Thermal
The radiation of heat.
See Also: Energy, Chemical, Electrical, Nuclear, Electromagnetic, Thermal Shock, Thermal Test, Infrared
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Product
Sensor
Grid-EYE
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The Panasonic Grid-EYE® is a type of thermal imaging sensor that can detect the presence of people or objects based on their heat signature. It consists of an 8x8 grid of 64 thermal sensors, which allows it to provide a detailed temperature map of the area being monitored. The built-in lens has a 60 degree viewing angle. The Grid-EYE features compact surface mount design using MEMS thermopile technology and offers digital output (I2C) for thermal presence, direction, and temperature values.
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Product
Thermal Shock Chamber
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Wewon Environmental Chambers Co, Ltd.
Makes it possible to quickly and autonomously transfer test items back and forth repeatedly between a hot and cold environment.
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Product
COM-HPC Server Type Ice Lake-D Starter Kit
Software Development Kit
The COM-HPC Server Type Starter Kit consists of a COM-HPC Server Type module, memory, and thermal solution of your choice with an extended ATX size COM-HPC Server Type reference carrier board, as well as necessary cabling. It allows you to quickly emulate the functionality of your end product for software development and hardware verification. Carrier board design files (schematics, mechanical drawings), COM-HPC module drivers, BSP, and user manual are also offered to aid you in designing your own custom carrier board.
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Product
Infrared Lens
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Zhejiang ULIRvisionTechnology Co., LTD
Ulirvision offers a wide range of range of infrared lens for infrared thermal imaging camera. Below are our featured thermal infrared lens and key factors need to consider for choosing infrared camera lens.
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Product
Scalable Multi-Channel Active Thermal Control (ATC)
T-Core Thermal Control System
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Cohu’s proprietary T-Core thermal system’s controller provides precise, multi-site temperature management of power dissipation ICs, such as graphic chips and CPUs, optimizing test yield.The T-Core thermal control system optimizes test yield at cold, ambient, and hot temperatures and offers better than +/- 1°C accuracy with response speeds of >125°C/sec. The system’s flexibility to control air, liquid, and refrigerant based thermal heads gives semiconductor manufacturers excellent temperature control capability for high volume manufacturing.
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Product
Multi-Mission EO/IR Surveillance Sensor
Star SAFIRE® III
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With thousands of systems fielded, the Star SAFIRE III provides extremely reliable high performance. Along with superior image stabilization and long-range imaging, Star SAFIRE III features internal navigation for precise targeting, MWIR thermal imager, optional EO color and low-light cameras, and multiple laser payload options. The system is fully hardened for military fixed-wing and helicopter operations, and it operates continuously in all conditions – even while sitting on the tarmac with no airflow.
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Product
Singlebeam Hydrographic Echosounders
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Teledyne Marine Odom Hydrographic
Odom Hydrographic provides an extensive range of hydrographic level single beam echosounders with the flexibility of frequency agility supporting existing transducer installations. Models include modern PC screen based interfaces as well as support for tried and tested thermal record printing.
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Product
Science-Grade MWIR InSb Camera
FLIR A6700 MWIR
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Designed for electronics inspections, manufacturing monitoring, scientific research, and non-destructive testing, the FLIR A6700 MWIR camera is ideal for high-speed thermal events and fast-moving targets. Short exposure times allow users to freeze motion and achieve accurate temperature measurements. In fact, the camera’s image output can be windowed to increase frame rates to 480 frames per second to accurately characterize even higher speed thermal events, helping ensure critical data doesn’t get missed during testing.
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Product
AC Load Bank (Resistive)
K-1000 Resisitive
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Kongter Test & Measurement Co., Limited
The kW of a resistive load bank is “real” power in electrical terms. When a resistive AC load bank is used to test an engine generator set the engine will produce its full horsepower rating, dissipate engine exhaust gases, and produce thermal energy into the engine cooling system. The resistive load bank in fact, will completely test the engine and its various systems.
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Product
Thermal Conductivity Measuring Device
TCM1001
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In recent years, there has been a demand for small and thin electronic products such as mobile devices, and printed circuit boards are shifting to thin, multi-layered, and even modularized printed circuit boards. effect of bonding materials, that is, the ability to easily conduct heat, is emphasized, and testing equipment that evaluates thermal conductivity is required .As a business of our company, we have mainly manufactured and sold test equipment for solder wettability tests and solder bonding strength, but there was a need to urgently develop next-generation bonding material test equipment to replace these. Under these circumstances, we received a request from an academic research facility to manufacture a device that can measure the thermal conductivity of conductive adhesives under research and development, and we were able to obtain an opportunity to develop the device. We proceeded with the development based on these requirements .
