Computer Aided Test
Computer Aided Test
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Product
BSD (Test Diagnostics)
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BSD Test Diagnostics software can be added to either developer or factory run-time systems to further improve the location of faults such as net bridges (short-circuits), open pins, open nets and even ''twisted'' connections that can occur within cable assemblies. BSD Test diagnostics reports faults in a verbose English language statement with pin level information included and can easily interpret multiple fault conditions.
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Product
COM Express® Basic Size Type 6 Module with Hexacore Mobile 9th Gen Intel® Xeon®, Core™, Pentium® and Celeron® Processors
Express-CFR
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The Express-CFR is COM Express® COM.0 R3.0 Basic Size Type 6 module supporting the Hexa-core (6 cores) 64-bit 9th Generation Intel® Core™ and Xeon® processor (codename “Coffeelake Refresh-H”) with Mobile Intel® QM370, HM370, CM246 Chipset.
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Product
Computer-On-Module
Open Standard Module (OSM)
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OSM form factor is the first computer-on-module form factor for solderable BGA mini modules that is natively capable of supporting both ARM and x86 designs. OSM modules are significantly smaller than previously available modules, with the largest measuring 45mm x 45mm. For a growing number of IoT applications this standard helps to combine the advantages of modular embedded computing with increasing requirements regarding cost, foot print and interfaces. The BGA design makes it possible to implement more interfaces on a small footprint. The largest Size-L (Large) measures 45mm x 45mm with 662 BGA pins. The modules are completely machine processible during soldering, assembly and testing.
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Product
Computer On Modules
ETX/XTX
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ETX / XTX CPU module eqiupped with Intel Atom has great I/O capacity and meets both ISA and PCI needs, while supporting the Computer On Module concept for plug-in CPU modules. Advantech is a founding member of the ETX Industrial Group (ETX-IG).
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Product
Enclosed Fanless Industrial Embedded Computer with NXP® i.MX8M Application Processor
SYS-444Q
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The SYS-444Q is a rugged enclosed fanless embedded computer system with NXP’s i.MX8M industrial application processor with quad-core Arm Cortex®-A53 for low-power processing. This rugged system has dual Ethernet, industrial I/O, expansion options, TPM 2.0 hardware security, and options for wireless connectivity. The processor supports industry-leading video processing along with an M4 microcontroller for real-time subsystems making it an ideal fit for industrial IoT applications requiring highly reliable performance in harsh conditions such as digital signage, industrial automation, energy management, building automation, and others.
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Product
Prototyping & Test Consulting Services Solutions
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Don’t cut corners on the path to quality. We are experts in Design for Test (DFT), Design for Manufacturing (DFM), agile development, prototyping and standards/best practices in many industries. Speak to our prototyping and consulting services experts to ensure you make the right decisions and investments at the start of your project.
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Product
COM Express® Type 2 Reference Carrier Board in ATX Form Factor
Express-BASE
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The COM Express approach of custom carrier combined with off the shelf system cores is an excellent solution when you need to customize but lack the time or quantity for a complete redesign. It fits most system integration projects with production volumes from 500 to 10,000 pcs per year. The COM Express concept has a great many advantages over full custom designs, it reduces engineering complexity, lowers the threshold for total project quantity and last but not least brings your product to the market in no time. The average time to design a carrier board is less than half the time of a full custom OEM board.
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Product
Imperial Test Executive
ITE
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The Imperial Test Executive (iTE) is a UI shell that sits on top of National Instruments TestStand. It provides a simple but elegant interface to execute your NI TestStand sequences. The iTE software was designed to allow general operators to execute ATE testing software without requiring any knowledge of NI TestStand. Training an operator to use this system typically takes less then 5-minutes.
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Product
Fast and Flexible WLAN Measurements up to 802.11ax
WLAN Test Toolkit
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The WLAN Test Toolkit gives you direct and fine control over the generation and analysis of IEEE 802.11a/b/g/n/ac and ax signals, as well as 802.11j/p/ah/af waveforms, with industry-leading speed and accuracy. It empowers you to characterize, validate, and test a variety of WLAN connectivity products, such as RF front end components, wireless modules, and user devices.The toolkit includes extensive support for the latest features of the 802.11ax standard, including extended single-user packets, multiuser OFDMA, and multiuser multiple input, multiple output (MIMO) functionality with per-user configuration and measurement results. The WLAN Test Toolkit helps you solve demanding new access point test cases by generating signals that simulate multiuser environments, including per-user impairments. You can also use the new software to generate trigger frames to test the real-time response of client devices and make power precorrection and relative center frequency measurements.
