Single Board Computers
Whole computer on one PCB.
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Product
4x 3U OpenVPX MOSA Mission Computer
SIU34-MCVARM-01
Mission Computer
SIU34-MCVARM-01 is a Modular Open Systems Approach (MOSA) DO-178C & DO-254 Certifiable Mission Computers (MC) with low power high performance OpenVPX Xilinx UltraScale+ SBC with Quad Core ARM Cortex -A53, 8 GB DDR4 SDRAM, 32 GB SATA Flash, 2 x 10/100/1000Base-T Ethernet, USB 3.0, FIPS-140-3 Level 3 Cyber Security, and Single Event Upset support.
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Product
COM Express Compact Size Type 6 Module with 6th Gen Intel® Core™ i7/i5/i3 and Celeron® 3955U Processors (formerly codename Sky Lake)
cExpress-SL
Computer on Module
The cExpress-SL is a COM Express® COM.0 R2.1 Type 6 Compact size module featuring the 64-bit 6th Generation Intel® Core™ i7/i5/i3 and Intel® Celeron® Ultra-Low TDP processors (formerly Sky Lake-U") with CPU, memory controller, graphics processor and I/O hub on a single chip. Leveraging the benefits provided by the 6th generation Intel® Core™ and Celeron® System-on-Chip, the cExpress-SL is specifically designed for customers who need optimum processing and graphics performance with suitable power consumption using Intel® Configurable TDP in a long product life solution.
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Product
Digital Output Board
VME-2128A
Digital Output Board
VME-2128A 128-bit High-Voltage Digital Output Board with Built-in-Test
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Product
Motion Control Terminal Board For Panasonic MINAS A4 Servo Amplifiers
DIN-814-A40
Terminal Board
- Panasonic MINAS A4 super servo- Dimensions: 123 mm x 107 mm x 44 mm (WxLxH)- Available for PCI-8174, PCI-8164, PCI-8154, PCI-8158 and PCI-8134
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Product
Computer-On-Module
Qseven®
Computer on Module
Qseven is an off-the-shelf, multi-vendor, computer-on-module that integrates all the core components of a common x86 PC and is mounted onto an application specific carrier board. A single ruggedized 230-pin MXM connector provides the carrier board interface to carry all the I/O signals to and from the Qseven module.
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Product
COM-HPC Server Type Size E Module with Ampere® Altra® SoC
COM-HPC-ALT
Computer on Module
ADLINK’s COM-HPC Ampere Altra is the first 80-core COM-HPC Server Type module in the world. It is based on the Ampere® Altra® SoC based on the Arm Neoverse N1 architecture and offers up to 80 Arm v8.2 64-bit cores at 2.8GHz with only 175 Watt TDP. The excellent performance-per-watt architecture makes the COM-HPC Ampere Altra well suited to processing massive data at the edge without requiring a significant initial investment or ongoing maintenance costs.
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Product
COM Express Basic Size Type 7 Module with Up to 16 Cores Intel Xeon D and Pentium D SoC (formerly codename: Broadwell-DE)
Express-BD7
Computer on Module
The Express-BD7 is a COM Express COM.0 R3.0 Basic Size Type 7 module supporting the 64-bit Intel Xeon processor D and Intel Pentium D processor system-on-chip (SoC) (formerly "Broadwell-DE"). The Express-BD7 is specifically designed for customers who need excellent computing performance with balanced power consumption and multiple 10G Ethernet connectivity in a long product life solution.
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Product
Enclosed Fanless Industrial Embedded Computer with NXP® i.MX8M Application Processor
SYS-444Q
Computer System
The SYS-444Q is a rugged enclosed fanless embedded computer system with NXP’s i.MX8M industrial application processor with quad-core Arm Cortex®-A53 for low-power processing. This rugged system has dual Ethernet, industrial I/O, expansion options, TPM 2.0 hardware security, and options for wireless connectivity. The processor supports industry-leading video processing along with an M4 microcontroller for real-time subsystems making it an ideal fit for industrial IoT applications requiring highly reliable performance in harsh conditions such as digital signage, industrial automation, energy management, building automation, and others.
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Product
COM-HPC Server Type Modules
Computer on Module
The COM-HPC specification currently defines two server modules. The largest of the server modules, Size E (200mm x 160mm), offers up to eight on-board DIMM sockets. The power input is a single 12-volt supply that can deliver up to 358 watts of power, and there are 64x lanes PCIe Gen5 in total.
