Single Board Computers
Whole computer on one PCB.
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Configurable 3U CPCI Multifunction I/O Boards
Optimized to deliver unusually high-function density, high resolution / accuracy and low power consumption for rugged defense, commercial aerospace, and industrial applications, NAI’s intelligent 3U CompactPCI cards can often operate as standalone systems, eliminating the need for a Single Board Computer (SBC), operating system and associated software royalty costs.
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PC/104 Single Board Computer with Vortex86DX3 System-on-Chip
CM1-86DX3
The CoreModule CM1-86DX3 is a PC/104 board with DMP Vortex86-DX3 single chip solution and has a very good performance to power ratio. The board comprises all peripherals needed for an embedded PC on a small 3.775" by 4.050" printed circuit board. The CM1-86DX3 integrates a powerful yet efficient DMP Vortex86DX3 with graphic controller and audio controller together with an additional GBit Ethernet controller to form a complete PC, with all the standard peripherals already onboard. Two Ethernet ports (1x GBit and 1x 100MBit), four RS232/RS422/RS485 serial ports, two USB 2.0 host controller to handle the communication with external devices. There are PS/2 connectors for keyboard and mouse. A first generation SATA interface allows the connection of hard disk or CD drive. CFast is also available. System expansion can easily be realized over the PC/104 bus connectors.
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Medical Box PC With IEC 60601-Compliant NVIDIA IGX Platform
MLB-IGX
- GPU: 2,048-core NVIDIA Ampere architecture with 64 Tensor Cores- CPU: 12-core Arm® Cortex®-A78AE v8.2- Up to 1,705 trillion operations per second of AI performance- NVIDIA® ConnectX®-7 smart network interface card (SmartNIC)- Ten years of NVIDIA® hardware and software support
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Qseven® Reference Carrier Board
Q7-BASE
Qseven is a Computer-on-Module (COM) standard for small sized and highly integrated systems adopted by SGET. The Qseven concept is an off-the-shelf, multi-vendor, Computer-on-Module that integrates all the core components of a common PC and is mounted onto an application specific carrier board. Qseven modules have a standardized form factor of 70 mm x 70 mm or 40 mm x 70 mm and have specified pinouts based on the high-speed MXM connector, regardless of the vendor. The Qseven module provides the functional requirements for an embedded application, which include, but are not limited to, graphics, audio, mass storage, network and multiple USB ports. A single ruggedized 230 pin MXM connector provides the carrier board interface to carry all the I/O signals to and from the Qseven module. This MXM connector is a well-known and proven high-speed signal interface connector that is commonly used for -PCI Express graphics cards in notebooks.
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4x 3U OpenVPX MOSA Mission Computer
SIU34-MCVARM-01
SIU34-MCVARM-01 is a Modular Open Systems Approach (MOSA) DO-178C & DO-254 Certifiable Mission Computers (MC) with low power high performance OpenVPX Xilinx UltraScale+ SBC with Quad Core ARM Cortex -A53, 8 GB DDR4 SDRAM, 32 GB SATA Flash, 2 x 10/100/1000Base-T Ethernet, USB 3.0, FIPS-140-3 Level 3 Cyber Security, and Single Event Upset support.
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COM Express Compact Size Type 6 Module with Mobile 7th Gen Intel® Core™ and Celeron® Processors (formerly codename: Kaby Lake)
cExpress-KL
The cExpress-KL is a COM ExpressR COM.0 R2.1 Type 6 Compact size module featuring the 64-bit 7th Generation Intel® Core™ i7/i5/i3 and IntelR CeleronR Ultra-Low TDP processors (formerly "Kaby Lake U") with CPU, memory controller, graphics processor and I/O hub on a single chip.
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SMARC Short Size Module with Intel® 6th Gen. Atom® x6000 Processors (formerly codename: Elkhart Lake)
LEC-EL
The ADLINK LEC-EL is a SMARC module that supports Intel Atom® x6000 (x6425E, x6413E, x6211E, x6200FE, x6425RE) processors (formerly Elkhart Lake) with integrated Intel® UHD graphics and high speed interfaces. LEC-EL modules support up 8GB LPDDR4 memory, and are also available with rugged operating temperature range and low power envelope, making them a perfect match for mission critical fanless edge computing applications that require safety and reliability at all times.
