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Product
Semiconductor
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Engineered ceramics are used in the semiconductor industry because of their excellent material properties. Ultra-pure ceramics are often used in the whole cycle of semiconductor manufacturing including Semiconductor Wafer & Wafer Processing, Semiconductor Fabrication (Front End), and Semiconductor Packaging (Back End).
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Product
32-lane, 32-port, PCI Express
PEX89032
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The new PCIe Gen 5.0 (32 GT/s) PEX89000 series builds on the longevity of the Broadcom series of switches, now spanning 13 families. The PEX89000 family allows customers to build systems from simple PCIe connectivity inside the box to high-performance, low-latency, scalable, cost-effective PCIe fabrics for composable hyper-scale compute systems supporting ML/AI and Server/Storage applications.
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Product
Multilayer PCB
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ultilayer circuit boards were essential in the advancement of modern computing. The multilayer PCB basic construction and fabrication are similar to micro chip fabrication on a macro size. The range of material combinations is extensive from basic epoxy glass to exotic ceramic fills. Multilayer can be built on ceramic, copper, and aluminum. Blind and buried vias are commonly produced, along with pad on via technology.
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Product
81 lane, 21 port, PCI Express
PEX 9781
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Broadcom has extended the reach of PCIe for use as a fabric for data center and cloud computing through its ExpressFabric initiative and platform of hardware and software. ExpressFabric can eliminate expensive bridging devices within the rack, such as adapter cards that translate native PCIe to Ethernet and back to PCIe.
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Product
Brush or Sponge Pilling Tester
TF222
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TESTEX Testing Equipment Systems Ltd.
Brush or Sponge Pilling Tester, to determine the pilling propensity and simulate normal wear of knitted and woven fabrics used in apparel and automotive interiors by brush and/or sponging specimens together in a circular motion to form pills. Specimens are evaluated under standard lighting conditions using a pilliscope, light cabinet or similar, against users’ standard fabrics or piling photographs.
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Product
Broadcasting & Wireless Colocation
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LBA Technology™ specializes in providing radio broadcasting equipment for AM and DRM medium wave stations worldwide. We design, fabricate, and market radio frequency equipment to complement AM and medium wave transmitters and transmitting plants. Our systems make AM radio towers and masts more effective and efficient.
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Product
20μm Transparent Quartz Interdigitated Electrode (IDE)
TIE1
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20 μm transparent interdigitated electrode (IDE) fabricated on a high-quality quartz substrate for MEMS sensors, gas sensing, biosensing, optoelectronic detection, and electrochemical research. Manufactured using precision microfabrication with customizable electrode materials, dimensions, and layouts for laboratory, sensor development, and OEM applications.
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Product
Supply Chain Management
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200 Customers100 Active SuppliersPurchasing for 60 material classifications including such materials as:a) IC, Resisters, Capacitors, Wire, Cable, Power Suppliesb) Connectors, Converters, Diodes, Fuses, Fabricated partsc) Inductors, Relays, Switches, Hardware
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Product
Gen-Z
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Gen-Z is a data-access technology designed to provide high-speed, low-latency, memory-semantic access to data and devices via direct-attached, switched or fabric topologies. Gen-Z components use low-latency read and write operations to directly access data and use a variety of advanced operations to move data with minimal application or processor involvement. Gen-Z fabric utilizes memory-semantic communications to move data between memories on different components with minimal overhead. Memory-semantic communications are extremely efficient and simple, which is critical to delivering optimal performance and power consumption. Teledyne LeCroy provides protocol analysis and error injection test equipment to support development and debug of Gen-Z based devices
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Product
L-Band RF Tuner and 2-Channel 500 MHz A/D with Virtex-7 FPGA - XMC
Model 71791
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- Accepts RF Signals from 925 MHz to 2175 MHz- Programmable LNA handles L-Band input signal levels from -50 dBm to +10 dBm- Programmable analog downconverter provides IF or I+Q baseband signals at frequencies up to 123 MHz- Two 500 MHz 12-bit A/Ds digitize IF or I+Q signals synchronously; optional: 400 MHz 14-bit A/Ds- Two FPGA-based multiband digital downconverters- Xilinx Virtex-7 VX330T or VX690T FPGAs- 4 GB of DDR3 SDRAM- Sample clock synchronization to an external system reference- PCI Express (Gen. 1, 2 & 3) interface, up to x8- Clock/sync bus for multimodule synchronization- VITA 42.0 XMC compatible with switched fabric interfaces- Optional user-configurable gigabit serial interface- Optional LVDS connections to the Virtex-7 FPGA for custom I/O
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Product
Course Length Tester
TF124
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TESTEX Testing Equipment Systems Ltd.
Course Length Tester, to determine the accurate length of a complete course of knitted fabric. When the yarn is attached to the clamp and wound round the pulleys, the length indicated on the ruler by the weighted clamp is added to that indicated on the appropriate location in use to give the total length of yarn.
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Product
Hand-held Textile Moisture Meter
TF123B
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TESTEX Testing Equipment Systems Ltd.
Hand-held Textile Moisture Meter, widely used in leather materials, fabrics, garments, yarn, axis, cheese, textiles and other industries that need rapid determination of moisture (moisture regain).
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Product
Impedance Measurement
CITS880s
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Finer geometries and thinner copper can present a challenge for fabricators measuring impedance on leading edge PCBs. The CITS880s answers that challenge with the introduction of Launch Point Extrapolation (LPE). LPE extrapolates the TDR response back to a point close to the start of the transmission line effectively allowing to users more accurately to measure the instantaneous or incident impedance of the line.