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Product
COM Express Type 6 Development Kit
COM Express Type 6 Starter Kit Plus
Computer on Module
The Type 6 Starter Kit Plus consists of a COM Express Type 6 module with ATX size Type 6 reference carrier board that offers one PCI Express x16 slot with proprietary pinout for DDI adapter card that convert DDI signal to DP or HDMI signal, one PCI Express graphics x16 slot, one PCI Express x4 slot, three PCI Express x1 slots, Serial ATA, VGA, LVDS, USB3.0/2.0, Gigabit LAN and Super I/O. All necessary cables are included.
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Product
SMARC® Short Size Module with Intel Atom® E3900 Series, Pentium™ N4200 or Celeron™ N3350 Processor (codename: Apollo Lake)
LEC-AL
Computer on Module
The LEC-AL Computer-On-Module (COM) combines the SMARC® 2.0 standard with the latest Intel Atom® E-Series and Pentium® and Celeron® N-series System-on-Chips (SoCs), providing ideal solutions for low power consumption and high performance requirements. The module provides the high integration, high performance, low power, and ruggedness favored by Internet- of-Things (IoT) applications such as retail transactional clients, digital signage, and in-vehicle infotainment systems. The LEC-AL module utilizes the latest Intel E-series and N-series SoCs, which are based on the Intel 64 Architecture, the new HD Graphics 500/505 engine, and a faster, 4-vector image processing unit. The SoCs are manufactured on Intel's industry-leading, tri-gate 14nm process, improving system performance by supporting more than 4 GB of both virtual and physical memory.
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Product
ATX Server Board With Intel® Core™ Ultra 9/7/5, DDR5, And PCIe Gen5 For Workstations, General-Purpose Servers, And Multi-Tasking.
ASMB-789
Server Board
Features an LGA 1851 socket for Intel® Core™ Ultra 9/7/5 processors with the W880 chipset, delivering next-gen performance.Supports up to 192 GB of high-speed DDR5 ECC/Non-ECC UDIMM memory at up to 5600 MT/s.Provides extensive expansion with one PCIe x16 (Gen5), one PCIe x8 (Gen5), and five PCIe x4 slots.Drives triple independent displays through DisplayPort, VGA, and HDMI 2.0 for advanced visual workspaces.Includes four SATA 3 ports for traditional storage and seven USB 3.2 ports for high-speed peripherals.Features one M.2 2280 slot (PCIe x4) for fast NVMe SSDs, accelerating boot times and application performance.Its rackmount-optimized design ensures positive airflow, enhancing cooling and system reliability in server environments.Built to operate reliably in a 0 ~ 60°C (32 ~ 140°F) ambient temperature range, suitable for various industrial settings.
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Product
Digital Input Board
VME-1128
Digital Input Board
VME-1128 is a 128-bit High-Voltage Digital Input Board with Built-in-Test. This product complies with the VMEbus specification (ANSI/IEEE STD 1014-1987, IEC 821 and 297) with the following mnemonics: A24:A16:D32/D16/D08 (EO): Slave: 39/3D:29/2D Form factor: 6U
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Product
DIN-Rail Wiring Terminal Board With CJC Circuit
PCLD-8710
Terminal Board
Low-cost screw-terminal with 68-pin SCSI-II connectorOnboard CJC (Cold Junction Compensation) circuits for direct thermocouple measurementReserved space for signal-conditioning circuits such as low-pass filter, voltage attenuator and current shuntIndustrial-grade screw-clamp terminal blocks for heavy-duty and reliable connectionsDIN-rail mounting case for easy mountingSupports PCI-1710U/UL, PCI-1710HGU, PCI-1711U/UL, PCI-1716/L
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Product
Printed Circuit Board
RISER-PCM-1
Printed Circuit Board
WINSYSTEMS’ RISER-PCM-1 boards are designed to provide extra space in a PC/104 stack. They are printed circuit boards (PCBs) with PC/104 mounting holes and bus connectors. They allow a board with either tall components or heat sinks to be placed in a stack of boards in a location other than only at the top. The additional separation is 0.60 inches using standard PC/104-type spacers.
