Semi-conductor
active or passive elements connected as an electronic circuit using a crystalline subtance, eg. silicon or germanium.
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Product
Semiconductor Technology
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Semiconductor technology has maintained exponential performance growth, transforming society at a blistering pace. Now, all eyes are on the industry to keep up that rate – commonly associated with Moore’s law – to accommodate for challenges such as the steeply growing amount of data, low-power edge computing for artificial intelligence and high-performance computing to crack some of the world’s toughest problems.
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Product
Bonding Tester
PTR1102
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In wire bonding in semiconductor manufacturing, electrodes are joined using gold wires of several tens of microns. In order to measure the pull (tensile) strength and ball shear (shear) strength of this gold wire, this machine has load detection accuracy and fine positioning accuracy. In addition, for the measurement of high load areas such as die shear strength and solder joint strength, this machine supports measurement in high load areas while maintaining accuracy in low load areas by replacing the sensor part.
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Product
WaferPro Express On-Wafer Measurement Program Software
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WaferPro Express software performs automated wafer-level measurements of semiconductor devices such as transistors and circuit components. It provides turnkey drivers and test routines for a variety of instruments and wafer probers. Its new user interface makes it easy to setup and run complex wafer-level test plans, while powerful customization capabilities are enabled by the new Python programming environment.
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Product
Wafer Inspection System
INSPECTRA® Series
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INSPECTRA® series meet the requests of 100% automatic inspection with high speed and high specifications from front-end to back-end of semiconductor processing. INSPECTRA® series are wafer inspection systems with high speed and high sensitivity. Our original "Die-to-Statistical-Image" comparison method achieves the target defects detection controlling process variation and overkill.
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Product
Standard GaN Amplifiers
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A GaN (Gallium Nitride) amplifier is a power amplifier that uses GaN, a wide-bandgap semiconductor material, to provide high power density, efficiency, and frequency capabilities.
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Product
Nand Flash Tester
NplusT
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NplusT was created in December 2002 by Tams Kerekes' 20-years experience in the field of electrical semiconductors and reliability testing.The company started with the sales representation of semiconductor equipment and consumable suppliers. In the meantime, qualified engineering services, linked to the represented products, were provided in Europe.In 2003 NplusT started to market "RIFLE", the non-volatile memory engineering tester, and related services. In a few years, this product has become a reference platform for many memory makers.In 2005 Liliom Laboratories, a Hungarian software development company, merged into NplusT. Thanks to this operation, the company became leader in the test data collection and processing segment.From 2008 a dominant portion of NplusTs turn-over derived from licensing software products. Today almost every European along with several Far East semicon companies license our software products and make use of qualified engineering services.From 2011, NplusT provides turn-key solutions for device testing and characterization, including hardware, software and support.
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Product
13MP Jetson TX2/TX1 Camera Board
E-CAM130_CUTX1
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e-CAM130_CUTX1 - 13MP Jetson TX2/TX1 camera board is a 4-lane MIPI CSI-2 camera solution for NVIDIA® Jetson TX2/TX1 developer kit. The e-CAM130_CUTX1 Board uses 13MP custom Lens camera module based on AR1820 CMOS Image sensor from ON Semiconductor. This camera daughter board can be directly interfaced to the NVIDIA® Jetson TX2/TX1 developer kit. The e-CAM130_CUTX1 is a 13MP color camera with the S-mount (also known as M12 board lens) lens holder.
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Product
Copper Diffusion TestSystems
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Materials Development Corporation
MDC announces the addition of software and hardware for copper diffusion studies to its CSM/Win suite of semiconductor test systems and software. This new CSM/Win feature plays an important part in the development of processes and materials for the next advance in integrated circuit technology that employscopper as a conductor. Special Current-Voltage Bias-Temperature Stress (IV-BTS) software can measure the degradation of insulator quality due to copper diffusion.Multiple test sites can be stressed with a constant voltage while the current through each site is measured and recorded. The Current-Voltage Bias-Temperature Stress test supplements conventional MOS C-V measurements and Triangular Voltage Measurements (TVS) that are also employed in copper diffusion studies.
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Product
PXI-5154, 1 GHz, 2 GS/s, 8-Bit, 8 MB/ch, PXI Oscilloscope
780319-01
Oscilloscope
1 GHz, 2 GS/s, 8-Bit, 8 MB/ch, PXI Oscilloscope—The PXI‑5154 is ideal for acquisition and characterization of fast, nanosecond-edge speeds. It is well-suited for automated test and data streaming applications in the consumer electronics, semiconductor, aerospace/defense, and life sciences industries. The PXI‑5154 also comes equipped with up to 256 MB of memory per channel to provide high, sustained sample rates over extended data capture windows. This digitizer, optimized for automated test, uses a high-throughput bus to lower test times, provides picosecond-level synchronization among modules, and integrates with the entire suite of NI hardware, so you can build and customize a complete mixed-signal or high‑channel‑count test system.
