Single Board Computers
Whole computer on one PCB.
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Product
VME Processor Cards
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Curtiss-Wright Defense Solutions
We believe upgrading VME systems with the latest processing technology and security capabilities shouldn't require a complex and costly redesign. That's why our VME single board computers (SBCs) are designed with contemporary processors, Trusted Computing features, and pinouts that are compatible with older VME boards.
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Product
6U CompactPCI Dual 64-bit PMC Slots Carrier Board
cPCI-8602
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- Supports two single-size 32,64-bit/33,66 MHz PMC sites in 4HP width- PICMG® 2.0 32,64-bit/33,66 MHz cPCI bus- PICMG® 2.1 Hot Swap Specification Compliant- 3.3V or 5V V(I/O) for cPCI bus and PMC sites- PLX® PCI-to PCI bridge PCI6154 for PCI bus- Power and HotSwap LED incidators on front panel
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Product
Carrier Board Design and Software Verification Computer-on-Module Starter Kit
Starter Kit - ETX
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- ETX module of choice- CPU, Memory of choice- Thermal Solution (heatspreader, and heatsink) of choice- Reference Carrier Board- Schematics, Design Guide, and User Manuals- ADLINK USB Stick with Documentation, Software
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Product
6x 3U OpenVPX MOSA Mission Computer
SIU36-MCVARM-01
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SIU36-MCVARM-01 is a Modular Open Systems Approach (MOSA) DO-178C & DO-254 Certifiable Mission Computers (MC) with low power high performance OpenVPX Xilinx UltraScale+ SBC with Quad Core ARM Cortex -A53, 8 GB DDR4 SDRAM, 32 GB SATA Flash, 2 x 10/100/1000Base-T Ethernet, USB 3.0, FIPS-140-3 Level 3 Cyber Security, and Single Event Upset support.
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Product
FMC Add-On Cards
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iWave’s FPGA-IP Evaluation Add-On FMC Card is designed to meet ANSI/VITA 57.1 FMC Standard. The card supports both High-Pin Count (HPC) & Low-Pin Count (LPC) connector and can be used in an air-cooled environment. FPGA-IP Evaluation Add-On Card can be interfaced with most of the FPGA development kits available in the market. This card also helps to evaluate iWave’s proprietary FPGA Intellectual Property (IP) Cores.
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Product
COM Express® Type 2 Reference Carrier Board in ATX Form Factor
Express-BASE
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The COM Express approach of custom carrier combined with off the shelf system cores is an excellent solution when you need to customize but lack the time or quantity for a complete redesign. It fits most system integration projects with production volumes from 500 to 10,000 pcs per year. The COM Express concept has a great many advantages over full custom designs, it reduces engineering complexity, lowers the threshold for total project quantity and last but not least brings your product to the market in no time. The average time to design a carrier board is less than half the time of a full custom OEM board.
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Product
Carrier Boards
ROM-DB7503
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ROM-DB7503 is the Referenced Carrier Board designed for Advantech's Qseven 2.1 module. It i provides a thorough environment for module board evaluation with its completefunction support. it's more easier for the end user to design portable devices by referring ROM-DB7503 design.
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Product
50-Pin D-Type Breakout Female DIN mount
40-967-050-F
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This termination option is capable of accepting heavy duty connection wires and uses rising clamp screw terminals to minimize the danger of copper strand damage. Users should care take to protect the termination, provide a suitable method of restraining the cables, and ensure appropriate electrical safety precautions are observed.
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Product
Computer-On-Module
SMARC
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SMARC form factor is the only computer-on-module form factor that truly is capable of supporting both ARM and x86 designs. With 314-pins on a high speed MXM3 connector, SMARC can fully cover both typical x86 interfaces as well as typical ARM type low level signals. Using ARM SoCs opens the possibility to leverage the product ecosystem of familiar devices such as tablet computers and smart phones. Alternative low power SoCs and CPUs, such as tablet oriented x86 devices and other RISC CPUs may be used as well.
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Product
Medical Box PC With IEC 60601-Compliant NVIDIA IGX Platform
MLB-IGX
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- GPU: 2,048-core NVIDIA Ampere architecture with 64 Tensor Cores- CPU: 12-core Arm® Cortex®-A78AE v8.2- Up to 1,705 trillion operations per second of AI performance- NVIDIA® ConnectX®-7 smart network interface card (SmartNIC)- Ten years of NVIDIA® hardware and software support
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Product
COM Express Compact Size Type 6 Module with AMD Ryzen™ Embedded V2000 APU (Zen 2 architecture)
cExpress-AR
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The cExpress-AR, featuring the new AMD Ryzen™ V2000 APU with its high performance integrated Radeon™ graphics, is the first Type 6 module on the market to support an octa-core (8-core) embedded SoC, with up to 16 threads and an impressive turbo boost up to 4.2 GHz. Compared to earlier embedded quad-core V1000 processors, the additional cores combined with AMD's Zen 2 architecture result in a more than two-fold performance increase and double the performance-per-watt efficiency.
