake-UP3)
cExpress-TL
Computer on Module
ADLINK cExpress-TL,based on the 11th Gen Intel® Core™ i7/i5/i3 and Celeron™ processor, is the first COM Express module to support PCI Express Gen 4 at 16 GT/s, effectively doubling the bandwidth of previous generations. Additionally if features support for 2.5GbE Ethernet, leveraging existing Cat5e cable infrastructure being used for 1GbE Ethernet, it supports four USB 3.2 ports with transfer rates up to 10Gb/s. The modules have a configurable power range of 15 to 28 watts, which suits them for fanless space-constrained embedded applications. Typical industries in need of such high-performance/low-power characteristics are transport, medical, industrial automation and control, edge controllers, robotics and multi-camera-based AI. cExpress-TL features the Intel® Iris® Xe, a new graphics core, and supporting AVX-512 Vector Neural Net Instructions (VNNI) can significantly improve the number of elements processed per cycle, providing AI inferencing performance that is up to 3x that of previously available from non-VNNI platforms. Intel® Iris® Xe provides 96 execution units and is able to be configured to support two 8K independent displays or four 4K independent display (HDMI/DP/eDP). Additional support includes In-Band ECC (IBECC), providing ECC level error correction on DDR4 SODIMM memories for mission critical or rugged applications.
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Product
High-Performance 6th Generation Intel® Core™ i7/i5/i3 Processor-Based Fanless Embedded Computer
MXC-6400 Series
Industrial Computer
The Matrix MXC-6400 series is a line of high-performance fanless embedded computers, integrating 6th generation Intel® Core™ i7/i5/i3 processors and the QM170 chipset for more powerful computing and graphics performance with minimal power consumption.
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Product
COM Express Basic Size Type 6 Module with 11th Gen Intel® Core™, Intel® Xeon® and Intel® Celeron® Processors
Express-TL
Computer on Module
ADLINK’s Express-TL COM Express Type 6 Basic size module is based on the 11th Gen Intel® Core™, Xeon® W and Celeron® 6000 processor, and is the first COM Express module to support PCI Express x16 Gen4, effectively doubling the bandwidth of previous generation COM Express modules. With a combined 8 cores, 16 threads, and up to 128GB memory, the Express-TL brings uncompromised system performance and responsiveness to your solution. Featuring brand new Gen 12 Intel® UHD Graphics and Intel® AVX-512 Vector Neural Network Instructions (VNNI), the Express-TL provides AI inferencing performance as much as 3X higher compared to previous generation non-VNNI platforms. The integrated Gen 12 Intel® UHD Graphics core can be configured to support one 8K independent display or four 4K independent displays (HDMI/DP/eDP). In addition, legacy display interfaces such as LVDS and analog VGA are still supported as build options. Key features for today’s applications are support for 2.5 GbE and USB 3.2 with transfer rates of up to 10Gb/s that can transfer image data from cameras faster than previous generation products. Combined with 8 processor cores at 25W TDP, Intel® AVX-512 VNNI, Intel® OpenVINO™ toolkit and Intel® UHD Graphics, the Express-TL is well suited for AI at the edge applications (AIoT/IoT).
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Product
96-Channel Digital I/O Plug-In
1260-114
Digital I/O Board
The high channel count of the digital I/O plug-ins allows a significant portion of digital I/O to be realized in a single slot of the Adapt-a-Switch™ carrier, saving valuable VXIbus chassis space. The 1260- 114 provides 96 digital I/O channels in twelve groups of eight bits each.
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Product
50-Pin D-Type Breakout Female DIN mount
40-967-050-F
Breakout Board
This termination option is capable of accepting heavy duty connection wires and uses rising clamp screw terminals to minimize the danger of copper strand damage. Users should care take to protect the termination, provide a suitable method of restraining the cables, and ensure appropriate electrical safety precautions are observed.
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Product
Medical Box PC With IEC 60601-Compliant NVIDIA IGX Platform
MLB-IGX
Industrial Computer
- GPU: 2,048-core NVIDIA Ampere architecture with 64 Tensor Cores- CPU: 12-core Arm® Cortex®-A78AE v8.2- Up to 1,705 trillion operations per second of AI performance- NVIDIA® ConnectX®-7 smart network interface card (SmartNIC)- Ten years of NVIDIA® hardware and software support
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Product
34945EXT Distribution Board, For Two 87222, L7222C Transfer Switches And Six N181x SPDT Switches
Y1154A
Distribution Board
The Y1150A-Y1155A distribution boards enable simple connections to the external switches. The distribution boards plug onto the 34945EXT and are used to route the power and control signals from the driver module to the switches using standard cables.