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Product
Copper Pillar Bump
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Like in conventional fabrication, integrated circuits are created on the wafer but near the end of the manufacturing process, the attachment pads are metalized on the surface of the chips to make them more receptive to solder. Then solder dots are deposited on each of the pads, and chips are cut, flipped, and positioned so that the solder balls are facing the connectors on the external circuitry.
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Product
Growler Tester
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Being the reckoned names in the industry, we offer wide range of Growler Tester that are fabricated using"very high quality raw material which ensures high durability at its user end. These armature growler tester are widely finds its application in industrial and commercial sectors. They are light in weight and ensure performance based. Furthermore, we offer them at most affordable rates.
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Product
Fabric Unidirectional Water Transmission Performance Tester
DRK-UPT1
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Shandong Drick Instruments Co., Ltd.
The unidirectional water transmission performance tester is a special instrument for measuring the unidirectional water transmission performance of textiles.
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Product
Magnetic Field Sensors
SpinTJ
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The SpinTJ magnetic sensor family builds upon Micro Magnetics? in-house expertise developing low-field magnetic tunnel junction sensor products. Based on our proprietary fabrication processes, we have developed patented recipes for fabricating macroscopic, micron-scale, and submicron MTJ field sensors.
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Product
Rainproof Tester
TF161
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TESTEX Testing Equipment Systems Ltd.
Rainproof Tester, to determine the penetration resistance of fabrics or composites at different intensities of water impact. Simulated rain horizontally impacts fabric samples mounted vertically in a stainless steel bath. Samples are backed with a standardized blotting paper, which is weighed before and after each test. The rain is formed by a column of water, which can be adjusted from 600mm to 2400mm.
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Product
Paper-Based Screen-Printed Electrode (Paper-Based SPE Sensor)
ZPE1
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A paper-based screen-printed electrode (SPE) for electrochemical analysis, biosensor research, and rapid diagnostic applications, offering low-cost fabrication, excellent reproducibility, and convenient disposable use.
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Product
Textile Testing Equipment
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Manufacture and supply a wide range of textile testing equipments. Our machines all meet with: ISO, ASTM, AATCC, BS, EN, DIN, JIS and other requireable standards. Yarn, Fiber and fabric testers. Strength, Abrasion, pilling, flammability fatigue, peeling, appearance, etc. testing.
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Product
Mechanical Yarn Package Density Tester
Y016A
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To measure the hardness of yarn cones or beams of yarn or fabric
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Product
49 lane, 13 port, PCI Express
PEX 9749
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Broadcom has extended the reach of PCIe for use as a fabric for data center and cloud computing through its ExpressFabric initiative and platform of hardware and software. ExpressFabric can eliminate expensive bridging devices within the rack, such as adapter cards that translate native PCIe to Ethernet and back to PCIe.
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Product
Intel® Xeon® E3 Quad-Core 10 Gigabit Ethernet AdvancedTCA® Processor Blade
aTCA-9300
Processor Blade
The ADLINK aTCA-9300 is a high performance AdvancedTCAR (ATCA) processor blade featuring dual 4-core IntelR XeonR processor E3 1275V2 /1225V2, IntelR C216 Chipset, four channel memory up to 32 GB of DDR3 memory and 300 W power supply subsystem. Versatile connectivity includes dual 10GbE Fabric Interfaces, dual GbE Base Interfaces, quad front panel GbE egress ports, front panel dual COM and USB 2.0 ports and front panel VGA connector. An onboard SATA connector supports CFast up to 32 GB and the optional RTM (aTCA-R6270/R6280) supports an 8-channel mini-SAS port, dual 10GbE SFP+ ports, dual USB ports and dual hot-swappable SATA bays providing additional network throughput and storage capacities.
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Product
Custom Testing
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You create a custom test plan (a file that lists a series of tests to be run), to meet requirements specific to your environment and apply that test plan to any number of clusters. You specify the order in which tests run and the specific components to be tested. After you set up your custom test environment, you run the test procedure from SMIT and view test results in SMIT and in the Cluster Test Tool log file. For information about customized testing, see Setting up custom cluster testing.*Fixture Design*Fixture Fabrication*Custom Test Stands*Prototype Testing Services*Product Safety Testing Services
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Product
CCD Foundry Services
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Teledyne DALSA Semiconductor’s 150mm CCD process offers surface or buried channel operation at up to 15V with two or three layers of polysilicon and one, two or three layers of metal. A modular processing approach allows our foundry customers to adjust process parameters to meet the most demanding requirements for CTE (>99.999%), charge storage capacity, and dark current (<1nA/cm2). The base process uses 1X projection lithography with 2.5µm design rules, allowing die sizes of up to 100mm X 100mm. Where required, tighter alignment tolerances and smaller feature sizes can be obtained by using 5X lithography, using a mix and match or all-stepper approach. The maximum die size attainable with the stepper is 22mm X 22mm, but larger sensors can be fabricated using stitching.
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Product
Software Module with a Virtual Gage for Real-Time Inspection and Assembly
Verisurf Build
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Verisurf BUILD is the industry-leading tool for real-time model-based inspection, tool fabrication, and computer-aided assembly.Inspect position and profile, set details and fabricate tools, jigs, and fixtures faster and at lower cost than any other process or software.Evolved and perfected from a large installed base at today’s modern aerospace, automotive, and industrial tooling manufacturers.
