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Fabric Unidirectional Water Transmission Performance Tester
DRK-UPT1
Shandong Drick Instruments Co., Ltd.
The unidirectional water transmission performance tester is a special instrument for measuring the unidirectional water transmission performance of textiles.
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CompactPCI CPSB 2.16 6U 8 slot, 6 w/cPCI, 2 Fabric, no P2
107PS21608-0257R
CompactPCI CPSB 2.16 6U 8 slot, 6 w/cPCI, 2 Fabric, no P2, fully compliant to the PICMG 2.16 Packet Switching Backplane specification.
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Fabric Pneumatic Bursting Tester
TF142C
TESTEX Testing Equipment Systems Ltd.
Fabric Pneumatic Bursting Tester, to determine the bursting pressure of fabrics uses pneumatic test method, including knits, woven fabric, non-woven fabric, laminated fabric and other craft-made fabric.A test specimen is clamped over an expansive diaphragm by a circular clamping ring, increasing compressed air pressure is applied to the underside of the diaphragm, causing distension of the fabric until the test specimen bursts, the bursting strength and distension are determined.
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Star Fabric to PXI Module
41-921-001
This module resides in the Slot 1 position of a PXI chassis and interfaces to the backplane of the PXI chassis. When located in a generic peripheral slot, it can be used to drive two extension PXI chassis.
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Xeon E3-1125 Processor AMC, Fabric Mix
AMC723
The AMC723 is a Processor AMC (PrAMC) in a single module, mid size AdvancedMC™ (AMC) form factor based on the Intel® Corei Processor with Cave Creek PCH.
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Martindale Abrasion Pilling Tester
TESTEX Testing Equipment Systems Ltd.
Martindale Abrasion Tester, to determine the abrasion and pilling resistance of all kinds of textile structures. Martindale Test Equipment complies with EN ISO 12945-2/12947-1, ISO 20344, ASTM 4966/4970, etc. Martindale Fabric Abrasion Tester will meet your needs when you do Martindale rub test. Please contact us for more information about Martindale Machine or Martindale pilling test methods.
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MRM(Mask)
MRM Series
- Fully automated system that can produce masks by automating the mask production process such as fabric supply, molding, cutting, and bonding.
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Material Testing Software
MS100
Sinowon Innovation Metrology Manufacture Ltd.
MS100 is professional software for material testing in windows system, it is able to conduct tensile, compression, bending, shearing, bonding strength, peeling, tearing and other tests for rubber, plastic, leather, metal, nylon line, fabric, paper, aviation, packaging, construction, petrifaction, electrician, vehicle and other materials.
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Micro Vickers Hardness Tester
Sinowon Innovation Metrology Manufacture Ltd.
◆ MicVision main use in testing materials allows for the measurement of the hardness of small or thin specimens and small areas of larger specimens, MicVision testing is commonly used to determine characteristics of thin sheets, foils, fine wire, epoxies, paints, etc. and is often employed in R&D applications .◆ MicrVision hardness is especially useful in determining hardness variations, caused by hardening, quenching, plating, fabrication, welding or annealing, bonding, etc. Micro hardness testing can be accurately employed using loads as slight as 10 gram, somewhat less and considerably more in certain situation.
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Bipolar Supply Voltage Output D/A Converters
Analog Devices is an industry-leading provider of bipolar d/a converter solutions offering exceptional 1 ppm performance and optimized feature sets to ensure quick and easy deployment of bipolar converters across a range of end applications. With a comprehensive portfolio of bipolar DACs fabricated using proprietary iCMOS® process technology, ADI has enabled the development of high performance ICs at high voltage levels while simultaneously reducing package size and power consumption. By bringing together the many benefits of integration, ADI’s bipolar DACs reduce design time and system complexity.
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Wafer Chucks
ARC, in addition to fabricating Wafer Chucks from aluminum, is also known for its ability to work in hard to machine materials such as hardened (50-62 Rockwell) metal alloys, fired ceramics, e.g. SiC and glasses. These materials are often ideal for semiconductor equipment applications due to their ability to hold critical dimensions and tolerances. ARC specializes in surface grinding and lapping these materials to precision flatness and parallelism specifications needed for semiconductor wafer chuck requirements.