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Product
SMARC Short Size Module with Rockchip PX30 Quad-Core ARM Cortex A35
LEC-PX30
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LEC-PX30 based on power-efficient quad-core Arm® Cortex®-A35 SoC is a low-power, low-cost, entry-level, small-sized SMARC rev 2.0 module. For applications, such as IoT controllers, IoT gateways, wearable and mobile industrial devices, basic HMI, sensor concentrators, requiring good computing performance at low power consumption (1.5W- 5W) and Linux Yocto capability, LEC-PX30 is an ideal solution.
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Product
SMARC Short Size Module with Freescale i.MX6 Solo, DualLite, Dual or Quad Core Processor
LEC-iMX6
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The SMARC ("Smart Mobility ARChitecture") is a versatile small form factor computer Module definition targeting applications that require low power, low costs, and high performance. The Modules will typically use ARM SOCs similar or the same as those used in many familiar devices such as tablet computers and smart phones. Alternative low power SOCs and CPUs, such as tablet oriented X86 devices and other RISC CPUs may be used as well. The Module power envelope is typically under 6W.
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Product
NI Real-Time Test Cell Reference System
780590-35
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VeriStand Full Development License with NI Standard Service , Include 1 Year SSP
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Product
COM Express Rev. 3.1 Basic Size Type 7 Module with AMD Embedded Ryzen™ V3000
Express-VR7
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ADLINK’s Express-VR7 COM Express Type 7 Basic size module is based on AMD Embedded Ryzen™ V3000 series processor. Offering up to 8 cores and 16 threads at 15W/45W TDP, the module exhibits the best performance per watt in its class, along with 14x PCIe Gen4 lanes with enterprise level reliability and extreme rugged temperature option (-40°C to 85°C).
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Product
SMARC Short Size Module with NXP i.MX 8M
LEC-iMX8M
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- Quad Arm® Cortex®-A53 and Cortex-M4- Cryptographic co-processor for end-to-end IOT security- Full 4K UltraHD resolution HDMI 2.0a and dual channel LVDS- Two MIPI-CSI-2 camera inputs- 2x GbE LAN (optional TSN support), USB 3.0/2.0 and OTG- Standard or rugged support: 0°C to 60°C or -40°C to 85°C- 15 year product availability
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Product
Computer-On-Module
Qseven®
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Qseven is an off-the-shelf, multi-vendor, computer-on-module that integrates all the core components of a common x86 PC and is mounted onto an application specific carrier board. A single ruggedized 230-pin MXM connector provides the carrier board interface to carry all the I/O signals to and from the Qseven module.
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Product
SMARC Short Size Module with NXP i.MX 8M Plus
LEC-IMX8MP
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ADLINK LEC-IMX8MP, based on the powerful NXP i.MX8M Plus (quad core Arm Cortex-A53) processor with an optional Neural Processing Unit (NPU) operating at up to 2.3 TOPS., is the first SMARC revision 2.1 compliant module focusing on machine learning and vision, advanced multimedia, and industrial IoT with high reliability. Additionally, it supports dual Image Signal Processors and two camera inputs for an effective Vision System. The LEC-IMX8MP is suited for applications such as smart home, building, city and industry 4.0.
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Product
Flexible Cable, 3.5 Mm (Test Port) To 3.5 Mm
85131E
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Achieve phase stability with this 96.5-cm cable when a DUT is connected, with adapter, directly to the test set port
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Product
Computer-On-Module
SMARC
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SMARC form factor is the only computer-on-module form factor that truly is capable of supporting both ARM and x86 designs. With 314-pins on a high speed MXM3 connector, SMARC can fully cover both typical x86 interfaces as well as typical ARM type low level signals. Using ARM SoCs opens the possibility to leverage the product ecosystem of familiar devices such as tablet computers and smart phones. Alternative low power SoCs and CPUs, such as tablet oriented x86 devices and other RISC CPUs may be used as well.
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COM Express Basic Size Type 6 Module with 12th Gen Intel® Core™ Processor (formerly codename: Alder Lake-P)
Express-ADP
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ADLINK’s Express-ADP COM Express Type 6 Basic size module is based on the 12th Gen Intel® Core™ processor and is the first COM Express module to support advanced hybrid architecture with up to 6 Performance-cores (P-cores) for IoT workloads and up to 8 Efficient-cores (E-cores) for background task management, boosting productivity and fueling IoT innovation across a wide variety of deployments.