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Product
COM Express Rev. 3.1 Basic Size Type 6 Module with 13th Gen Intel® Core™ Mobile Processor
Express-RLP
Computer on Module
ADLINK’s Express-RLP COM Express Type 6 Basic size module is based on 13th Gen Intel® Core™ mobile processor (formerly codenamed Raptor Lake-P) and is the first COM Express utilizing Intel’s advanced hybrid architecture (with up to 6 Performance-cores and 8 Efficient-cores) offered with industrial-grade/real-time option to provide superior performance for edge IoT innovations across varied power ranges — at 15W/28W/45W TDP.
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Product
Mini Module
COMeT10-3900
Computer on Module
The COMeT10-3900 is an industrial COM Express® Type 10 Mini module with an Intel Atom® E3900 processor. This low power, industrial module was designed and manufactured in the USA. The small form factor module is designed as a processor mezzanine that can be plugged onto a carrier board that contains user-specific I/O requirements.
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Product
Dual LGA3647-P0 Intel® Xeon®Scalable EATX Server Board with 12 DDR4, 5 PCIe x16 + 1 PCIe x8 + 1 PCI, 8 SATA3, 6 USB3.0, Dual 10GbE, IPMI
ASMB-925
Server Board
- EATX Server Board with dual Xeon Scalable processors- DDR4 2933MHz RDIMM up to 1.5TB, support Intel Optane DC Persistent Memory- Five PCIe x16 (Gen3), one PCIe x8 (Gen3), and one PCI slot- Intel® X557-AT2 dual 10GbE ports- Eight SATA3.0 and six USB3.0 ports- 0 ~ 40 °C ambient operation temperature range
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Product
2-Axis High-Resolution Laser Axis Board for VME
10898D
Laser Board
The 10898D 2-axis high-resolution laser axis board provides the same resolution as the Keysight 10897D high-resolution laser axis board with increased slew rates and reduced noise. The increased stage velocity limits and low noise compared to previous laser systems offer premium positioning repeatability and accuracy for advanced applications such as IC fabrication equipment.
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Product
High-Performance 6th Generation Intel® Core™ i7/i5/i3 Processor-Based Fanless Embedded Computer
MXC-6400 Series
Industrial Computer
The Matrix MXC-6400 series is a line of high-performance fanless embedded computers, integrating 6th generation Intel® Core™ i7/i5/i3 processors and the QM170 chipset for more powerful computing and graphics performance with minimal power consumption.
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Product
SMARC Short Size Module with Rockchip PX30 Quad-Core ARM Cortex A35
LEC-PX30
Computer on Module
LEC-PX30 based on power-efficient quad-core Arm® Cortex®-A35 SoC is a low-power, low-cost, entry-level, small-sized SMARC rev 2.0 module. For applications, such as IoT controllers, IoT gateways, wearable and mobile industrial devices, basic HMI, sensor concentrators, requiring good computing performance at low power consumption (1.5W- 5W) and Linux Yocto capability, LEC-PX30 is an ideal solution.
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Product
SMARC® 2.1 Short Size Module With Intel® Core™ I3 Processors, Intel® Processors N Series And Intel® 7th Gen Atom® X7000E Processors
LEC-ALN
Computer on Module
The ADLINK LEC-ALN is a SMARC module that supports up to 8 cores Intel® Core™ i3 (i3-N305, i3-N300) Processors, Intel® Processors N Series (N97, N50) and Intel® Atom® x7000E (x7425E, x7213E, x7211E) Processors (formerly Alder Lake-N) with integrated Intel® UHD graphics and high-speed interfaces. LEC-ALN modules support up 16GB LPDDR5 memory, up to 256GB eMMC storage (build option) and are also available with rugged operating temperature range and low power envelope, making them a perfect match for mission critical fanless edge computing applications that require safety and reliability at all times.
