Semi-conductor
active or passive elements connected as an electronic circuit using a crystalline subtance, eg. silicon or germanium.
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Product
Test System
ITC57300
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The ITC57300 Dynamic Parametric Test System mainframe accepts Test Heads that perform nondestructive transient measurements on semiconductor devices such as Insulated Gate Bipolar Transistors (IGBT), power MOSFETs, diodes, and other bipolar devices(requires additional optional bias power supplies and custom personality boards). Included in the mainframe are all test equipment and software necessary to analyze and perform resistive and inductive switching time, switching losses, gate charge, Trr/Qrr, and other transient tests.
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Product
Capacitor to Dim
DAM1
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Lifasa - International Capacitors, SA
DAM switching capacitors are used to protect semiconductors (IGBT transistors). These are charged and discharged repeatedly with high current peaks. This series is especially indicated for applications that require high capacities at high voltages.
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Product
Ultrasonic Transducers
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Sonix S-series ultrasonic NDT transducers are designed in-house to meet the demanding nondestructive testing requirements of semiconductor manufacturing. We offer the collaborative expertise to help customers choose the best ultrasonic NDT transducer for their application, based on three primary considerations.
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Product
BSDL File Validation
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Corelis offers services to validate the accuracy of Boundary-Scan Description Language (BSDL) files that characterize the boundary-scan functionality of semiconductor devices. These services include validation of a device's BSDL file while the chip is still in development and BSDL file accuracy verification against actual silicon.
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Product
Automated Optical Inspection
AOI
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No complex assembly process is complete without the ability to inspect and characterize the many different components used. ficonTEC’s fully automated INSPECTIONLINE systems acquire high-resolution pictures of the surfaces of interest and performs optical inspection based on the user’s criteria. For example, facet inspection of laser diodes, QC for coatings, surface inspection, top/bottom/side-wall inspection of semiconductor chips, and die sorting are just some of the many inspection tasks performed routinely by ficonTEC’s suite of inspection tools. As for all of ficonTEC’s systems, a modular approach permits the inspection platform to equipped with additional features – automatic tray handling and various feeding philosophies, testing capabilities (e.g. LIV), top/bottom chip inspection, and in-situ labelling.
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Product
Steam Aging Test Chambers
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Dongguan Amade Instruments Technology Co., Ltd
Steam aging test chamber is a climatic test machine used to judge the products performance to resist extreme circumstance under high temperature, high humidity and high pressure during the transportation, storage and usage. The principle is very simple, water in the tank is heated turning into steam to form a simulated test environment under specified temperature and humidity. Specimens are placed into the drawers of machine to carry out test lasting for preselected time. It is applicable to electronic connectors, semiconductor IC, transistor, LCD, diodes, resistances etc.
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Product
9kHz to 20/40GHz Signal Generator
CSG Series
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Corech Microwave’s CSG series of Compact Microwave Signal Generators（Signal Source）operate from 9kHz to 20GHz / 40GHz. It offers high dynamic output power -120 to +17dBm, ultra low phase noise: -105dBc/Hz@10KHz, low harmonics and spurious. These exceptional performances make CSG9K20GA / CSG9K40GA an ideal choice for many test and measurement applications, including Semiconductor, Quantum Technology, Radar and Communication etc.
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Product
Semiconductor Test Software Solutions
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The test engineering staff at Test Spectrum has developed hundreds of test software projects on all major ATE platforms for numerous product technologies.Whether you need to optimize a current test platform, convert to a lower cost test platform, or design a brand new program for a cutting edge product within incredible time constraints, the Test Spectrum team will exceed your program expectations with quality products and excellent results.
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Product
LXI High Voltage Matrix 2-Pole 100x2
60-310-102
Matrix Switch Module
The 60-310 is a 2-pole Matrix Module available in 300x2, 200x2 and 100x2 formats. It is capable of cold switching 1000VDC and has a maximum carry current of 1A. It is designed for high voltage applications including circuit board isolation testing, relay testing, semiconductor breakdown monitoring and cable harness insulation testing. The 60-310 is designed in accordance with the LXI Standard 1.4 and is supplied in a 2U high, full rack width case with 500mm depth.
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Product
Mixed Signal Test Systems
MTS1010i
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The MTS-1010i is a more economical version of the MTS-2010i & MTS-1020i testers. It has a reduced platform size and reduced power supplies. Like the other testers in the MTS family it is a highly cost effective production ATE designed for testing high-volume linear and mixed signal semiconductor devices (Op Amps, high-voltage drivers, DAC, ADC, etc.), both at the wafer sort and final test stages of the manufacturing process.
