Single Board Computers
Whole computer on one PCB.
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Product
COM Express Compact Size Type 6 Module with 6th Gen Intel® Core™ i7/i5/i3 and Celeron® 3955U Processors (formerly codename Sky Lake)
cExpress-SL
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The cExpress-SL is a COM Express® COM.0 R2.1 Type 6 Compact size module featuring the 64-bit 6th Generation Intel® Core™ i7/i5/i3 and Intel® Celeron® Ultra-Low TDP processors (formerly Sky Lake-U") with CPU, memory controller, graphics processor and I/O hub on a single chip. Leveraging the benefits provided by the 6th generation Intel® Core™ and Celeron® System-on-Chip, the cExpress-SL is specifically designed for customers who need optimum processing and graphics performance with suitable power consumption using Intel® Configurable TDP in a long product life solution.
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Product
COM Express Mini Size Type 10 Module with Intel Atom® E3900 Series, Pentium®, and Celeron® SoC (formerly Apollo Lake)
nanoX-AL
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The nanoX-AL is a COM Express® COM.0 R3.0 Type 10 module supporting Intel Atom® processor E3900 series system-on-chip (SoC). The nanoX-AL is specifically designed for customers who need optmized processing and graphics performance with low power consumption in a long product life solution.
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Product
COM Express Rev. 3.1 Basic Size Type 6 Module with 13th Gen Intel® Core™ Mobile Processor
Express-RLP
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ADLINK’s Express-RLP COM Express Type 6 Basic size module is based on 13th Gen Intel® Core™ mobile processor (formerly codenamed Raptor Lake-P) and is the first COM Express utilizing Intel’s advanced hybrid architecture (with up to 6 Performance-cores and 8 Efficient-cores) offered with industrial-grade/real-time option to provide superior performance for edge IoT innovations across varied power ranges — at 15W/28W/45W TDP.
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Product
COM Express® Basic Size Type 2 Module with 6th Gen Intel Core™, Intel Xeon® and Intel Celeron® Processors (formerly codename: Sky Lake-H)
Express-SL2
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ADLINK announces a new COM Express Type 2 Computer-on-Module, based on the highly popular Intel® Core processors (formerly codenamed Skylake and Kaby Lake). The Express-SL2/KL2 supports all type 2 related legacy I/O and thereby allows customers to extend the production life of existing type 2 based systems for at least another 10 years.
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Product
1U Storage Chassis For EATX/ATX Server Board With 8 Hot-Swap Drive Bays For High-Density Storage Servers.
HPC-8108
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1U rackmount chassis support EATX/ATX motherboard8-bay hot-swappable 2.5" SATA/SAS/SSD drive bays with slim ODDSupport 12Gb/s SASIIIAnti-vibration FAN designSingle front USB2.0 port
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Product
COM Express Type 7 Basic Size Module with Intel® Xeon® D-1700 Processor (formerly codename: Ice Lake-D)
Express-ID7
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ADLINK’s Express-ID7 COM Express Type 7 Basic Size module is based on the Intel® Xeon® D-1700 processor and features integrated high-speed Ethernet for up to 4x 10G combined with 16 PCIe Gen4 lanes for instantaneous responsiveness and performance. Equipped with Intel® TCC, Deep Learning Boost (VNNI), AVX-512 technologies for optimal, accelerated AI performance, and support for Time Sensitive Networking (TSN), it provides precise control of hard-real-time workloads across all networked devices.
