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Hot Embossing Systems
EV Group’s series of high-precision hot embossing systems are based on the company’s market-leading wafer bonding technology. Excellent pressure and temperature control as well as uniformity over large areas allow for high accuracy imprints. Hot embossing is a cost-effective and flexible fabrication technology with very high replication accuracy for feature sizes down to 50 nm. The systems are well suited for embossing complex micro- and nanostructures and high-aspect ratio features into a wide range of polymer substrates or spin-on-polymers. The combination with stamp-to-substrate alignment allows alignment of hot embossing to pre-processed substrate structures.
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SmartPower® Microwave Power Generators
AX2500
SmartPower® AX2500 Series intelligent microwave power generators build on ASTeX's experience in producing rugged, reliable microwave power generators for demanding semiconductor fabrication and industrial applications. The AX2500 design architecture incorporates the best of ASTeX field-proven technology, and combines new design features aimed at improved performance and lower cost of ownership.
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Software Module with a Virtual Gage for Real-Time Inspection and Assembly
Verisurf Build
Verisurf BUILD is the industry-leading tool for real-time model-based inspection, tool fabrication, and computer-aided assembly.Inspect position and profile, set details and fabricate tools, jigs, and fixtures faster and at lower cost than any other process or software.Evolved and perfected from a large installed base at today’s modern aerospace, automotive, and industrial tooling manufacturers.
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Static Honest Meter
Sataton Instruments Technology CO., Ltd
Static honest meter is professional designed to determine the attenuation of static electricity, corona discharge time, static voltage attenuation half-life, static decay curve and other electric property of fiber, yarn, fabric, textile or plate materials. It is suitable for measuring the diffusibility of static in the testing samples.
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Solid Plastic Portable Gage
100
Dwyer solid plastic portable manometers are precision instruments in inclined and vertical (well-type) styles for the measurement of static pressure, vacuum or differential pressure. To assure the accuracy required in instruments of this type, all machining of bores and wells is to the highest standards of precision backed by Dwyer's years of experience in the fabrication of acrylic instruments.
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4-Channel 200 MHz A/D with DDC, Virtex-7 FPGA - XMC
Model 71761
- Complete radar and software radio interface solution- Supports Xilinx Virtex-7 VXT FPGAs- GateXpress supports dynamic FPGA reconfiguration across PCIe- Four 200 MHz 16-bit A/Ds- Four multiband DDCs (digital downconverters)- Multiboard programmable beamformer- 4 GB of DDR3 SDRAM- Sample clock synchronization to an external system reference- LVPECL clock/sync bus for multimodule synchronization- PCI Express (Gen. 1, 2 & 3) interface up to x8- VITA 42.0 XMC compatible with switched fabric interfaces- Optional LVDS connections to the Virtex-7 FPGA for custom I/O- Supports GateXpress® FPGA-PCIe Configuration Manager- Synchronize up to eight modules with Model 7893 System Synchronization and Distribution Amplifier - PCIe
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4-Channel 200 MHz, 16-bit A/D with Virtex-6 FPGA - 3U VPX
Model 52660
- Complete radar and software radio interface solution- Supports Xilinx Virtex-6 LXT and SXT FPGAs- Supports gigabit serial fabrics including PCI Express, Serial RapidIO and Xilinx Aurora- Four 200 MHz 16-bit A/Ds- Up to 2 GB of DDR3 SDRAM or 32 MB of QDRII+ SRAM- Sample clock synchronization to an external system reference- LVPECL clock/sync bus for multiboard synchronization- Optional LVDS connections to the Virtex-6 FPGA for custom I/O- 3U VPX form factors provides a compact, rugged platform- Compatible with several VITA standards including: VITA-46, VITA-48 AND VITA-65 (OpenVPX™ System Specification)- Ruggedized and conduction-cooled versions available
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3-Channel 200 MHz A/D and 2-Channel 800 MHz D/A with Virtex-6 FPGA - 3U VPX
Model 52620
- Complete radar and software radio interface solution- Supports Xilinx Virtex-6 LXT and SXT FPGAs- Supports gigabit serial fabrics including PCI Express, Serial RapidIO and Xilinx Aurora- Three 200 MHz 16-bit A/Ds- One digital upconverter- Two 800 MHz 16-bit D/As- Up to 2 GB of DDR3 SDRAM or 32 MB of QDRII+ SRAM- Sample clock synchronization to an external system reference- LVPECL clock/sync bus for multimodule synchronization- Optional LVDS connections to the Virtex-6 FPGA for custom I/O- 3U VPX form factors provides a compact, rugged platform- Compatible with several VITA standards including: VITA-46, VITA-48 AND VITA-65 (OpenVPX™ System Specification)- Ruggedized and conduction-cooled versions available- Synchronize up to eight modules with Model 7893 System Synchronization and Distribution Amplifier - PCIe
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Advanced Aggregators
Aggregators are devices designed to increase efficiency and port utilization of network packet brokers. They are commonly used at the network edge or in TOR applications where port utilization tends to be low. Aggregators are also capable of pre-filtering traffic prior to sending out to Network Packet Broker’s for advanced filtering or taking the place of packet brokers in applications where only L2-L4 filtering is required. Aggregators improve ROI by reducing the total cost of a network visibility fabric and increasing the efficiency of existing infrastructure.