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SMARC® Short Size Module with Intel Atom® E3900 Series, Pentium™ N4200 or Celeron™ N3350 Processor (codename: Apollo Lake)
LEC-AL
The LEC-AL Computer-On-Module (COM) combines the SMARC® 2.0 standard with the latest Intel Atom® E-Series and Pentium® and Celeron® N-series System-on-Chips (SoCs), providing ideal solutions for low power consumption and high performance requirements. The module provides the high integration, high performance, low power, and ruggedness favored by Internet- of-Things (IoT) applications such as retail transactional clients, digital signage, and in-vehicle infotainment systems. The LEC-AL module utilizes the latest Intel E-series and N-series SoCs, which are based on the Intel 64 Architecture, the new HD Graphics 500/505 engine, and a faster, 4-vector image processing unit. The SoCs are manufactured on Intel's industry-leading, tri-gate 14nm process, improving system performance by supporting more than 4 GB of both virtual and physical memory.
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PICMG® 1.3 Full-Size 6th generation Intel® Core™ i7/i5/i3 LGA1151 Processor-based SHB (Code name: Skylake)
NuPRO-E43
The ADLINK PICMG 1.3 SHB, the NuPRO-E43, supporting the 6th Gen IntelR Core i7/i5/i3 processor and equipped with the IntelR Q170 Express chipset. The NuPRO-E43 supports high-speed transfer interfaces such as PCIe3.0, USB 3.0, and SATA 6 Gb/s (SATA III), with dual-channel DDR4 2133 MHz memory up to 32 GB.
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NI-9485 , 8-Channel, SSR Relay, 60 VDC/30 Vrms, 750 mA C Series Relay Output Module
779600-01
The NI-9485 allows for direct connection to a wide array of industrial devices such as motors, actuators, and DC devices. Each channel provides access to a solid state relay (SSR) for switching voltages up to 60 VDC/30 Vrms with switching current up to 750 mA per channel or up to 1.2 A on four channels. Each channel also features channel-to-channel isolation.
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COM Express® Basic Size Type 2 Module with 6th Gen Intel Core™, Intel Xeon® and Intel Celeron® Processors (formerly codename: Sky Lake-H)
Express-SL2
ADLINK announces a new COM Express Type 2 Computer-on-Module, based on the highly popular Intel® Core processors (formerly codenamed Skylake and Kaby Lake). The Express-SL2/KL2 supports all type 2 related legacy I/O and thereby allows customers to extend the production life of existing type 2 based systems for at least another 10 years.
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COM Express Compact Size Type 6 Module with Intel Pentium, Celeron N3000 Series and Atom x5 E8000 SoC (formerly codename: Braswell)
cExpress-BW
ADLINK cExpress-BW provides two DDI channels (with up to 4K resolution) and one eDP or DDI3 channel supporting three independent displays, enabling it to drive multiple HD screens without the need for a discrete graphics card. In addition, LVDS is optionally available to support next generation displays. The cExpress-BW offers up to five PCI Express lanes x1. A wide range of operating systems are supported, including Linux, Windows 7 and 8.1u, Windows Embedded Standard 7, Windows Embedded Industry 8.1 and VxWorks.
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Medical Computer Equipped With MXM Graphics Module Supporting NVIDIA Quadro® GPU With 8th/9th Generation Intel® Core™ I7/i5/i3 In LGA1151 Socket. Compliant With IEC 60601-1/IEC 60601-1-2
MLB-3002
- 2x PCIe Gen3 x4 expansion slot for Full Height Half Length add on card, each slot is 25W power budget and additional Molex 4 pin power cable (12V/1.5A and 5V/2A) support- ADLINK MXM Graphics module support (Type A/B, up to 120W)- 8th/9th Gen Intel® Core™ i7/i5/i3, Celeron® processor- Dual SODIMMs for up to 64GB DDR4 non-ECC memory (dependent on CPU)- DisplayPort (2 from CPU, 4 from MXM)- 1x M.2 E key supporting 1630 or 2230 for Wi-Fi/Bluetooth module, 1x M.2 B key supporting 2242 or 2280 for SATA storage module- Reliable Molex type 12V DC-in connector- 1x Intel® i219-LM and 3x Intel® i210-AT
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COM Express Basic Size Type 7 Module with Up to 16 Cores Intel Xeon D and Pentium D SoC (formerly codename: Broadwell-DE)
Express-BD7
The Express-BD7 is a COM Express COM.0 R3.0 Basic Size Type 7 module supporting the 64-bit Intel Xeon processor D and Intel Pentium D processor system-on-chip (SoC) (formerly "Broadwell-DE"). The Express-BD7 is specifically designed for customers who need excellent computing performance with balanced power consumption and multiple 10G Ethernet connectivity in a long product life solution.