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Fabricated And Specialist Thermocouples
Fabricated and Specialist Thermocouples to suit a wide range of applications.
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Fabric Drape Tester
TF118
TESTEX Testing Equipment Systems Ltd.
Fabric Drape Tester, to measure and calculate the coefficient of drape by tracing a shadow of the draped fabric on paper. Fabric Drape Tester complies with BS EN 9073, BS 5058, ERT 90-1, etc.
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Nanostructuring
AMO offers a highly flexible process-platform for the fabrication of nanostructures. We have a broad range of lithography techniques that can be flexibly combined with each other – including interference lithography. Each lithography technique is tailored to a specific pattern-transfer process and can be used on a wide range of substrates. In addition, we have developed an advanced nanoimprint lithography process that can transfer e-beam-defined patterns to large areas in a cost-effective manner.
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CrumpleFlex Tester
TF117C
TESTEX Testing Equipment Systems Ltd.
The equipment tests a tube of fabric by twisting it through 90o stretching alternately compressing the tube at the same time. After completion of the test the fabric is tested for resistance to penetration by water. CrumpleFlex Tester is fitted with electronic pre-determined counter with automatic stop at a pre-determined number of cycles, also fitted with acrylic plastic interlock safety cover.
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Probe Cards
PICOPROBE® PROBE CARDS by GGB Industries, Inc., allows for more chip design flexibility because each probe card is custom configured to your circuit for testing wafers on either manual or automatic probe stations. Probe cards with complex layouts consisting of numerous DC contacts and multiple microwave probes with operating frequencies of 40, 50, 67, or 110 GHz can be custom fabricated quickly and inexpensively.
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Uncooled Microbolometer
384 x 288 FPA
Drawing on its extensive experience in microbolometric detector design, fabrication, and characterization, as well as in detector-to-ROIC (Read-Out Integrated Circuit) monolithic integration, INO is proud to offer its 384 x 288 pixel microbolometer FPA (Focal Plane Array) in short series.
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VPX / OpenVPX Chassis
VPX is a broadly defined technology utilizing the latest in a variety of switch fabric technologies in 3U and 6U format blades. Open VPX is the architecture framework that defines system level VPX interoperability for multi-vendor, multi-module, integrated system environments.
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Specialty Test Instruments
Special test equipment means “either single or multipurpose integrated test units engineered, designed, fabricated, or modified to accomplish special purpose testing in performing a contract.
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Nonwoven Thickness Gauge
DRK141P-II
Shandong Drick Instruments Co., Ltd.
It is used to determine the thickness of bulky non-woven fabrics with a thickness of ≤ 20mm and the thickness of large-compression non-woven fabrics.
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Single Board Computer
VPX6-1958
Curtiss-Wright Defense Solutions
The VPX6-1958 rugged, high performance 6U OpenVPX Single Board Computer (SBC) combines Intel's powerful Core i7 processor with the power and flexibility of the VPX platform's high speed fabric interconnects. The VPX6-1958 supports Intel's 4th Generation Core i7-4700EQ processor.
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Flexural Damage Tester
DRK242A-II
Shandong Drick Instruments Co., Ltd.
It is used to test the dynamic anti-torsion and flexural fatigue performance of coated fabrics.
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Wafer Manufacturing
Scientific Computing International
A procedure composed of many repeated sequential processes to produce complete electrical or photonic circuits on semiconductor wafers in semiconductor device fabrication process.
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3U VPX Processor Board
VP32001
LinkedHope Intelligent Technologies Co.,Ltd.