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Product
Digital Image Correlation System for Complete 3D Warpage, Thermal Expansion, and Strain Analysis of Materials and Components in the Heating and Cooling Phase
Q-400 TCT
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The Q-400 TCT system is designed for complete three-dimensional and highly sensitive warpage, thermal expansion measurement and strain analysis of materials and components in the heating and cooling phase. Areas from 50 mm x 70 mm down to 2 mm x 3 mm can be investigated. Measurements can be done from room temperature up to 300°C and down to -40°C. The system is specially suited for thermal expansion measurement of electronic components and is frequently used in the development and testing of complex anisotropic materials, components, and structures in electronic applications.
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Product
microDXP
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The microDXP is a complete, low power compact digital spectroscopy card design for a wide range of handheld, benchtop and other embedded applications, lowering cost and speeding time-to-market. Its small size allows for very compact assemblies and its low power consumption assures thermal stability and extended battery life.
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Product
CPCI/PICMG 2.16 Intel Core 17th Gen. System
CP6004-RA_RC
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The CP6004-RA/RC, a CompactPCI PICMG 2.16 compliant 6U CPU board, comes with various rugged levels, making it yet another addition to Kontron’s rugged PICMG 2.16 portfolio.Based on the Intel® Core™ i7 third generation processor and the QM77 platform controller hub, the CP6004-RA/RC is featured by dual or quad core computing performance at a reasonable thermal design power, including a complete set of data, communication and multimedia interfaces.
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Circuit Breaker Testing Equipment
HISAC Swift
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HISAC Swift - Circuit Breaker Operational Analyser is meant for checking the performance of the MV Circuit Breakers. The Analyser contains various intelligent measuring modules designed for measuring parameters such as contact timings of Main/PIR & Auxiliary contacts, Close/Trip Coil Current characteristics and Static Contact Resistance of R, Y & B poles simultaneously. The results can be directly viewed on the TFT touch screen display in graphical as well as numerical form. It is possible to print the graph on a built-in thermal printer or download record to PC for further analysis on CPLOT software. This all in one instrument is best suited for gang operated CBs.
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Product
Thermal Shock Chamber
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Sanwood Environmental Chambers Co ., Ltd.
Three zone thermal shock chamber uses the test material structure or composite material to withstand the degree of extreme high temperature and low temperature in a continuous environment in an instant, so as to test the chemical changes or physical damage caused by thermal expansion and contraction in the shortest time.
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Product
Long Wave Infrared Cameras
Calibir DXM640 Series
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The Calibir uncooled Long Wave Infrared camera platform offers outstanding shutterless imaging performance and is optimized for Size, Weight and Power (SWAP). The Calibir DXM640 series features both shutter and shutterless operation and rapid image output on power up while delivering uniform response over the entire operating temperature range, making it ideal for thermal imaging applications requiring uninterrupted image acquisition. ULIS’s gen2 sensor offers an improved NETD and the updated calibration include customized gain correction on a per lens basis to offer even better image performances and response uniformity.
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Product
kSA BandiT
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The kSA BandiT is a non-contact, non-invasive, real-time, absolute wafer and thin-film temperature monitor used during thin-film deposition and thermal processing.
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Product
2 Zone Thermal Shock Test Chamber
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2-Zone Thermal Shock Testing Equipment with programmable electronics.
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Product
Thermal Imaging Camera Attachment for iOS and Android
FLIR ONE
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Explore the world around you in ways you never thought possible. Simply attach FLIR ONE to your smartphone or tablet and experience a new vision of the world. FLIR ONE offers non-contact spot temperature measurement, patented MSX Technology, and automatic shuttering. Plus, the FLIR ONE App offers thermal panoramas and timelapse. FLIR ONE features both FLIR's revolutionary Lepton thermal camera and a VGA visible light camera. Using MSX Technology, FLIR ONE blends images from both cameras to create thermal images with enhanced detail and resolution.
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Product
Thermitest
THW-L2
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Designed with speed and operational simplicity in mind, the Transient Hot Wire (THW-L2) Liquid Thermal Conductivity Meter is an advanced measurement system for direct determination of the thermal conductivity of liquids and pastes in accordance with ASTM D7896-19. In less than 2 seconds, a single measurement of small volumes of liquids and pastes can be accurately and precisely measured for thermal conductivity. Using a non-stationary measurement approach, the THW-L2 uses rapid test times to limit convective effects for samples with a wide range of viscosities. The THW sensor consists of a 60 mm heating wire that is fully inserted into an isothermal sample. A constant current source (q) is used to heat the sensor wire and the temperature rise is recorded by monitoring the change in electrical resistance of the wire. The slope (m) is determined from the plot of temperature rise vs. logarithm of time and is used in the calculation of thermal conductivity (λ). Liquid samples of high thermal conductivity will have a lower slope, while liquid samples with low thermal conductivity will have a higher slope.