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Terminal Board for General Purpose with 100-pin SCSI-II Connector
DIN-814-GP
- Available for PCI-8134, PCI-8164, PCI-8154, PCI-8158 and PXI-8164- Supports Specific Servos by Cable Selecting- On-board Connector Type: 100-pin SCSI-II- Dimensions: 146 mm x 85 mm x 44 mm (W x L x H)
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SMARC® 2.1 Short Size Module With Intel® Core™ I3 Processors, Intel® Processors N Series And Intel® 7th Gen Atom® X7000E Processors
LEC-ALN
The ADLINK LEC-ALN is a SMARC module that supports up to 8 cores Intel® Core™ i3 (i3-N305, i3-N300) Processors, Intel® Processors N Series (N97, N50) and Intel® Atom® x7000E (x7425E, x7213E, x7211E) Processors (formerly Alder Lake-N) with integrated Intel® UHD graphics and high-speed interfaces. LEC-ALN modules support up 16GB LPDDR5 memory, up to 256GB eMMC storage (build option) and are also available with rugged operating temperature range and low power envelope, making them a perfect match for mission critical fanless edge computing applications that require safety and reliability at all times.
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Digital Input Board
VME-1129
VME-1129 128-bit high voltage digital input board with Built-in-Test and input filter. This product complies with the VMEbus specification (ANSI/IEEE STD 1014-1987, IEC 821 and 297), with the following mnemonics: A24:A16: D32/D16/D08 (EO): Slave:39/3D: 29/2D Form Factor: 6U
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6th Generation Intel® Core™ i7/i5/i3 Fanless Computer
MVP-6010/6020 Series
ADLINK's newly introduced MVP-6010/6020 Series value line of fanless embedded computing platforms, incorporating the 6th Generation Intel® Core™ processor, provides one PCIex16 and three PCI or two PCIe x8 and two PCI expansion slots, 1 mini PCIe slot and single-side access for I/O ports, optimizing easy maintenance in industrial automation environments. The series retains the robust design of all ADLINK MXC/MXE lines, at a new extremely cost effective price point.
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9th Gen Intel® Xeon®, Core™ i7/i3 and 8th Gen Intel® Core™ i5 Processor-Based Embedded Fanless Computer
MXE-5600 Series
- 9th Gen Intel® Xeon®, Core™ i7/i3 and 8th Gen Intel® Core™ i5 BGA processor and Mobile Intel® CM246 Chipset- Dual SODIMMs for up to 32GB DDR4 non-ECC/ ECC memory- Rich I/O: 2x DP++, HDMI, 2x GbE, 6x COM, 8-ch DI, 8-ch DO, TPM2.0- 2x USB 3.1 Gen2, 2x USB 3.1 Gen1. 4x USB 2.0- Rich storage: 2x 2.5" SATA 6 Gb/s, CFast, M.2 2280
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COM-HPC Server Type Modules
The COM-HPC specification currently defines two server modules. The largest of the server modules, Size E (200mm x 160mm), offers up to eight on-board DIMM sockets. The power input is a single 12-volt supply that can deliver up to 358 watts of power, and there are 64x lanes PCIe Gen5 in total.
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sbRIO-9482, Non-Enclosed, 4-Channel, SPST Relay, 60 VDC (1 A)/250 VAC (1.5 A) C Series Relay Output Module
783000-01
The sbRIO‑9482 directly connects to a wide array of industrial devices such as motors, actuators, and DC devices. Each channel provides access to an electromechanical relay for switching signals up to 60 VDC (1 A) or 250 Vrms (1.5 A), features channel‑to‑channel isolation, and has a LED that indicates the status. Non-enclosed modules are designed for OEM applications.
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High-Resolution VMEbus Laser Axis Board
10897D
The 10897D High-resolution VMEbus laser axis board provides excellent resolution of up to 0.3 nm with a high resolution interferometer. The data age uncertainty is dramatically reduced allowing extremely accurate measurement and control of moving systems. The very high data rates accommodate high-bandwidth and high-performance closed-loop applications. Configured with appropriate lasers and optics components, the 10897D supplies unsurpassed positioning accuracy for dynamic measurement.