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Product
Medical Computer Equipped With MXM Graphics Module Supporting NVIDIA Quadro® GPU With 8th/9th Generation Intel® Core™ I7/i5/i3 In LGA1151 Socket. Compliant With IEC 60601-1/IEC 60601-1-2
MLB-3002
Industrial Computer
- 2x PCIe Gen3 x4 expansion slot for Full Height Half Length add on card, each slot is 25W power budget and additional Molex 4 pin power cable (12V/1.5A and 5V/2A) support- ADLINK MXM Graphics module support (Type A/B, up to 120W)- 8th/9th Gen Intel® Core™ i7/i5/i3, Celeron® processor- Dual SODIMMs for up to 64GB DDR4 non-ECC memory (dependent on CPU)- DisplayPort (2 from CPU, 4 from MXM)- 1x M.2 E key supporting 1630 or 2230 for Wi-Fi/Bluetooth module, 1x M.2 B key supporting 2242 or 2280 for SATA storage module- Reliable Molex type 12V DC-in connector- 1x Intel® i219-LM and 3x Intel® i210-AT
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Product
Quad QSFP28/QSFP+ FMC+ Module
FPGA Board
iWave’s QSFP28/QSFP+ 2×1 Stacked FMC+ HSPC Module is designed to meet VITA 57.4 FMC+ Standard. This FMC+ Module is supported by two stacked QSFP28/QSFP+ ports(Upto400G) with 4-Bit Silicon Labs programmable clock synthesizer (default = 156.25Mhz). A flexible reference clock for on the QSFP28/QSFP+ 2×1 Stacked FMC+ Module is fully programmable over the 0.16 to 710 MHz range through I2C. Each QSFP28/QSFP+ ports are directly connected to four multi-gigabit serial transceivers banks of Vita 57.4 compliant carrier Board.
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Product
COM Express Basic Size Type 6 Module with 11th Gen Intel® Core™, Intel® Xeon® and Intel® Celeron® Processors
Express-TL
Computer on Module
ADLINK’s Express-TL COM Express Type 6 Basic size module is based on the 11th Gen Intel® Core™, Xeon® W and Celeron® 6000 processor, and is the first COM Express module to support PCI Express x16 Gen4, effectively doubling the bandwidth of previous generation COM Express modules. With a combined 8 cores, 16 threads, and up to 128GB memory, the Express-TL brings uncompromised system performance and responsiveness to your solution. Featuring brand new Gen 12 Intel® UHD Graphics and Intel® AVX-512 Vector Neural Network Instructions (VNNI), the Express-TL provides AI inferencing performance as much as 3X higher compared to previous generation non-VNNI platforms. The integrated Gen 12 Intel® UHD Graphics core can be configured to support one 8K independent display or four 4K independent displays (HDMI/DP/eDP). In addition, legacy display interfaces such as LVDS and analog VGA are still supported as build options. Key features for today’s applications are support for 2.5 GbE and USB 3.2 with transfer rates of up to 10Gb/s that can transfer image data from cameras faster than previous generation products. Combined with 8 processor cores at 25W TDP, Intel® AVX-512 VNNI, Intel® OpenVINO™ toolkit and Intel® UHD Graphics, the Express-TL is well suited for AI at the edge applications (AIoT/IoT).
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Product
PXI FPGA Module
FIO168
Carrier Board
Using OpenATE USB/PXI FPGA Carrier, you can develop your design to define custom I/O and control Hardware without prior knowledge PCI I/O and USB interface.
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Product
Motion Control Terminal Board For Mitsubishi J2S-A Servo Amplifiers
DIN-812M0
Terminal Board
- On-board connector type: 100-pin SCSI-II female- Suitable for Mitsubishi J2 super servo- Dimensions: 123 mm x 107 mm x 44 mm (WxLxH)- Available for PCI-8132
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Product
ISI Channel Boards
M8049A
ISI (Intersymbol Interference) Channel Board
The M8049A ISI channel boards can be used to emulate channel loss in receiver test setups. The boards are used to emulate channel loss for data rates of 32 Gb/s and higher. A choice of 21 PC board traces with different lengths can be inserted into the signal path. The trace lengths range from 0.8 inch (20.3 mm) to 22.3 inch (566.4 mm). By cascading the traces within one board or with another board, a wide range of channels can be emulated with very fine resolution of insertion loss steps. With their small size the ISI channel boards can be located closely to the device under test.
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Product
Computer-On-Module
ETX®
Computer on Module
ETX is one of the earliest successful computer-on-module form factors. Today it is still widely used in applications such as industrial automation, transportation and medium and low level medical appliances. While high-end Intel® Core™ applications have mostly migrated to COM Express, ETX is still very much alive in the lower power segment, mostly notably using Intel Atom® SoCs.
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Product
FPGA Processing Board
VP880 / VP881
FPGA Board
The VP880 / VP881 is a high-performance FPGA processing board featuring Xilinx® Ultrascale™ and Zynq® Ultrascale+™ technology. It is designed for the most demanding, mission critical military/defense applications such as electronic warfare / DRFM, radar/sonar image processing, satellite communications systems, multichannel digital transmission/reception and advanced digital beamforming.