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Product
Medical Box PC Featuring The 12th/13th/14th Gen Intel® Core™ I3/i5/i7/i9 Processors, With Support For MXM GPU Module With Embedded NVIDIA RTX GPU And Thunderbolt™ 4 Port
MLB-3102 with NVIDIA MXM GPU
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- ADLINK MXM graphics module support (type A/B, up to 120W TDP based on power supply)- 12th/13th/14th Gen Intel® Core™ i3/i5/i7/i9, Celeron® processor- Dual SODIMM for up to 64GB DDR5 non-ECC memory (depending on CPU)- 1x HDMI 2.0, 5x DisplayPort (1 from CPU, 4 from MXM)- 1x M.2 E-key supporting 1630 or 2230 for Wi-Fi/Bluetooth module, 1x M.2 M-key supporting 2242 or 2280 for SATA/PCIe storage module, 1x M.2 M-key supporting 2242 or 2280 for NVMe & frame grabber- Reliable Molex 24V DC-in connector- 2x 2.5GbE Intel® I225-LM Ethernet Controller- 2x PCIe Gen 3 x4 expansion slot for full-height, half-length add-on card, each slot is 25W power budget and additional Molex 4-pin power cable (12V/1.5A and 5V/2A) support
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Product
Development Board
SOM-DB5800
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Development Board for COM Express® R2.1 Type 6 / 10 Modules. Development Board Compliant to PICMG COM.0 R2.1 Type 6 / 10 Pin-out. Support COM Express Basic, Compact & Mini modules. Expansion: PCIe x16, PCIe x4, PCIe x1, Mini-PCIe, Express Card.
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Product
Compact Modular Industrial Computers Based On 14/13/12 Gen Intel® Core™ Processors
MVP-5200 Series
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The MVP-5200 Compact Modular Industrial Computers powered by 14/13/12th Gen Intel® Core™ i9/i7/i5/i3 and Celeron processors. Featuring Intel R680E chipset and supporting up to 65W, the computers can also incorporate GPU cards in a rugged package suitable for AI inferencing at the Edge, and can be used for but not limited to smart manufacturing, semiconductor equipment, and warehouse applications.
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Value Family 9th Gen Intel® Xeon®/Core™ i7/i5/i3® Processor-Based Expandable GPU Workstation Platforms
MVP-6100-MXM Series
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- 9th Gen Intel® Xeon®/Core™ i7/i5/i3 LGA processor- Dual SODIMMs sockets for up to 32GB DDR4 non-ECC/ECC- Abundant I/O: Up to 4x additional DP 1.4 from MXM, 2x DP++, DVI, VGA, 3x GbE, 3x COM, TPM2.0- 2x USB 3.1 Gen 2, 1x USB 3.1 Gen 1, 3x USB 2.0- Rich storage options: up to 4x 2.5" SATA, M.2 2280
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Product
Digital Input Board
VME-1182A
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A multifunctional intelligent controller allows COS, SOE, pulse accumulation, debounce times and time tagging control on a per-channel basis.
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Product
SMARC 2.1 Reference Carrier Board with M.2 Extension
I-Pi SMARC Plus
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The I-Pi SMARC Plus is small (110mm x 110mm) SMARC reference carrier board based on SGeT SMARC (Smart Mobility ARChitecture) 2.1 hardware specification. Together with the SMARC short size module of your choice and off the shelf add-on cards, you can quickly emulate the functionality of your desired end product for software development and hardware verification.
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Product
4x 3U OpenVPX MOSA Flight Control Computer
SIU34-FCCVARM-01
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SIU34-FCCVARM-01 is a Modular Open Systems Approach (MOSA) DO-178C & DO-254 Certifiable Flight Control Computer (FCC) with low power high performance OpenVPX Xilinx UltraScale+ SBC with Quad Core ARM Cortex -A53, 8 GB DDR4 SDRAM, 32 GB SATA Flash, 2 x 10/100/1000Base-T Ethernet, USB 3.0, FIPS-140-3 Level 3 Cyber Security, and Single Event Upset support.
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High-Performance 6th Generation Intel® Core™ i7/i5/i3 Processor-Based Fanless Embedded Computer
MXC-6400 Series
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The Matrix MXC-6400 series is a line of high-performance fanless embedded computers, integrating 6th generation Intel® Core™ i7/i5/i3 processors and the QM170 chipset for more powerful computing and graphics performance with minimal power consumption.
