Test Sockets
provide electro mechano connection between DUT and ATE in hand testing applications.
See Also: BGA Test Sockets, Burn-In Sockets
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Test Sockets
QFN/QFP
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For today’s chipscale packages, finding the right socket solution can be challenging. With SC™ sockets from Ardent, you can count on the right design, the best performance, and quick turns for even the most challenging custom designs
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Test Sockets
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socket design as per customer specificationsquick + easy socket changehigh-performance spring probesdesigned for high frequency up to 16 GHz-55C/-67F to 150C/302F temperature rangemanual/automatic application optionssmall socket footprintone socket base for each insert (3x3 to 9x9 QFN)one-click switch from engineering to production socket modedevice dependent standard socket frame with changeable insertmore than 500,000 compression cyclesKelvin test applicabilitytool-free insert + actuator exchanges0.3 mm minimum lead pitchQFP extender available
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Test Sockets
MEMS Device
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Patented MEMS Sockets from Ardent Concepts use a unique scrubbing action contact set which is ideal for today’s sensitive MEMS devices, including accelerometers, gyroscopes, MEMS microphones and other specialized devices used in mobile electronics applications
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Test Sockets
Non Standard
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Chances are good Ardent can help you with that. We can adapt our technology to just about any package, device or module. Small volumes of custom sockets for higher bandwidth applications are a niche all in their own, and our engineering team has many years of experience designing custom sockets for all kinds of applications.
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MultiSite Test sockets and Wafer Level
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multi-site sockets include anything from strip test sockets to test sockets for wafer test to multi-position, singulated devices. The advantages of these sockets can be enormous as test time can be decreased by a factor of ten over conventional one up testing. In most cases, the throughput is only limited by tester capabilities and/or handling capacity.
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Test Sockets
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Yamaichi Electronics Co., Ltd.
A test socket is the ideal point to test your home’s internal phone wiring for faults. You can also use it to identify any potential faults with the phone line outside. Your test socket is located in your master socket. It is the point between the internal phone wiring in your house and the phone line outside. That means by plugging into your test socket you can bypass all the internal wiring and test your device directly on the phone line.
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Socket Probes
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A lot of companies build test sockets. But only our test sockets are populated with our own proprietary probe technology, developed internally. This assures you that when you purchase one of our test sockets, you are using the most advanced interconnect available.
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Universal PLCC ZIF (Zero-Insertion-Force) Test Socket
Series 537
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Universal PLCC ZIF Test Socket Live Bug Type. This Universal PLCC ZIF (zero insertion force) Test Socket will take seven sizes of PLCC footprints with Aries insert plate, Part No. XX-537-20. Data Sheet No. 10012, available seperately.
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USB SOCKET TESTER
MDPPTSTUSB
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*Provides the user with a simple way to test a USB socket on a vehicle*Mini probe will light up when 4.4V - 5.25V is detected
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Flex Socket Test Module
JT 2127/Flex Socket Test Module
Test Module
The JT 2127/Flex STM memory socket tester is a family of hardware adapters specifically designed for the testing of of PCB-mounted DIMM & SODIMM sockets using a JTAG/boundary-scan controller and supporting software. The testing of memory sockets has always been troublesome for test and production engineers using JTAG/boundary-scan systems. Even when it is possible to create memory writes/reads from a boundary-scan compliant access device on the UUT (Unit Under Test), the initialization process may fail leaving you with little diagnostics information. What’s more it can still be uncertain whether fault lays with the DIMM module itself or the socket. Using the new JT 2127-Flex system from JTAG Technologies you get pin-point diagnostics from a known-good test interface so you can be certain that your socket is soldered correctly.
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RF Socket
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With unparalleled technology, coaxial structure, and high-precision machining equipment, LEENO can provide RF test socket with high bandwidth, impedance matching and high frequency up to 40GHz.