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Product
COM-HPC Server Type Size E Module with Ampere® Altra® SoC
COM-HPC-ALT
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ADLINK’s COM-HPC Ampere Altra is the first 80-core COM-HPC Server Type module in the world. It is based on the Ampere® Altra® SoC based on the Arm Neoverse N1 architecture and offers up to 80 Arm v8.2 64-bit cores at 2.8GHz with only 175 Watt TDP. The excellent performance-per-watt architecture makes the COM-HPC Ampere Altra well suited to processing massive data at the edge without requiring a significant initial investment or ongoing maintenance costs.
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Product
Mini Type COM-HPC Module With Intel® Core™ Ultra Processor (Meteor Lake)
COM-HPC-mMTL
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Combining a power-efficient Intel® Core™ Ultra processor with up to 64GB LPDDR5 memory in a 95x70mm size makes this ideal for battery-powered, space-limited, high-performance edge applications like medical ultrasound devices, industrial automation, data loggers, autonomous driving, and AI robots.
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Product
Small Size DIN-Rail IPC With Intel® Atom™ E3845
UNO-1372G
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Intel® Atom E3845 1.91GHz processor with 4GB DDR3L Memory3 x GbE, 3 x USB, 2 x COM, 1 x VGA, 1 x HDMI, Audio, iDoor, mSATA, 2 x mPCIe, 1 x SATA, 4 x DI, 4 x DO, 1 x Power TerminalCompact with Fanless DesignDual Power Input for avoiding Power Down TimeExchangeable RTC Battery with easy Access on the TopDigital I/O with Isolation Protection for Sensing and controllingDiverse system IO and Supports Fieldbus Protocol by iDoor Technology as a Protocol GatewaySupports MRAM by iDoor TechnologyLAN Redundancy (Teaming)
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Product
3U CompactPCI Serial MXM GPU Carrier Card
cPCI-A3MXM
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- Follow PICMG® CompactPCI® Serial design guide- CompactPCI® Serial, 3U 4HP/8HP (100mm x 160mm)- Compatible with MXM Type A (82 mm x 70 mm) or Type B (82 mm x 105 mm)- Support NVIDIA A1000 with 2048 CUDA® cores, 16 RT Cores and 64 Tensor Cores or NVIDIA RTX™ A4500 with 5888 CUDA® cores, 46 RT Cores and 184 Tensor Cores- 4x DisplayPort 1.4, support 4K (3840x2160) resolution- Operating temperature: -40°C to +70°C- Designed to meet EN50155 standards
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Product
Digital Input Board
VME-1129
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VME-1129 128-bit high voltage digital input board with Built-in-Test and input filter. This product complies with the VMEbus specification (ANSI/IEEE STD 1014-1987, IEC 821 and 297), with the following mnemonics: A24:A16: D32/D16/D08 (EO): Slave:39/3D: 29/2D Form Factor: 6U
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Product
Medical Computer Equipped With MXM Graphics Module Supporting NVIDIA Quadro® GPU With 8th/9th Generation Intel® Core™ I7/i5/i3 In LGA1151 Socket. Compliant With IEC 60601-1/IEC 60601-1-2
MLB-3002
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- 2x PCIe Gen3 x4 expansion slot for Full Height Half Length add on card, each slot is 25W power budget and additional Molex 4 pin power cable (12V/1.5A and 5V/2A) support- ADLINK MXM Graphics module support (Type A/B, up to 120W)- 8th/9th Gen Intel® Core™ i7/i5/i3, Celeron® processor- Dual SODIMMs for up to 64GB DDR4 non-ECC memory (dependent on CPU)- DisplayPort (2 from CPU, 4 from MXM)- 1x M.2 E key supporting 1630 or 2230 for Wi-Fi/Bluetooth module, 1x M.2 B key supporting 2242 or 2280 for SATA storage module- Reliable Molex type 12V DC-in connector- 1x Intel® i219-LM and 3x Intel® i210-AT
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Product
COM Express Basic Size Type 6 Module with 7th Gen Intel® Core™ 7000 Series and Intel® Xeon® Processors (formerly codename: Kaby Lake)
Express-KL/KLE
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The Express-KL/KLE is a COM ExpressR COM.0 R2.1 Basic Size Type 6 module supporting the 64-bit 7th Generation Intel Core and Xeon processor E3 (codename "Kaby Lake-H”) with Mobile IntelR QM175, HM175, CM238 Chipset. The Express-KL/KLE is specifically designed for customers who need excellent graphics performance and high-level processing performance in a long product life solution.