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Product
SMARC Module
LEC-MTK-I1200
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The ADLINK LEC-MKT-I1200 is a SMARC module powered by the MediaTek MT8395 SoC with 4x Arm Cortex-A78 and 4x Cortex-A55 cores and up to 5 TOPS APU. The module incorporates a spate of IoT technologies, such as on-device artificial intelligence (AI) capabilities and support for up to 3 cameras, while delivering a low power envelope, making it the ideal solution for robotic and drone applications across various sectors, including consumer, enterprise, defense, industrial, logistics, and more.
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Product
COM Express® Type 6 R3.1 Reference Carrier Board In ATX Form Factor
Express-BASE6 R3.1
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Express-BASE6 R3.1 is an ATX COM-Express Type 6 Basic / Compact size module reference carrier board based on PICMG COM-Express Revision 3.1. Together with the COM-Express Type 6 module of your choice and off the shelf add-on cards, you can quickly emulate the functionality of your desired end product for software development and hardware verification.
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Product
FPGA Board
VP889
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The VP889 is a high-performance FPGA processing board featuring Xilinx® Virtex Ultrascale+™ and Zynq® Ultrascale+™ technology.
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Product
COM Express
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COM Express, defined by the PCI Industrial Computer Manufactures Group (PICMG), is the most successful Computer-On-Module (COM) standard in the embedded market today. COM Express employs a mezzanine-based approach, whereby an off-the-shelve module with two 220-pin board-to-board connectors, plugs into a custom, application-specific carrier board.
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Product
3.5" Embedded SBC With Intel® Celeron® Processor J1900/N2807, LVDS/VGA/HDMI, Dual LANs And Audio
CAPA842
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The CAPA842, fanless 3.5-inch embedded board, is equipped with the newest 22nm Intel® Celeron® processor quad core J1900 (2.0GHz) or dual core Celeron® N2807 (1.58 GHz). The CAPA842 supports high bandwidth DDR3L-1333 SO-DIMM with memory up to 8 GB. Designed with fanless ultra-small form factor, the CAPA842 has excellent temperature tolerance for used in extremely harsh environments. With integrated Intel® Gfx graphics engine, up to 854MHz in turbo, this ultra-small 3.5-inch embedded single board computer provides completely new visual experiences, including faster media processing, full HD over HDMI, and spectacular HD playback, etc. Moreover, its multiple display outputs of HDMI, LVDS and VGA support dual views.
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Product
Computer-On-Module
Open Standard Module (OSM)
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OSM form factor is the first computer-on-module form factor for solderable BGA mini modules that is natively capable of supporting both ARM and x86 designs. OSM modules are significantly smaller than previously available modules, with the largest measuring 45mm x 45mm. For a growing number of IoT applications this standard helps to combine the advantages of modular embedded computing with increasing requirements regarding cost, foot print and interfaces. The BGA design makes it possible to implement more interfaces on a small footprint. The largest Size-L (Large) measures 45mm x 45mm with 662 BGA pins. The modules are completely machine processible during soldering, assembly and testing.
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Product
Computer On Module
ITX-M-CC452-T10
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The ITX-M-CC452-T10 is an industrial Mini-ITX small form factor Type 10 reference carrier board designed to fully test WINSYSTEMS’ COMeT10-3900 COM Express Type 10 Mini module. The carrier board adheres to the PICMG COM Express specifications providing compatibility with other COM Express mini type 10 modules.
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Product
COM Express Basic Size Type 7 Module with Intel Atom® C3000 SoC
Express-DN7
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The Express-DN7 is a COM Express® COM.0 R3.0 Basic Size Type 7 module supporting the 64-bit Intel Atom® C3000 processor (formerly “Denverton-NS”) system-on-chip (SoC). 16 CPU cores with 31W TDP and integrated 10G Ethernet make the Express-DN7 especially suited for customers who need excellent computing performance with low power consumption, such as edge computing applications, in a long product life solution.