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Copper Pillar Bump
Like in conventional fabrication, integrated circuits are created on the wafer but near the end of the manufacturing process, the attachment pads are metalized on the surface of the chips to make them more receptive to solder. Then solder dots are deposited on each of the pads, and chips are cut, flipped, and positioned so that the solder balls are facing the connectors on the external circuitry.
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High-Speed Switching Diodes 33 To 140 GHz
Insight Product Company offers high-speed switching diodes with switching time up to 2 nsec and operating frequency range up to 140 GHz. Silicon p+-p-n-n+ high-speed switching diodes are designed to be used in mm-wave switching devices, phase changers, modulators, attenuators for the millimeter wavelength range. They are fabricated in the metal-ruby packages with hard-lead carrier (diameter 3.0 mm, 1.5 mm).
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3U VPX – OpenVPX Backplanes
VPX is a broadly defined technology utilizing the latest in a variety of switch fabric technologies in 3U and 6U format blades. OpenVPX is the architecture framework that defines system level VPX interoperability for multi-vendor, multi-module, integrated system environments.
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Auto Water Vapour Permeability Tester
TF165B
TESTEX Testing Equipment Systems Ltd.
Water Vapour Permeability Tester, also called Water Vapor Transmission Rate Tester (WVTR Tester) is to determine the water vapor permeability of various textile and garment fabrics, coating fabric, composite, sportswear, and industrial fabrics. This tester complies with ASTM E96, GB/T 12704, JIS L1099, etc.
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AdvancedTCA® Carrier Blade with 4x Intel® Xeon® Processor E3-1515M v5 COM Express Modules and FM10420 Multi-Host Controller
aTCA-9400
- 4x COM Express Type 6 module slots supporting ADLINK Express-SL/SLE with Xeon® Processor E3-1515M v5 (45W)- Integrated Intel® GT4e GPU providing high-performance H.264/H.265 transcoding- COMe modules connected by Intel® Ethernet Multi-host Controller FM10420, supporting up to 25Gbps Ethernet bandwidth between CPUs- 2x 10G SFP+, 4x 1G RJ-45 Ethernet on front panel- 2x 10G to Fabric channels, 2x1G to Base channels
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Fibre Channel Test & Simulation Interface for PCI Express
PCIe-FC4
Avionics Interface Technologies
Half-size four lane PCIe board - Supports Point-to-Point, Switched Fabric, and Arbitrated Loop topologies - Two independent Fibre Channel ports - Two SFP sockets accept fiber or copper transceivers - Each port supports 1, 2, and 4 Gbps speedsComprehensive decoding of FC-1, FC-2, and Upper Layer Protocol (ULP) frames - Full Error Injection and Detection - IRIG-B Time Code Encoder/Decoder for Data Correlation - In-line Port Configuration for Transparent Analyzer - Supports multiple ULPs including FC-AE-ASM, FC-AE-RDMA, FC-AE-1553, and FC-AV - Compatible with AIT’s fcXplorer GUI Bus Analyzer Software
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Air Permeability Tester
TF164B
TESTEX Testing Equipment Systems Ltd.
Our Air Permeability Tester determines the resistance of fabrics (woven, knitted and non-woven textile materials) to the passage of air (air flow) under constant pre-set air pressure while firmly clamped in the test rig of selected test head/area.The specimen is loaded to the test area of the instrument easily by means of a pneumatic holder. By pressing down the holder to start the test. The air permeability tester is equipped with a vacuum pump to draw air through an automatic interchangeable test head with a circular opening. The pre-selected test pressure is automatically maintained, and after a few seconds the air permeability of the test specimen is digitally displayed in the pre-selected unit of measure on the touch panel after test the holder is released and the vacuum pump is shut off.
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Ultrasonic Welding
It is an ultrasonic plastic welder which utilizes ultrasonic vibration energy to perform secondary processing of plastic(resin). It can be used not only for resin welding but also for various purposes such as resin caulking, fusing and cutting of non-woven fabrics, hood cutting, and packaging processing.
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PCIe Gen 4.0 Retimer
PEX88T32
Broadcom PEX88000 switches allow customers to build systems from simple PCIe connectivity in and outside the box to high performance, low latency, scalable, cost-effective PCIe fabrics for composable hyper-scale compute systems.