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Product
32-Axis PCIe EtherCAT MainDevice Motion Controller
PCIe-8334
Motion Controller
ADLINK PCIe-8334 is a hardware-based EtherCAT motion controller able to support up to 32 synchronized axes and over 10,000 points simultaneously. The PCIe-8332 features dedicated isolated emergency stop input (EMG), and configurable isolated high-speed digital input as not only generic sensor input but also pulsar input, with up to 1MHz input frequency. Optimum jitter control is provided in minimal cycles of 250µs to optimize synchronous I/O performance for vertical automation applications in semiconductor, electronic manufacturing, and others. The PCIe-8334 provides an out-of-shell application-ready (APS) function library to generate multi-dimensional, highly synchronized, time-deterministic event-triggered motion & I/O control. A wide range of compatible 3rd party SubDevice are easily designed with ADLINK's APS function library. ADLINK's MotionCreatorPro 2 utility is fully compliant with the Microsoft Windows environment, that allows complete EtherCAT motion and I/O configuration and function evaluation as well as compiling program download functions.
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Product
Wide Temperature Range HDR USB3.1 Gen1 Camera Board (Color)
See3CAM_CU20
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See3CAM_CU20 is a 2.0 MP HDR USB camera board with ultra-Lowlight performance. It has an ability to stream seamlessly at wide temperature range (-40°C to 85°C). This Full HD USB3.1 Gen1(5Gb/Sec.) camera is based on 1/2.7" AR0230AT CMOS digital image sensor with a pixel size of 3.0 μm x 3.0 μm from ON Semiconductor™. It has S-mount (M12) lens holder which allows customers to choose and use the lens according to their requirement. It is a Plug-and-Play camera (UVC compliant) for Windows, Linux. This HDR camera is also backward compatible with USB 2.0 host ports.
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Product
ALD Advantages
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Atomic Layer Deposition (ALD) stands out for one reason: control. The most significant advantages of thin film deposition via Atomic Later Deposition over other methods, are manifest in four distinct areas – film conformality, low temperature processing, stoichiometric control, and inherent film quality associated with the self-limiting, and self-assembled nature of the ALD mechanism ALD is exceptionally effective at coating surfaces that exhibit ultra high aspect ratio topographies, as well as surfaces requiring multilayer films with good quality interfaces technology. This thin-film process builds materials one atomic layer at a time, delivering unmatched uniformity and sub-nanometer precision, even on complex 3D structures. That level of accuracy makes ALD a critical technology for advanced semiconductor manufacturing, flexible electronics, and materials research.
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Product
1.3 MP Global Shutter Camera (Monochrome / Color (RAW Bayer))
See3CAM_10CUG
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The See3CAM_10CUG is a 1.3 MP Custom Lens CMOS USB Global Shutter Camera Module. This is a S/CS/C Mount global shutter camera and is UVC-compliant SuperSpeed USB 3.0 Camera. It is based on the Aptina / ON Semiconductor AR0134 CMOS sensor. See3CAM_10CUG is also backward compatible with USB 2.0 host ports and does not require any special camera drivers.
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Product
Characterization Platform
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This standalone integral software and hardware platform is capable of functioning as an independent single-channel or virtual multi-channel characterization test subsystem. The platform is USB controlled to provide temperature, RF-signal and bias-control to a device-under-test (DUT) for semiconductor performance measurement. When used in conjunction with Accel-RF's embedded Pulser-Card Assembly, the test device is capable of pulsed DC and RF stimulus.
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Product
Mercury Probes
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Materials Development Corporation
MERCURY PROBES are precision instruments that enable rapid, convenient, and non-destructive measurements of semiconductor samples by probing wafers with mercury to form contacts of well-defined area.
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Product
Temporary Bonding Systems
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Temporary bonding is an essential process to offer mechanical support for thin or to-be-thinned wafers, important for 3D ICs, power devices and FoWLP wafers, as well as for handling fragile substrates like compound semiconductors. A device wafer is bonded to a carrier wafer with the help of an intermediate temporary bonding adhesive, allowing the typically fragile device wafer to be processed with additional mechanical support. After the critical processes, the wafer stack is debonded. EVG’s outstanding bonding know-how is reflected in its temporary bonding equipment, which has been provided by the company since 2001.
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Product
ANSI X3.28 to Modbus RTU Converter
Model 2399
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* Converts ANSI X3.28 commandslinto Modbus RTU packets.* New 32 Address Mode supports multi-channel Modbus Controllers like the Watlow MLS300.* Control Modbus RTU devices from any ASCII serial source.* Serial ports support RS-232 and 2-wire/4-wire RS-485 signals.* Includes serial baud rate conversion.* Internal logic is IEEE-488.2 compatible and uses SCPI commands for configurtion setup.* 2399 mounts on a DIN rail or on any flat panel.* Inexpensive way to maintain manufacturing equipment such as semiconductor fusion chambers, etc as the ANSI Controllers become obsolete.* Application Note AB23-3 describes how to use the 2399 to replace obsolete Watlow Controllers in the Axcelis/Fusion Gemini Asher.* 2399 Serial Keyboard Program lets you control and setup the 2399 and test the ANSI modes.* 239x Table Loader Program uploads ANSI Command Table entries from an Excel csv file.