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Product
Distribution Board, For 8 N181x SPDT Switches
Y1150A / 34945EXT
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Connects the 34945EXT to 8 N181x SPDT to route the power and control signals from the driver module to the switches
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Product
Value Family 9th Gen Intel® Core™ i7/i5/i3® Processor-Based Embedded GPU/AI Platforms
MVP-5100-MXM Series
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- 9th Gen Intel® Core™ i7/i5/i3 LGA processor- Dual SODIMMs sockets for up to 32GB DDR4- Abundant I/O: Up to 4x additional DP 1.4 from MXM, 2x DP++, DVI, VGA, 3x GbE, 3x COM, TPM2.0- 3x USB 3.1 Gen 1, 3x USB 2.0- Rich storage options: 2x 2.5" SATA, M.2 2280
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Product
PC/104-based Analog Input, Analog Output, and Digital I/O Board
PCM-MIO-A-1
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The PCM-MIO-A-1 is a versatile, PC/104-based analog input, analog output, and digital I/O board designed for high-accuracy and high-channel-count analog and digital I/O. The board is based upon Linear Technology’s precision converters and voltage references which require no external calibration. The digital I/O utilizes WINSYSTEMS’ versatile WS16C48 Universal I/O controller functionality, also available on many of our SBCs and other I/O products.
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Product
SMARC® 2.1 Short Size Module With Intel® Core™ I3 Processors, Intel® Processors N Series And Intel® 7th Gen Atom® X7000E Processors
LEC-ALN
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The ADLINK LEC-ALN is a SMARC module that supports up to 8 cores Intel® Core™ i3 (i3-N305, i3-N300) Processors, Intel® Processors N Series (N97, N50) and Intel® Atom® x7000E (x7425E, x7213E, x7211E) Processors (formerly Alder Lake-N) with integrated Intel® UHD graphics and high-speed interfaces. LEC-ALN modules support up 16GB LPDDR5 memory, up to 256GB eMMC storage (build option) and are also available with rugged operating temperature range and low power envelope, making them a perfect match for mission critical fanless edge computing applications that require safety and reliability at all times.
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Product
1U 19” Edge Computing Platform with Intel® Xeon® D Processor
MECS-6120
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- 1x Intel® Xeon® D-17XX Series family processor- 3x DDR4-2666 RDIMM ECC REG up to 192GB- 2x 2.5” SATA bays and 2x M.2 M Key interfaces- 420mm depth 1U 19” rackmount form factor- Built-in Intel® QAT: SSL (20G), Compression (15G)- Intel® eASIC by card for FEC acceleration- EMC grade: Class B & Advanced chassis management, IPMI v2.0 compliant
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9th Gen Intel® Xeon®, Core™ i7/i3 and 8th Gen Intel® Core™ i5 Processor-Based Embedded Fanless Computer
MXE-5600 Series
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- 9th Gen Intel® Xeon®, Core™ i7/i3 and 8th Gen Intel® Core™ i5 BGA processor and Mobile Intel® CM246 Chipset- Dual SODIMMs for up to 32GB DDR4 non-ECC/ ECC memory- Rich I/O: 2x DP++, HDMI, 2x GbE, 6x COM, 8-ch DI, 8-ch DO, TPM2.0- 2x USB 3.1 Gen2, 2x USB 3.1 Gen1. 4x USB 2.0- Rich storage: 2x 2.5" SATA 6 Gb/s, CFast, M.2 2280
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Product
Digital Output Board
VME-2128A
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VME-2128A 128-bit High-Voltage Digital Output Board with Built-in-Test
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Product
Computer On Modules
COM Express Compact
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Advantech COM-Express Compact includes Intel core i, Intel 5th Generation, Intel atom processor, which are all designed with low power consumption processors. They perform the same functions and same pin definitions as the COM-Express Basic module but with smaller board dimensions of 95 x 95 mm. And COM Express Compact series provide from Intel core i, Intel 5th Generation, Intel atom processors, and is the best solution for mobile applications.