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Product
Sheet Resistance Measurement
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The Filmetrics® R54-series and R50-series sheet resistance measurement instruments have been developed based on over 45 years of KLA sheet resistance measurement innovation. The R50 measures metal layer thickness, sheet resistance and sheet conductance. The R54-series adds a light-tight enclosure, along with 300mm support, to provide metal thickness measurement solutions for semiconductor and compound semiconductor manufacturing.
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Product
PXI-2536, 544-Crosspoint, 1-Wire PXI Matrix Switch Module
778572-36
Matrix Switch Module
544-Crosspoint, 1-Wire PXI Matrix Switch Module—The PXI‑2536 is a high-density 8x68 PXI matrix switch module that is ideal for routing low-power DC signals in validation test systems of mass produced devices such as semiconductor chips and printed circuit boards (PCBs). Featuring FET relays, the PXI‑2536 offers unlimited mechanical lifetime and switching speeds up to 50,000 crosspoints/s. It also features onboard relay counting for relay monitoring and deterministic operation with hardware triggers to improve test throughput.
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Ultrasound Transducers
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Utilizing optical and semiconductor fabrication techniques, Imaginant manufactures the PureView PrecisionTM line of RoHS-compliant delay-line ultrasound transducers with center frequencies ranging from 50 MHz to 250 MHz (higher and lower transducer frequencies are also available). Imaginant's precision-manufacturing process produces transducers that exhibit high reliability and high uniformity from device to device. This manufacturing consistency enables uniform test system performance to be attained across multiple systems. Imaginant transducers are available in focused and flat-face models that can be produced with minimal-damping for applications requiring maximal sensitivity or with maximal-damping and high-bandwidth for applications requiring the highest-degree of temporal precision.
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Product
Hydrofluoric Acid Monitor
CM-200A/210A
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The CM-200A/210A hydrofluoric acid monitors have been developed specifically to meet the stringent demands of semiconductor manufacturing. The CM-200A/210A provides a real time read-out of hydrofluoric acid concentration by measuring the electric conductivity of the sample solution. These superior units offer high repeatability even at low concentrations. The CM-200A/210A can be used for a variety of purposes ranging from monitoring etched wafer cleaning processes to any other industrial application of hydrofluoric acid.
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Product
Laser Heads
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The laser head is the source of the laser beam used in all laser motion and position measurement systems. The primary difference between laser heads is in the velocity, reference frequency and optical output power. Other considerations are size, heat dissipation, and input power requirements. Which laser you choose depends primarily on the application in which it will be used. For example, semiconductor lithography systems typically have faster moving parts (stages), and therefore need higher velocities than machine tool applications.
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Product
Package Test
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WinWay’s commitment to technology, quality and service ensures our interface solutions go above and beyond to exceed your expectations. Our products and services have a proven track record of delivering customer success in semiconductor testing. The Company offers comprehensive test interface solutions ranging from wafer-level test, package-level test to thermal management.
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Product
Laser Head
5517EL
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The Keysight 5517EL is used primarily in VME and PC based laser interferometer systems where the velocity of motion is faster, such as semiconductor lithography and flat panel applications. Please contact Keysight for custom requirements.
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Product
Semiconductor
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Package FunctionSMV(2.9mm*2.8mm) AND GateUSV(2.0mm*2.1mm) NAND GateFM8(5.0mm*4.5mm) NOR GateSM8(2.9mm*4.0mm) OR GateUS8(2.0mm*3.1mm) INVERTER
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Product
Custom Solutions - OEM Raman
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For years, HORIBA Scientific’s OEM team has been the preferred, reliable and consistent supplier of OEM spectroscopy components. Our know-how in Raman (We are Number #1!) has made it into our miniature spectrometers and systems for portable Raman applications (Process control, Security, Pharmaceutical, Medical, Semiconductor…).
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Product
Automated Front & Backside Mask Aligner System
Model 6000
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With over 4 decades of manufacturing in the semiconductor industry, OAI meets the growing challenge of a dynamic market with an elite class of production photolithography equipment. Built on the proven OAI modular platform, the Model 6000 has front and backside alignment that is fully automated with a submicron printing capability as well as submicron top to bottom front side alignment accuracy which delivers performance that is unmatched at any price. Choose either topside or optional backside alignment which uses OAI’s customized advanced recognition pattern software. These Mask Aligners have OAI’s Advanced Beam Optics with better than ±3% uniformity and a throughput of 200 wafers per hour in first mask mode, which results in higher yields. The Series 6000 can handle a wide variety of wafers from thick and bonded substrates (up to 7000 microns), warped wafers (up to 7 mm-10mm), thin substrates (down to 100 micron thick), and thick photo resist.
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Product
PXI-5670, 2.7 GHz PXI Vector Signal Generator
PXI-5670 / 778768-01
Vector Signal Generator
2.7 GHz PXI Vector Signal Generator—The PXI‑5670 has the power and flexibility you need for product development applications from design through manufacturing. It can generate custom and standard modulation formats such as AM, FM, PM, ASK, FSK, PSK, MSK, and QAM. The PXI‑5670 delivers a highly flexible and powerful solution for scientific research, consumer electronics, communications, aerospace/defense, and semiconductor test applications as well as for emerging areas including software defined radio, radio frequency identification (RFID), and wireless sensor networks.