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Product
9th Gen Intel® Xeon®, Core™ i7/i3 and 8th Gen Intel® Core™ i5 Processor-Based Embedded Fanless Computer
MXC-6600 Series
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- 9th Gen Intel® Xeon®, Core™ i7/i3 and 8th Gen Intel® Core™ i5 Processor- Dual SODIMMs for up to 32GB DDR4- Rich I/O: 2x DP++, 1x HDMI, 2x GbE, 6x COM, 8-ch DI, 8-ch DO, TPM 2.0- 2x USB 3.1 Gen2, 2x USB 3.1 Gen1, 4x USB 2.0- Rich storage: up to 4 internal 2.5" SATA 6 Gb/s ports with RAID 0/1/5/10 support, CFast, M.2 2280
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Product
COM Express Type 6 Prototyping Kit based on Intel® 12th Gen Core™ i5-12600HE
COM Express Type 6 Alder Lake-P
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The cExpress-BT is a COM ExpressR COM.0 R2.1 Type 6 module supporting the Intel Atom® processor E3800 Series and Intel® Celeron® N2900/J1900 processor SoC (codename: Bay Trail). The cExpress-BT is specifically designed for customers who need high-level processing and graphics performance with low power consumption in a long product life solution.
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Product
3U CompactPCI® Serial XMC Module Carrier Blade
cPCI-A3XMC
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- 3U 4HP CPCI-S.0 peripheral- One XMC slot- Operating temperature: -40°C to 85°C with qualified components
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Product
SMARC® Short Size Module with Intel® Atom™ Processor E3800 Series System-on-Chip
LEC-BTS
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- Single, dual or quad-core Intel® Atom™ Processor E3800 Series System-on-Chip- Up to 4 GB DDR3L at 1066/1333 MHz (non-ECC)- HDMI and LVDS- GbE, camera interface- 1x SATA 3Gb/s, 1x USB 3.0, 3x USB 2.0, max. 12x GPIO- Extreme Rugged™ operating temperature: -40°C to +85°C
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Product
Development Board
SOM-DB5920
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Development Board for COM Express® R3.0 Type 7 Modules. PICMG COM.0 R 3.0 Type 7 Pin out. COM Express ® Basic/Compact module, 10 Gigabit Ethernet support by OCP mezzanine card. Extension: PCIe x16, PCIe x8, 2 PCIe x4.
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Product
Intel® Atom™ Processor E3845 Fanless Expandable Embedded Computer with PCI/PCIe Slots
MXC-2300
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Featuring the latest Intel® Atom™ E3845 processor, the Matrix MXC-2300 series excels with minimal power consumption, exceptional 3D graphics, and powerful media acceleration, delivering a leading improvement in performance and cost-efficiency over any previous generation Atom-based system.
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Product
FPGA Processing Board
VP880 / VP881
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The VP880 / VP881 is a high-performance FPGA processing board featuring Xilinx® Ultrascale™ and Zynq® Ultrascale+™ technology. It is designed for the most demanding, mission critical military/defense applications such as electronic warfare / DRFM, radar/sonar image processing, satellite communications systems, multichannel digital transmission/reception and advanced digital beamforming.
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Product
SMARC® Short Size Module with Intel® Pentium™ and Celeron™ Processor N3000 Series SoC (codename: Braswell)
LEC-BW
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The LEC-BW Computer-On-Module (COM) combines the SMARC® 1.1 standard with the Intel® Pentium® and Celeron® N-series System-on-Chip (SoC), providing an ideal solution for low power consumption and high performance requirements. The module provides the high integration, high performance, low power, and ruggedness favored by Internet-of-Things (IoT) applications such as retail transactional clients, digital signage, and in-vehicle infotainment systems.
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Product
Digital Output Board
VME-2533
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VME-2533 32-bit Differential Digital Output Board. VMEbus specification compatible double height form factor.
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Product
34945EXT Distribution Board, For Two 87104x/106x L7x0xx Multiport Or 87406B Matrix Switches
Y1151A
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The Y1150A-Y1155A distribution boards enable simple connections to the external switches. The distribution boards plug onto the 34945EXT and are used to route the power and control signals from the driver module to the switches using standard cables.
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Product
3U CompactPCI Mini PCI, Mini PCIe Carrier Board
cPCI-3W10
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- Supports 32bit, 33/66MHz CompactPCI® bus- One SIM card socket- One Mini PCI and one Mini PCIe socket- PICMG® 2.0 R3.0 compliant