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Product
CD Measurement and Advanced Film Analysis
FilmTek CD
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Scientific Computing International
SCI’s leading-edge solution for fully-automated, high-throughput CD measurement and advanced film analysis for the 1x nm design node and beyond. Delivers real-time multi-layer stack characterization and CD measurement simultaneously, for both known and completely unknown structures. Patented multimodal measurement technology meets the challenging demands associated with the most complex semiconductor design features in development and production.
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Product
Dynamic Power Device Analyzer/Double Pulse Tester
PD1500A
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As an off-the-shelf measurement solution, the PD1500A delivers reliable, repeatable measurements of wide-bandgap semiconductors. The platform ensures user safety and protection of the system’s measurement hardware.
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Product
Highest Throughput For Fragile Devices
Ismeca NY20
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20-position turret platform for semiconductor test, inspection and packaging, provides the highest quality yield and throughput. It integrates innovative hardware and software technology such as intelligent features that enable extended autonomous operation and productivity.
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Product
PANELMAP
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PANELMAP is a software package used to collect, edit, analyze and visualize measured physical parameters on rectangular semiconductor panels. PANELMAP can import data files from various metrology tools such as ellipsometers, thickness gauges and four point probes. The imported data can then be visualized or printed as line scans, contour plots, 2D or 3D plots or as a histogram.
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Product
Bonding
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With our extensive experience in designing and manufacturing precision wafer bonding equipment, EVG is well recognized for setting industry standards in wafer bonding. EVG wafer bonding systems can be configured for R&D, pilot-line or high-volume production, and for any direct or interlayer-based bonding process, including sophisticated low-temperature covalent bonding. With this portfolio of technologies and equipment, EVG addresses markets for advanced packaging and 3D integration, MEMS, as well as advanced compound semiconductor and SOI substrates, holding the leading position and dominant market share.
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Product
Total Organic Carbon Monitor
HT-110
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The continuous online TOC-Analyzer HT-110 is suitable for the measurement ot total organic carbons in Purified Water (PW), Water For Injection (WFI) and Highly Purified Water (HPW). The unit is operating according to USP 643. It is applicable for pharmaceutical and/or semiconductor manufacturing. The measuring principle is based on UV-Oxidation and measurement of the difference in conductivity. TOC concentration measurement (TOC concentration 500 ppbC or lower) is necessary to perform quality control according to GMP (Good Manufacturing Practice).
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Product
High-Density Precision SMU (100 PA, 30 V)
PZ2130A
Source Measure Unit
The Keysight PZ2130A is a high-channel density precision source / measure unit (SMU) with 5 channels per module that saves space at a low cost per channel for a wide range of applications requiring numerous precision power supplies. Its seamless current measurement ranging function eliminates the time it takes to change the range and expands the dynamic range to cover multiple measurement ranges, which reduces test duration. These capabilities make the PZ2130A suitable for applications that require numerous precision power supplies, such as semiconductor reliability tests and integrated circuit (IC) tests. The Keysight PX0107A low noise filter adapter lowers its voltage source noise level, which makes the PZ2130A suitable for noise sensitive applications such as quantum computing as well.
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Product
High Voltage Switching Test System
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The advanced development of new technologies, such as SiC and GaN, have opened the opportunity for more efficient and higher voltage/power performance in switching and power management circuits. Their high cutoff frequencies, low on-state resistance, and very high breakdown voltages can increase power supply power handling densities approaching hundreds of watts/inch. Reliability of these new technologies and techniques is critical for realizing practical applications. While Silicon devices have a rich history of proven reliability, these newer compound semiconductor technologies are too new to have a reliability history and have not been well proven. Further, process variations, even in well-controlled lines, yield widely varying results. This has driven the need for additional testing and to burn-in devices prior to delivery.
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Product
BHF Concentration Monitor
CS-137
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The CS-137 is a high-precision chemical solution concentration monitor designed to meet the strict demands of semiconductor wet-etching processes.
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Product
Device Interface
Interface
Providing flexible, dependable services for device interface design, development, ordering, production, and support. The importance of the device interface has greatly increased, as high speed, high density semiconductor devices are more rapidly developed, and as customers more severely demand high accuracy, high reliability, and high productivity of testing.
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Product
High Temperature Digital Mass Flow Controller
SEC-8000 F/D/E Series
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The SEC-8000F/D/E series can operate in high temperature environments, from 15 ℃ to 120 ℃, for a variety of tasks including semiconductor and compound semiconductor processing.
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Product
Chip Inspection System
GEN3000T
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GEN3000T is an inspection system that performs automatic inspection of individual semiconductor chips.This revolutionary chip surface inspection system was achieved by combining the chip handling technology cultivated by Toray with the inspection algorithm used in the "INSPECTRA®" wafer defect inspection system.