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Product
Fully Automatic 4 Point Probe Sheet Resistance System For Semiconductor Process Evaluate
WS-3000
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*Automatic probe head selection(exchanger) among 4 kinds of probe head*[No need to exchange a probe head by each different sample measurement]*Edge 1mm measurement is available by dual meas. mode*High cost performance from high speed measurement*FOUP compatible, GEM / SECS compatible
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Product
Surface Photovoltage
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The surface photovoltage spectroscopy modules are the perfect all-in-one solution for in-depth studies of light sensitive materials such as organic semiconductors, solar cells or light sensitive dyes.
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Product
Dynamic Ultra Micro Hardness Tester
DUH-210/DUH-210S
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A new evaluation system for measuring the material strength of micro regions, such as semiconductors, LSI, ceramics, hard disks, vapor deposited films, and thin coating layers, not addressed by previous hardness testers. It can also be used to evaluate the hardness of plastics and rubbers. This instrument uniquely measures dynamic indentation depth, not the indentation after the test. This in turn permits measurement of very thin films and surface (treatment) layers that are impossible to measure with conventional methods. Additionally, this same method supplies the data needed to calculate elastic modulus on the test specimens.
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Product
Applications
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No matter what the requirement for ultra high-precision measurement, VIEW has the ideal solution. VIEW non-contact measurement systems utilize sub-pixel image feature detection with either field-of-view (FOV) or point-to-point (PTP) configurations for exceptional accuracy and repeatability. From etch-dimensions on hard disk drive (HDD) heads to semiconductor overlay measurements, we provide the accuracy you need for quality manufacturing.
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Product
FluorOptic Fiber Optic Temperature Sensors
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Advanced Energy’s Luxtron® Fiber Optic Temperature Sensors enable customer innovation in complex applications for a wide range of industries including semiconductor equipment, industrial, manufacturing, telecommunications, data center computing, and medical. Based on Fluoroptic® technology, each individual product can be configured for specific applications.
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Product
LED
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Scientific Computing International
A light-emitting diode (LED) is a semiconductor device that emits light when current flows through it.
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Product
64-Axis PCIe EtherCAT MainDevice Motion Controller
PCIe-8338
Motion Controller
ADLINK PCIe-8338 is a hardware-based EtherCAT motion controller able to support up to 64 synchronized axes and over 10,000 points simultaneously. The PCIe-8338 features dedicated isolated emergency stop input (EMG), and configurable isolated high-speed digital input as not only generic sensor input but also pulsar input, with up to 1MHz input frequency. Optimum jitter control is provided in minimal cycles of 250µs to optimize synchronous I/O performance for vertical automation applications in semiconductor, electronic manufacturing, and others. The PCIe-8338 provides an out-of-shell application-ready (APS) function library to generate multi-dimensional, highly synchronized, time-deterministic event-triggered motion & I/O control. A wide range of compatible 3rd party SubDevice are easily designed with ADLINK's APS function library. ADLINK's MotionCreatorPro 2 utility is fully compliant with the Microsoft Windows environment, that allows complete EtherCAT motion and I/O configuration and function evaluation as well as compiling program download functions.
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Product
Materials Metrology
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Nova is a market leader for innovative thin film metrology and process control technologies. We develop highly sensitive in-line metrology solutions on high productivity platforms, thereby enabling critical metrology solutions to be closer to a semiconductor fab’s process and integration needs.Our technologies enable customers to accurately detect and quantify small variations in film composition and thickness, thereby influencing better device functionality, and improved manufacturing yield.
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Product
3.4 MP Autofocus Low Light USB Camera Board With Liquid Lens
See3CAM_30
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See3CAM_30 is a 3.4MP UVC Compliant, low light, autofocus USB camera with liquid lens. It is a two-board solution with AR0330 CMOS image sensor from ON Semiconductor and USB 3.1 Gen1 type C interface board. See3CAM_30 is a colour camera with S-mount lens holder and does not require any special camera drivers to be installed in the host PC. See3CAM_30 is customizable and it is a Ready-to-Manufacture camera with all the necessary firmware built in and compatible with the USB Video Class (UVC). It consumes less power and doesn't heat up. There is no mechanical movement like in VCM motor for autofocus. Hence the life of the lens increases.
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Product
Memory Test Systems
T5503HS2
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Semiconductor memories are in high demand to meet the needs of fast-growing end markets such as portable electronics and servers. It has been forecasted that applications ranging from mobile devices and data centers to automobiles, gaming systems and graphics cards will consume an estimated 120 billion gigabits of DRAM capacity. To meet this market demand, new generations of memories with data-transfer speeds of 6.4 Gbps and higher are being developed. Advantest’s second-generation T5503HS2 tester is designed to handle these ultra-high-speed memory ICs.
