- Applied Instruments, Inc.
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Satellite Signal Level Meter
Super Buddy
Complete more installs faster and better using the Super Buddy satellite finder meter. Be "sure of your bird" with the positive ID feature or use the automatic scan to identify the unknown satellite. The Super Buddy's geo-sensitive "Field Guide" shows you just the birds visible to your install -- ALL of them, with their individual transponders. The Super Buddy even gives the elevation and azimuth for whichever satellite you select.
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120 A High Voltage 50 Ω Pulse Generator
TLP-12010C
High Power Pulse Instruments GmbH
- High pulse output current up to 120 A (short circuit)- Ultra-fast 50 Ω high voltage pulse output with typical rise time 100 ps (0 A to 40 A) and 300 ps in high-current mode (0 A to 120 A)- Wafer, package and system level TLP, VF-TLP and HMM testing- Up to 180 kW peak output power into 50 Ω load- Built-in HMM pulse up to ±32 kV in 50 Ω-configuration- High speed 50 Ω trigger output for oscilloscopes (synchronous to high voltage pulse output)- 6 USB programmable pulse rise times: 100 ps to 50 ns ...show more -
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High Power Devices
SemiProbe configures our PS4L Adaptive Architecture into the Voltarus (TM) family of probe stations to fulfill the unique requirements of testing high power devices at wafer level prior to packaging. Voltarus probe stations are available in manual, semiautomatic, and fully automatic configurations that can test and characterize power devices up to 10 KV or 200 Amps (pulsed).
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Wafer Level Test
Double sided wafer inspection system is an automatic inspection system for afterdicing wafer chip. It can do double side inspection simultaneously. The appearance defects of wafer chip are clearly conspicuous by using advanced illumination technology. Illumination and camera acquisition mode can be adjusted for various wafer process, like vertical chip or flip chip.
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Humidity Sensors
digital humidity sensor with integrated temperature sensor that provides excellent measurement accuracy at very low power. The device measures humidity based on a novel capacitive sensor. The humidity and temperature sensors are factory calibrated. The innovative WLCSP (Wafer Level Chip Scale Package) simplifies board design with the use of an ultra-compact package. The sensing element of the HDC1008 is placed on the bottom part of the device, which makes the HDC1008 more robust against dirt, dust, and other environmental contaminants. The HDC1008 is functional within the full 40C to +125C temperature range.
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Wafer/Dicing Frame Prober
WDF 12DP+
The WDF 12DP is a prober/handler capable of transporting and testing standard 300-mm wafers and dicing frames without need of a changeover kit. To support multiple tests after dicing, it has a special positioning function that differs from former types, as well as image-processing functions such as wafer level packaging.
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High Voltage 50 Ω Pulse Generator
TLP-3010C
High Power Pulse Instruments GmbH
*Wafer and package level TLP/VF-TLP/HMM testing*Ultra fast 50 Ω high voltage pulse output with typical 100 ps rise time*Built-in HMM (IEC 61000-4-2) pulse up to ±8 kV*High pulse output current up to ±30 A*High speed 50 Ω trigger output for oscilloscopes (synchronous to high voltage pulse output)*6 programmable pulse rise times: 100 ps to 50 ns*8 programmable pulse widths: 1 ns to 100 ns*Optional pulse width extender increases pulse width up to 1.6 µs in 68 programmable steps*Fast measurement tim...show more -
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Probing Solutions
ES62X-CMPS
The ES62X-CMPS compact manual probe station is a rugged wafer probing solution designed for high reliability, compact size and low investment cost. It enables manual wafer level measurements up to 300 mm wafers. The probing station can also be used for TLP, HMM, HBM, LV-Surge, RF, S-parameter and DC-measurements. Micro positioners with vacuum as well as magnetic base can be attached. The chuck has a vacuum interface for the wafer and is electrically isolated. Multiple 4 mm connectors can be used to connect a voltage potential to the wafer backside.
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High Voltage 50 Ω Pulse Generator
TLP-12010A
High Power Pulse Instruments GmbH
- High pulse output current up to ±120 A (short circuit)- Ultra-fast 50 Ω high voltage pulse output with typical 300 ps rise time- Wafer, package and system level TLP and HMM testing- 180 kW peak output power into 50 Ω load- Built-in HMM pulse up to ±32 kV in 50 Ω-configuration- High speed 50 Ω trigger output for oscilloscopes (synchronous to high voltage pulse output)- 6 digital programmable pulse rise times out of: 300 ps to 50 ns (optional)- 1 built-in pulse width: 100 ns- Optional external p...show more -
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MultiSite Test sockets and Wafer Level
multi-site sockets include anything from strip test sockets to test sockets for wafer test to multi-position, singulated devices. The advantages of these sockets can be enormous as test time can be decreased by a factor of ten over conventional one up testing. In most cases, the throughput is only limited by tester capabilities and/or handling capacity.