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Test Contactor/WLCSP Probe Head
ACE
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ACE™ test sockets offer optimal RF performance for fine pitch FBGA, QFN and wafer-level packages for Power Amplifiers, RF switches and mobile communications. Supporting pitches down to 0.4 mm, ACE features an innovative design that provides superior performance, improved yields and power efficiency.ACE probe heads deliver exceptional electrical performance, both DC and RF. Manufactured from HyperCore™ base material, a proprietary material of Cohu’s Everett Charles Technologies, ACE probes have the electrical properties of BeCu with the non-oxidizing properties of a precious metal. The short signal path, sharp tips, and large contact area between plungers provide high current conductance and reliable contact with less force.
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Universal ZIF (Zero-Insertion-Force) DIP Test Socket
Series X55X
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Universal Zero Insertion Force DIP Test Socket. All pin count sockets go into PCB with either .300 or .600 [7.62 to 15.24] centers. Sockets can be soldered into PCBs or plugged into any socket. Socket fits into Aries or any competitive test socket receptacle.
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Universal SOIC-to-0.600 [15.24] DIP Adaptor
Series 647
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Universal SOIC to .600 [15.24] DIP Adapter. 44 pin adapter for mounting Aries Series 547 Universal SOIC ZIF (zero insertion force) Test Socket to .600 [15.24] DIP PCB layout. Consult Data Sheet No. 10015 for test socket information.
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Test Socket Based Elastomeric Matrix Connectors
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Z-Axis offers a wide range of high performance test sockets, which are based on our elastomeric matrix connectors, for wide range of IC packages (BGA sockets, LGA sockets, etc.), coaxical, and wafer level; and for testing high speed, digital, analog, and RF signals etc.
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Burn-In Test
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C.C.P. Contact Probes Co., LTD.
Customized Burn-In Test Sockets for temperatures of up to 180°C.
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Transformer Rated Pre-Wired Meter Enclosures
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TESCO Transformer-Rated Pre-Wired Meter Enclosures are built with the TESCO tradition of quality and durability. TESCO enclosures are designed for use in commercial and industrial metering installations where voltage ratings of 480 and above are required. The enclosures are available with ringless, single piece or two piece covers and can be pre-wired between the test switch and socket to meet your exact specifications.
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Passive Component ATS
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Test and packing speeds from 80ppm to1,800ppmStandard functions - Inductance/quality factor test - Winding resistance test - Polarity testOptional functions - Layer short test - Insulation resistance test - Bias current testCircular vibrating plate design feeds inductors steadily and rapidlyIndex disc design eliminates dropped inductorsFour-wire measurement test socket designAutomatic discharge mechanism when feeding errors occurEach test station has an independent NG (No Good) product collection boxTest without packaging function provided, good products gathered in bulk collection boxExclusive data collection software designed for monitoring product quality in real timeReserved stations for number spraying and automatic optical inspectionSwitchable Chinese/English/Japanese operating interfaceEquipment is fast, stable and safe
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Fuel Display Unit Tester
MS 1125
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Fuel Display Unit Test Bench is a compact table-top test bench with front panel controls, indications, built-in signal simulator and necessary power supply for testing the serviceability of Fuel Display Unit of Helicopter. FTB operates on 230 V AC and supplies 28 V DC power to FDU. FTB is housed in a metallic cabinet FTB interfaces with both 61 Pin connector and 6-pin socket mounted on the rear panel of FDU by means of the cable connected to the unit. FTB is fabricated utilizing off-the-shelf standard industrial/commercial components like rotary switches, toggle switches, press switches, test sockets, fuse holders, potentiometer etc. The Frequency generation circuit is integrated into FTB for the simulation of Fuel probe and flow rate signals. The frequency of the signal can be selected by means of a rotary switch Low amplitude sine wave signal is simulated for testing flow rates. Variable voltage DC power supply with a voltage range of 24 to 29 Volts is provided within FTB to power-up FDU. 5 V DC is provided for the operation of signal generating circuit (PIC Frequency Controller Board). An off-the-shelf Hand held battery operated Digital Multimeter (DMM) procured from the prominent manufacturer (FLUKE) is supplied with FTB for setting up and measurement of various parameters like Resistance, Voltage, Frequency etc.