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M/MA Module Carrier
VX405C
The VX405C carrier provides the mechanical and electrical interfaces between the VXIbus and up to six (6) VITA 12-1996 standard M/MA-Modules. The carrier provides VXI register configuration and access to the M/MA-Module I/O space and memory (if present). Each M/MA-Module is controlled separately and appears as a different logical address in the VXI environment. Over 100 M/MA-Modules are available that can provide custom interfacing to the unit under test (UUT). Up to six (6) unique interfaces may be provided in a single VXI slot.
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FMC Add-On Cards
iWave’s FPGA-IP Evaluation Add-On FMC Card is designed to meet ANSI/VITA 57.1 FMC Standard. The card supports both High-Pin Count (HPC) & Low-Pin Count (LPC) connector and can be used in an air-cooled environment. FPGA-IP Evaluation Add-On Card can be interfaced with most of the FPGA development kits available in the market. This card also helps to evaluate iWave’s proprietary FPGA Intellectual Property (IP) Cores.
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96-Channel Digital I/O Plug-In
1260-114
The high channel count of the digital I/O plug-ins allows a significant portion of digital I/O to be realized in a single slot of the Adapt-a-Switch™ carrier, saving valuable VXIbus chassis space. The 1260- 114 provides 96 digital I/O channels in twelve groups of eight bits each.
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COM Express Compact Size Type 6 Module with 11th Gen Intel® Core™ and Celeron® Processors (formerly codename: Tiger Lake-UP3)
cExpress-TL
ADLINK cExpress-TL,based on the 11th Gen Intel® Core™ i7/i5/i3 and Celeron™ processor, is the first COM Express module to support PCI Express Gen 4 at 16 GT/s, effectively doubling the bandwidth of previous generations. Additionally if features support for 2.5GbE Ethernet, leveraging existing Cat5e cable infrastructure being used for 1GbE Ethernet, it supports four USB 3.2 ports with transfer rates up to 10Gb/s. The modules have a configurable power range of 15 to 28 watts, which suits them for fanless space-constrained embedded applications. Typical industries in need of such high-performance/low-power characteristics are transport, medical, industrial automation and control, edge controllers, robotics and multi-camera-based AI. cExpress-TL features the Intel® Iris® Xe, a new graphics core, and supporting AVX-512 Vector Neural Net Instructions (VNNI) can significantly improve the number of elements processed per cycle, providing AI inferencing performance that is up to 3x that of previously available from non-VNNI platforms. Intel® Iris® Xe provides 96 execution units and is able to be configured to support two 8K independent displays or four 4K independent display (HDMI/DP/eDP). Additional support includes In-Band ECC (IBECC), providing ECC level error correction on DDR4 SODIMM memories for mission critical or rugged applications.
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Quad QSFP28/QSFP+ FMC+ Module
iWave’s QSFP28/QSFP+ 2×1 Stacked FMC+ HSPC Module is designed to meet VITA 57.4 FMC+ Standard. This FMC+ Module is supported by two stacked QSFP28/QSFP+ ports(Upto400G) with 4-Bit Silicon Labs programmable clock synthesizer (default = 156.25Mhz). A flexible reference clock for on the QSFP28/QSFP+ 2×1 Stacked FMC+ Module is fully programmable over the 0.16 to 710 MHz range through I2C. Each QSFP28/QSFP+ ports are directly connected to four multi-gigabit serial transceivers banks of Vita 57.4 compliant carrier Board.
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COM Express Basic Size Type 6 Module with 6th Gen Intel® Core™, Xeon® and Celeron® Processors (formerly codename: Skylake)
Express-SL/SLE
The Express-SL/SLE is a COM Express® COM.0 R2.1 Basic Size Type 6 module supporting the 64-bit 6th Generation Intel® Core™ and Xeon® E3-and Celeron® processors (codename "Skylake-H") with IntelR QM170, HM170, CM236 Chipset.
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34945EXT Distribution Board, For One 87204x/206x Or 87606B Switch And Two N181x Switches
Y1152A
The Y1150A-Y1155A distribution boards enable simple connections to the external switches. The distribution boards plug onto the 34945EXT and are used to route the power and control signals from the driver module to the switches using standard cables.