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Textile Testing Instruments
Dongguan Amade Instruments Technology Co., Ltd
Textile testing instruments are developed to determine the quality and performance of various fibrillar component fabrics, structural fabrics, garments, home textiles and other textiles by physical and chemical methods in conformance with international standards. By using scientific testing methods to judge the quality of materials or final products, manufacturers of textiles are capable of detecting the defects and unqualified products to correct problems in time, conducive to reducing loss and maintaining the business reputation. Testings cover tensile strength, tearing strength, seam slippage, joint strength, bursting strength, resistance to wear, pilling resistance, color fastness to washing, rubbing fastness, light fastness, color fastness to perspiration, dimension stability, inflaming retarding test etc.
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Powered VXS Crates
VXS - "VME-bus switched serial" is the new ANSI / VITA 41 standard which combines the 32-bit parallel VME-bus with high speed switched serial interconnect fabrics in order to increase the data transfer bandwidth to several GB/s.
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Shrinkage Template Scale
TESTEX Testing Equipment Systems Ltd.
Shrinkage Template Scale, suitable for all shrink testing standards. Shrinkage Template Scale complies with AATCC 135/150/160/179, BS EN 3759, ISO 3759, etc. Welcome to contact us if you have any problems about fabric shrinkage test method.
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Multi-purpose Textile Flammability Tester
TESTEX Testing Equipment Systems Ltd.
Multi-purpose Textile Flammability Tester, to determine the flammability resistance of textile fabrics and for the flammability test of toys and toy material. Multi-purpose Textile Flammability Tester complies with ISO 6940 (1995&2004) / 6941 (1995&2003), ISO 15025, EN71-2, etc. Please contact us for more information about flammability test method.
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NVM Express
NVM Express is a scalable host controller interface designed to address the needs of Enterprise, Data Center and Client systems for supporting chip-to-chip, board-to-board, adapter and distance solutions. The protocol can efficiently use interconnect and fabric technologies such as PCI Express, Ethernet and Fibre Channel. Teledyne LeCroy provides protocol analysis, emulation, exerciser and other test equipment to service all NVMe storage applications.
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Destructive Physical Analysis (DPA)
Is the process of disassembling, testing, and inspecting a component for the purpose of determining conformance with applicable design and process requirements. This process of sample testing is used to ensure that a high reliability component or device is fabricated to the required standards. Destructive Physical Analysis is also used effectively to discover process defects for troublesome production lot problems.
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VPX
VPX, formerly known as VITA 46, is an ANSI standard (ANSI/VITA 46.0-2007) that provides VMEbus-based systems with support for switched fabrics over a new high speed connector.
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40-72 GHz Doubler
1GC1-8048
The 1GC1-8048 is a balanced diode frequency doubler consisting of two Schottky diodes and a coplanar balun structure. The doubler provides 15 dB conversion loss and 17.5 dBc 1st and 3rd order feed-thru for input frequencies between 20 and 33.5 GHz. This IC is fabricated in HFTC's InGaP/GaAs heterojunction bipolar transistor (HBT) process that provides excellent uniformity, reliability and 1/f noise performance.
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cPSB 2.16 6 slot - 5 w/cPCI, 1 FS
107PS11606-0157R
CompactPCI CPSB 2.16 6U 6 slot, 5 w/cPCI, 1 Fabric, fully compliant to the PICMG 2.16 Packet Switching Backplane specification.
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Laser Process Analyzers
LGR-ICOS Series
LGR-ICOS laser process analyzers accurately measure gas concentrations with extraordinarily high sensitivity, fast response and over a wide dynamic range in both simple and complex mixtures. They are ideal for contaminant monitoring in HyCO (syngas), fuel gas, petrochemicals, and semiconductor fabrication facilities.
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Universal Amplifier Heatsinks
A universal heatsink, which is designed and fabricated for Eravant's active device applications with up to 15-watt power dissipation. The heatsink consists of the main heatsink body, a DC fan and a heat spreader. The heat spreader is also known as adapter, which is used to bridge the mounting gap between the heat sink main body and the to-be-heat-sunk devices, such as power amplifier, frequency active multiplier, oscillator, transmitter and transceiver due to various mounting hole locations. The heat spreader offers various mounting patterns to accommodate more than 15 product models. This heatsink is not only designed for Eravant's standard products and Uni-Guide™ featured products, but also for many industrial standard microwave and millimeter wave products offered by other manufacturers. Other heatsinks with different power dissipation capacities are offered under different model numbers.
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72-lane, 36-port, PCI Express
PEX89072
The new PCIe Gen 5.0 (32 GT/s) PEX89000 series builds on the longevity of the Broadcom series of switches, now spanning 13 families. The PEX89000 family allows customers to build systems from simple PCIe connectivity inside the box to high-performance, low-latency, scalable, cost-effective PCIe fabrics for composable hyper-scale compute systems supporting ML/AI and Server/Storage applications.