The VP32001 is a PC-compatible high performance 3U VPX processor board supporting the 2nd generation Intel® Core™ processor and the Intel® Series 6 mobile class chipset with up to 8 Gbytes of DDR3-1333 ECC SDRAM. The VP32001 features an XMC site and a range of I/O interfaces including two SATA600 channels, dual 1000Base-BX, RS232/422/485 and USB interfaces. The board provides a flexible PCI Express® (PCIe) backplane fabric interface that can be configured in several ways from eight x1 PCIe ports to a single x8 PCIe port making it suitable for use in both distributed systems and centralized switching systems as defined in OpenVPX (VITA 65). For rugged applications two VPX-REDI conduction-cooled versions are available, the VP32001-RCS is a VPX-REDI Type 1 Two-Level Maintenance conduction-cooled board and the VP32001-RCT is VPX-REDI Type 2. The board is suitable for a range of applications within industrial control, transport, aerospace, security and defense applications. To simplify integration many standard operating systems are supported.
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Semiconductor
Engineered ceramics are used in the semiconductor industry because of their excellent material properties. Ultra-pure ceramics are often used in the whole cycle of semiconductor manufacturing including Semiconductor Wafer & Wafer Processing, Semiconductor Fabrication (Front End), and Semiconductor Packaging (Back End).
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2-Ch 500 MHz A/D with DDC & 2-Ch 800 MHz D/A with DUC, Kintex UltraScale - XMC
Model 71851
- Jade Xilinx Kintex UltraScale FPGA Products and Navigator Design Suite Software Video- Jade Xilinx Kintex UltraScale FPGA Family Brochure- Complete radar and software radio interface solution- Supports Xilinx Kintex Ultrascale FPGAs- Supports VITA-49.2 VITA Radio Transport standard- Two 500 MHz 12-bit A/Ds- Two multiband DDCs (digital downconverters)- One DUC (digital upconverter)- Two 800 MHz 16-bit D/As- 5 GB of DDR4 SDRAM- Sample clock synchronization to an external system reference- LVPECL clock/sync bus for multimodule synchronization- PCI Express (Gen. 1, 2 & 3) interface up to x8- VITA 42.0 XMC compatible with switched fabric interfaces- Optional LVDS and gigabit serial connections to the Kintex - Ultrascale FPGA for custom I/O- Optional 400 MHz 14-bit A/Ds- Ruggedized and conduction-cooled versions available- Synchronize up to eight modules with Model 7893 System Synchronization and Distribution Amplifier - PCIe
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Sensor
Lepton
The FLIR Lepton™ is the most compact longwave infrared (LWIR) sensor available as an OEM product. It packs a resolution of 80 × 60 or 160x120 pixels into a camera body that is smaller than a dime. This revolutionary camera core is poised to equip a new generation of mobile and handheld devices, as well as small fixed-mount camera systems, with thermal imaging capabilities never seen before. Lepton contains a breakthrough lens fabricated in wafer form, along with a microbolometer focal plane array (FPA) and advanced thermal image processing. In order to support the lepton and make it easy to use, we have developed a breakout board to support the module along with example source code. Please see the Lepton Thermal Camera Breakout Datasheet for more information.
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Enterprise-Level Continuous Validation
TrustZero
Backed by continuous monitoring, TrustZero is a cloud-based tool that provides enterprise-level continuous validation for PACS. It works in conjunction with CertiPath’s popular TrustMonitor™ credential validation platform, which performs 24/7 Continuous Diagnostics and Mitigation (CDM) for the PKI trust fabric. Whether an organization has one PACS or several, TrustZero provides a single network location to respond to all validation queries for all credentials within a trust federation. When paired with TrustMonitor Enterprise, it can provide this same validation for credentials issued by local trust CAs for intranets, internal networks, VPNs, non-person entities, Internet of Things (IoT) devices, and other items that are issued certificates from private CAs.
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Geo / Cryogenic / NDE Instrumentation
Tristan designs and fabricates custom magnetometer systems to study the magnetic properties of samples. SQUID systems are extremely sensitive instruments designed to detect small electromagnetic signals. By combining SQUID electronics with various special purpose probes and auxiliary electronics, laboratory systems having a variety of capabilities are made available. - See more at: http://www.tristantech.com/#sthash.JlYDZcjM.dpuf