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Product
Fanless Embedded System With Intel® Celeron® 2980U/ Core™ I5-4300U/i3-5010U ULT SoC, HDMI/DisplayPort, 2 GbE LANs, 4 USB 3.0, 2 COM And PCIe Mini Card
eBOX560-880-FL
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The eBOX560-880-FL, a palm-sized, fanless embedded computing system utilizes high performance Intel® Haswell ULT multi-core SoC. The ultra-compact, ultra-lightweight eBOX560-880-FL adopts an IP40-rated rugged aluminum cold-rolled steel enclosure to withstand vibration of up to 3 Grms (with SSD) and has a unique thermal solution to support the temperature range from -20°C to +50°C (-4°F to +122°F). Supporting 4K2K resolution via HDMI interface, the outstanding embedded box computer is ideal for passenger information system, Kiosk, entry-level gaming, video surveillance, and other automation & embedded applications.
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Temperature Measurement IR Sensors & Detectors
ST150 With Diffractive Lens
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A single-channel silicon-based thermopile with integrated diffractive lens and internal baffle that delivers a very low Temperature Coefficient of Responsivity of -0.04%/C with a high output voltage, 19.5 FOV and a quick time constant of 38ms. This Low-cost detector comes in a TO-5 package and has a very short thermal shock response to ambient temperature change.
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Product
Mobile PCI Express Module with NVIDIA® Quadro® Embedded P5000
EGX-MXM-P5000
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Meeting the needs of embedded, ruggedized, and mobile system builders, ADLINK's EGX-MXM-P5000 Embedded MXM GPU Modules utilizes Quadro Pascal architecture to deliver superior graphics and computing performance. The EGX-MXM-P5000 is specifically purposed to accommodate form factors incompatible with conventional PCI Express cards, and is built to maintain operations under a wide range of thermal and other environmental conditions. It’s the ideal choice for blade-based and other deployments where high GPU density is critical, with a choice of GPU memory capacity, extremely reasonable power requirements, and flexible display options.
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Product
Thermal Load Boards
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Thermal Engineering Associates, Inc.
A Thermal Load Board (TLB) is used to simulate an application printed circuit assembly (PCA) either before all the heat-producing components are available for mounting on the application PCA or if the heat-producing components require complex electronic circuitry to create heat within the components. The TLB is typically designed to be as mechanically and thermally equivalent to the application PCA and usually offers a way to vary the power dissipation of the elements that simulate the heat-producing components.
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Product
Thermal Control and Monitoring
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Harmonize and control your entire data center thermal management system to achieve up to 50% higher efficiency, improve protection and security and enhance staff productivity.
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Product
*High-Power Beam Profiling
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Beam analysis of high-powered industrial lasers have always proved to be difficult because of the power levels (affecting the power densities) that these lasers operate at. Yet, the measurement of these lasers are critical for their success because of thermal effects which are more of a factor at these higher powers. These high-power performance measurement products have proven to be solutions for laser users who operate and maintain these high-powered lasers
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Product
Metal Cored PCB
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Teledyne Labtech is at the forefront of complex metal-cored PCB design and manufacture. The PCB use a thin metal core <2 mm, which acts as isolation between the RF/Microwave circuit and the Analogue/Digital circuitry and creates an excellent thermal path.The major advantages are reduced size and no need for complex microwave feed-thru's. The ability to laser cut pockets allows the designer engineer to mount the high power MMIC directly on to the metal core.
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Non-Destructive Testing (NDT)
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Marposs complements its geometric measurement solutions with solutions for non-destructive testing using eddy current technology.The testing options can be divided in three large groups:Material integrity test, to check for the presence of defects (cracks, porosity, blow holes, inclusions) on the surface and in the layer just below the surface.Material properties test, to check if the thermal cycles (hardening, hardening and tempering, annealing, stress relieving, etc.) have been performed correctly. Material identification checks are done to sort parts with the same geometry but made with different materials.Thread inspection to check if the treading has been carried out and its quality.In addition to the non-destructive checks performed with the eddy currents, we have developed a durometer for the conventional measurement of surface hardness, according to the Rockwell scale (HRC or HRA); which uses a diamond penetrator to measure the hardness of the sample being tested.
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Product
40 Channel Low Thermal Relay Multiplexer Module
DP-cPCI-4017
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DP-cPCI-4017 is a 40 Channel Relay Multiplexer module constructed using ‘2 Form A’ relays. The DP-cPCI-4017 is implemented as a 6U cPCI module. As a 40 channel multiplexer, one input can be multiplexed to any of the forty outputs or vice versa. The forty channel multiplexer is divided into 4 banks of 10 channels each. This combination allows the board to be used as one group of 40x1 or two groups of 20x1 or four groups of 10x1 multiplexer. The banks are isolated from each other using tree switches. Four tree switches are used, one tree switch for each bank.
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Product
Thermal Vacuum Data Acquisition and Control Software
TVAC 7000
Data Acquisition Module
Equipment used in space applications needs to go through stringent environmental tests in order to prove that it can survive the extreme conditions experienced during launch and while in space. Some of the key environmental tests include vibration, thermal vacuum, and electromagnetic compatibility. Thermal vacuum test is crucial to confirm the equipment is able to operate under the space vacuum condition.