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Value Family 9th Gen Intel® Core™ i7/i5/i3® Processor-Based Embedded GPU/AI Platforms
MVP-5100-MXM Series
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- 9th Gen Intel® Core™ i7/i5/i3 LGA processor- Dual SODIMMs sockets for up to 32GB DDR4- Abundant I/O: Up to 4x additional DP 1.4 from MXM, 2x DP++, DVI, VGA, 3x GbE, 3x COM, TPM2.0- 3x USB 3.1 Gen 1, 3x USB 2.0- Rich storage options: 2x 2.5" SATA, M.2 2280
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Product
Generator/Analyzer for NFC/EMVCo Manufacturing Test
Micropross MP500 PT1-NFC
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Support for ISO 14443 A/B, ISO 15693, MIFARE™, FeliCa™. Measurement correlation with NFC Forum and EMVCo certification test bench. Automated test executive with ready-to-run test sequences. Reader/Writer and Card Emulation modes, resonance frequency measurements supported on same antenna. Embedded analog measurements - LMA, field strength, S11, Q factor, waveform characteristics. Physical parameter/waveshape characteristic definition
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Product
Cable Free ATE
CABLEFREEATE
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Digalog Systems customizes resources to provide requirements or more cost-effective requirements that are not currently on the market.The CableFreeATE™ technology also affords lower cost and easier integration of some common offerings:- VPC 64 SPST Reed Relay- 0.1" Discrete Header 64 SPST Reed Relay- DL1-156R 72 SPST Reed Relay
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Product
Test Workflow Standard
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Test Workflow equips engineers with application-specific tools so that they can choose the right one for the job—from graphical programing environments to no-code and interactive software applications. Engineers can use Test Workflow software to perform quick ad-hoc tests, build an automated test system, automate data analysis and reporting, develop test sequences, and more.
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Product
NI Automated Test Software Suite
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The NI Automated Test Software Suite features all three NI IDEs and NI's most popular application software and add-ons specifically for building your automated test system with confidence. This package offers the power of LabVIEW, LabWindows/CVI, and Measurement Studio combined with the TestStand ready-to-run, test executive and the Switch Executive intelligent switch management application
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Product
SSD Test Systems
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Enables Rapid SSD Development and Production Ramp with Flexible Test Solution In the high-growth and highly competitive SSD market, a test system that supports multiple protocols can eliminate the need for retooling and achieve faster transitions from one product version — or one product generation — to the next. Advantest SSD Test System allows manufacturers to rapidly grow their product portfolios while remaining adaptable to the many changing needs of the evolving SSD market. This tester improves users’ engineering efficiency with powerful, easy-to-use software tools and a revolutionary multi-protocol hardware architecture, enabling accelerated SSD product development and a faster time-to-manufacturing ramp.
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COM Express Compact Size Type 6 Module with Mobile 7th Gen Intel® Core™ and Celeron® Processors (formerly codename: Kaby Lake)
cExpress-KL
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The cExpress-KL is a COM ExpressR COM.0 R2.1 Type 6 Compact size module featuring the 64-bit 7th Generation Intel® Core™ i7/i5/i3 and IntelR CeleronR Ultra-Low TDP processors (formerly "Kaby Lake U") with CPU, memory controller, graphics processor and I/O hub on a single chip.
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Product
H(3)TRB & HTGB Test Systems
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SET offers two H(3)TRB and HTGB product lines which differ in the number of test object channels and the range of technical possibilities. The innovative systems are scalable, modular and standardized.
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Test System Replication/Build-to-Print
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Need to manufacture test stations? For more than 15 years we have sourced, assembled, tested and shipped fleets of robust, cost-effective solutions. We produce them at our high-volume facilities and deploy them around the world.
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Value Family 6th Generation Intel® Core™ i7/i5/i3 Processor-Based Fanless Embedded Computer
MVP-6000 Series
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ADLINK's newly introduced MVP-6000 Series of fanless embedded computing platforms, incorporating the 6th Generation Intel® Core™ processor (Code name: Skylake), provides one PCIe Gen3 x16, one PCI slot, 1 mini PCIe slot and single-side access for I/O ports, optimizing easy maintenance in industrial automation environments. The series retains the robust design of all ADLINK MXC/MXE lines, at a new extremely cost-effective price point.
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Fastest In-Circuit Test Platform
TestStation
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Teradyne’s TestStation in-circuit test systems provide electronics manufacturers with reliable high-quality, high-volume testing for the latest printed circuit board assembly (PCBA) technologies that are used in automotive, industrial, computing, consumer, communications, and defense end-products.