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Universal Test Socket Receptacle
Series 6556
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Universal Test Socket Receptacle. The Aries Universal Test Socket Receptacle is sturdy, open frame, and easily mounted to PC boards. Allows for easy replacement of Aries and other manufacturers test sockets. A choice of four collet pin styles makes the receptacle useful for any interconnection method.
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Grypper G35 / G40
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*Package-size PCB footprint: Since the PCB footprint of Grypper is identical to the package, only one PCB design is required, enabling a seamless transition from test and validation through production and reducing overall cost of test*Low insertion force: Unique contact design reduces the insertion force required to insert and retain higher-ball-count packages safely and securely within the test socket*Oxide cutting wipe action: The contact design wipes the side of the solder ball during insertion, breaking through solder oxides ensuring a good electrical connection between contact and solder ball*Signal integrity: A short signal path achieves low inductance and low insertion loss, providing a nearly invisible electrical connection*Test socket has solder balls attached: The G40 contacts have solder balls reflowed onto the contacts to ensure reliable solder volume at the PCB to test socket solder interface.
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Manual Test Press Fixture
750/752 Series
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RTI's manual test presses are compact, portable, all-inclusive, and easy to use. Single lever operation and 100% vertical compression makes the manual test press an ideal solution for PCB, hybrid module, and high pin count device-level testing when complex test requirements cannot be met with a test socket and breakout board alone.
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Test Contactors/Probe Heads
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Cohu's line of test contactors, test sockets, and probe heads.
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Custom Test Connectors and Sockets
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Custom test sockets are traditionally expensive to build and maintain. To reduce these costs, consider: Using rapid prototyping techniques to build a housing. Using replaceable Z-Axis Connectors. Depending on board layouts and compressed height, these sockets or test fixtures can achieve high numbers of mate/de-mate cycles and operate at GHz frequencies.
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Grypper G80 / G80 LIF
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*Package-size PCB footprint: Since the PCB footprint of G80 is identical to the package, only one PCB design is required, enabling a seamless transition from test and validation through production and reducing overall cost of test*Low insertion force: Unique contact design reduces the insertion force required to insert and retain higher-ball-count packages safely and securely within the test socket*No lid required: The package snaps directly without a lid, enabling easy probing, scoping and troubleshooting the topside of the device*Excellent signal performance: A short signal path achieves low inductance and low insertion loss, providing a nearly invisible electrical connection
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Single Phase Round Energy Meter Test Bench Type KP-S1000-C
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Bofa Instrument & Equipment Co., Ltd
Single phase round energy meter test bench, type KP-S1000-C, is a special calibration equipment for testing Round (ANSI Socket type) energy meter and normal energy meter with bottom terminal block. It is an ideal testing equipment for energy meter factory or R&D institute, especially for testing ANSI Socket type energy meters. All the testing procedures can be automatically operated by PC or by Keyboard manually.
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Universal SOIC ZIF (Zero-Insertion-Force) Test Socket
Series 547
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Universal SOIC Zero Insertion Force Test Socket. Devices with up to 44 pins can be inserted without bending or otherwise damaging the legs, since no force is required to either insert or remove the component from the socket. Accepts SOIC gull-wing and J-lead devices, up to 44 pins on .050 [1.27] lead pitch, body widths from .150 to .600 [3.81 to 15.24].
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Boundary-Scan DIMM Socket Tester
ScanDIMM
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Maximizing test coverage is an important piece in test procedure development. Unfortunately, not all designs have the necessary requirements in place to accommodate boundary-scan test methods on memory devices. ScanDIMM digital socket test modules are designed to overcome such limitations when testing DIMM sockets utilizing boundary-scan test techniques.ScanDIMM modules provide the capability to instantly turn any DIMM socket into a fully compliant IEEE-1149.1 device. Integration is as simple as assigning the included BSDL file to the reference designator of the target socket and compiling test vectors.In multi-socket systems, multiple ScanDIMM modules can be linked to provide even greater boundary-scan test depth.
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General Final Test
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C.C.P. Contact Probes Co., LTD.
CCP designs and manufactures custom made test sockets.