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Probe Card
VC43™/VC43EAF™
VC43™/VC43EAF™ probe cards offer a larger format version of the popular VC20. In addition to saving time, another advantage of the modularity is the ability to leave the interface in place and simply install the VC43™ topside using Celadon’s twist and lock insertion tool which minimizes the possibility of triboelectric or interconnect issues that can occur during typical probe card changes. The VC43™ can be used for production parametric test, modeling, characterization, and wafer level reliabil...show more -
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Probe Card
T90™ Series
The 90 mm tile was designed for mounting on a standard 4.5″ probe card holder for multi-site wafer level reliability testing. The 1.6 mm (0.062″) thick rails allow the chassis to slip into planarity adjustable probe card holders for most analytical probe stations.
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Production Wafer Level Burn-in
TV19 VersaTile™ probe cards are designed with Celadon’s patented ceramic technology for superior electrical performance, yet is highly modular due to it’s 28mm x 28mm chassis. Micro-adjustments can be made in seconds with an allen wrench and a microscope. Easily align VersaTile cards for different wafer layouts using a 4.5” compatible 1×3 , 200mm, or 300mm VersAdjust plate.
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MPI Automated Probe Systems
MPI Advanced Semiconductor Test
MPI’s 200 mm and 300 mm automated probe systems are dedicated and designed to address current and future requirements for all facets of Device Characterization for Modeling and Technology/Process Development, Failure Analysis, Design Verification, IC engineering, Wafer Level Reliability as well as special requirements for MEMS, High Power, RF and mmW device testing.
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Wide Band Gap Production System
Reedholm has configured an integrated system, not just a set of boxes, for testing high power devices at the wafer level. Sophisticated testing, prober control, and database management do not carry a programming burden. As a result, fast, automated wafer testing is done in an inexpensive, compact probing platform.
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Sorters
Spartan™
The unified wafer management system gives the Spartan™ Sorter the minimum scale and complexity required to accomplish its core job – to move wafers as cleanly and as quickly as possible. The Spartan Sorter offers improved reliability and maximized efficiency, while delivering industry-leading cleanliness with the lowest particle levels.
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Single- and Dual-Yaw Axis Wafer Transport Robot
GPR-GB7SY
The GPR-GB7SY Yaw-Axis (single and dual yaw) robot features Genmark’s technologically advanced mechanisms including patented GPR and YAW technologies to achieve the highest level of performance currently available in an automated material handler capable of transporting up to 450mm wafer payloads with utmost reliability and precision.
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Custom Assembly, Packaging and Qualification
DPACI specializes in providing Turn-Key Solutions. We offer comprehensive manufacturing, assembly, qualification, testing, and certification of high reliability EEE components. We have a dedicated, self-contained Class 10,000 clean room with Class 100 laminar flows certified to QML Q (Military) and V (Space) levels to perform all assembly operations from wafer processing to final hermetic package seal
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Wafer Test
Silicon Turnkey Solution, Inc.
Most foundries provide wafers already probed to a set of DC parameters at room temperature to ensure they meet a basic subset of the package-part specification. Beyond this basic set of tests, more rigorous testing is often needed to meet specifications requiring die to be 100 percent probed, identify and segregate devices with higher performance levels and guarantee that parts will perform to a certain specification level.
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Wafer Level Test Handler
Kronos
Wafer level test handler for 6/9DOF sensors with real stimulus. Very high UPH capacity and the lowest cost of test (COT). KRONOS is one of the only wafer level test solutions for motion sensors with real stimulus.
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LED Type Wafer Alignment Sensor Controller
HD-T1
Panasonic Industrial Devices Sales Company of America
The HD-T1 Series is a new Wafer Alignment Sensor that uses a safe red LED light beam, with a resolution of 30µm, to achieve the same high level performance as Laser Sensors. The HD-T1 Sensor is best suited to detect wafer eccentricity, notches and orientation flats. Using linear image Sensor methodology and high-speed sampling technology, a wide variety of objects can now be stably measured with great precision at ultra-high speeds. This CCD style Sensor is developed for use in almost all fields of industry, e.g. tire manufacturing or Semiconductor production (Wafer Printed Circuit Boards).
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Equipment Front End Module (EFEM) Class 1 Minienvironment System
MiniMax™
Genmark’s MiniMax™ Equipment Front End Module (EFEM) is a class 1 minienvironment system designed to maximize productivity of semiconductor processing equipment tools that require the highest level of automation.The MiniMax™ can be customized to meet the automation requirements of any semiconductor manufacturing tool application and specified with one of the Genmark’s sophisticated and precise wafer and reticle handling robots, including the full line of patented GPR single or dual arm robots, GREX robot series, single and dual wafer aligners, FOUP/FOSB openers, reticle libraries, as well as any other customer specified equipment.
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Wafer/Chip/Package Semi-automated ESD Tester
400SW
Tokyo Electronics Trading Co., Ltd.
Semi-automated ESD tester featuring Ecdm 400E, Universal ESD Simulator. Used with a manual wafer probing system or a die manipulator, wafer or die level semi-auto ESD test can be done, as well as packaged device test. Damage is detected by V-I curve or leakage current change detection. Stress level and measurement points are programmed by personal computor via GP-IB. Once test terminals are selected, ESD endurance is automatically measured.
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High Voltage 50 Ω Pulse Generator
TLP-8010A
High Power Pulse Instruments GmbH
*Wafer and package level TLP/HMM testing*Fast 50 Ω high voltage pulse output with typical 300 ps rise time*Up to 80 kW peak output power into 50 Ω load*Built-in HMM pulse up to ±15 kV with 50 Ω-configuration*High pulse output current up to ±80 A (short circuit) with 6 dB reflection suppression*High speed 50 Ω trigger output for oscilloscopes (synchronous to high voltage pulse output)*6 GPIB programmable pulse rise times: 300 ps to 50 ns*1 built-in pulse width: 100 ns*Optional external pulse widt...show more -
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Probe Series
CAPELLA Series
MPI Photonics Automation is the industry leading provider of turnkey test solutions for the LED / Mini LED manufacturing industry. With more than 10,000 MPI probers installed worldwide, the CAPELLA series of probers have a proven track record of superior performance and reliability. The CAPELLA series probers support electrical and optical characterization of all LED product types (Vertical chip, Lateral chip, Flip-chip) from wafer to packaged die level. Whether you need a high-performance, cost-effective or specialty prober system, MPI PA has the most comprehensive range of LED wafer/chip probers to meet your exacting requirements.
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Wafer Test
Automatic KLA wafer probers with tray-to-tray-wafer-handling are operated 24h a day and 7 days a week. Data retention bake/tests are done at wafer level
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High Voltage 50 Ω Pulse Generator
TLP-4010C
High Power Pulse Instruments GmbH
*Wafer and package level TLP/VF-TLP/HMM testing*Ultra fast 50 Ω high voltage pulse output with typical 100 ps rise time*Built-in HMM (IEC 61000-4-2) pulse up to ±10 kV*High pulse output current up to ±40 A*High speed 50 Ω trigger output for oscilloscopes (synchronous to high voltage pulse output)*6 programmable pulse rise times: 100 ps to 50 ns*8 programmable pulse widths: 1 ns to 100 ns*Optional pulse width extender increases pulse width up to 1.6 µs in 68 programmable steps*Fast measurement ti...show more -
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Automated Wafer Handler up to 450mm
GPR-GB7S
The GB7S Robot System employs Genmark’s breakthrough and patented GPR™ Technology to achieve the highest level of performance currently available in an automated wafer handler which is capable of handling up to 450mm diameter wafers. The patented GPR technology enables the servo-controlled robot to interface compliantly and intelligently with misaligned cassettes, FOUPS and process modules, as well as provide software-controlled end-effector deflection compensation during transport of heavier pa...show more -
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Bond Tester for Wafers 2 - 12 inch
Sigma W12
Bondtester for wafers or at wafer level 2” – 12” (up to 300 mm)Precise testing and Cold Bump Pull (CBP) testingLarge X/Y stages X: 600mm, Y: 370 mmForce range from 1gf – 10 kgfBump pitch down to 20 µm
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Nano-focus X-ray Inspection System
X-eye NF120
Nano-focus Tube of 400 nano resolution is installed which is specialized for Semiconductor Packaging, Wafer Level Packaging(WLP) requiring detection of Sub-micron defects.Able to trace and inspect defected area precisely by precise movement of axis with Anti-vibration table.Tomography is available if 3D CT module is added and Wafer Bump Automatic Inspection is available from loading to inspection with wafer handler systems.
