3-D Solder Paste Inspection
checks form, height, surface area, bridges, volume, x/y offset and coplanarity of solder.
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Radiographic Inspection Test
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The radiographic inspection is a non-destructive x-ray method for detecting internal physical defects in small component parts which are not otherwise visible. Radiographic techniques are intended to reveal such flaws as improper positioning of elements, voids in encapsulating or potting compounds, inhomogeneities in materials, presence of foreign materials, broken elements, etc.
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Explosion Proof UV Inspection Light
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he Labino MB Hercules Ex is an extremely durable product specifically developed for use in areas where the risk of an explosion is high. Offshore Oil Rigs, Refineries, Aerospace, and Defense often require explosion proof products to ensure safety for their inspection teams. The Midbeam Hercules Ex has successfully completed extremely tough tests, including tests for thermal conditioning, Impact Tests, Drop Tests and IP tests that led to the ATEX certification (Certificate: ITS17ATEX402144X). This unique product is suitable for use in extreme weather conditions varying from 104° Fahrenheit (+ 40° Celsius) to minus 4° Fahrenheit (- 20° Celsius).
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Defect Inspection Module
EB40
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The Class 1 certified E40 and B40 modules (available separately or combined in one module) can automatically detect defects on the entire edge, from zone 1 to 5, and the entire backside. The ability to inspect the entire backside allows for faster root-cause analysis of zone 5 defects since such defects can migrate from the wafer interior.
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3D Optical Surface Profiler
NewView™ 9000
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The NewView™ 9000 3D optical surface profiler provides powerful versatility in non-contact optical surface profiling. With the system, it is easy and fast to measure a wide range of surface types, including smooth, rough, flat, sloped, and stepped. All measurements are nondestructive, fast, and require no sample preparation.
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Refurbished And Demo X-ray Inspection Systems
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Our 2024 collection of refurbished and demo X-ray inspection systems offers high-quality performance at an affordable price. These precision X-ray inspection systems provide exceptional value without compromising on quality.
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Reel to Reel Non-Contact OS Inspection System for TAB/COD/TCP/TBGA
TRV
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*Most suitable mechanism for non-contact inspection*Sprochet-less transfer decreases products damage.*Easy operation by Fixture alignment mechanism*Equipped with Tracing Test function
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Wireless Inspection Cameras
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General offers three wireless inspection cameras whose probes can be disconnected from the grip and monitor. They are the DCS18HPART (with a 6mm/0.23 in. diameter articulating probe), the DCS1800HP (with a 5.5mm/0.22 in. diameter non-articulating probe), and the DCS500 (with a 9mm/0.35 in. diameter probe and a 5 in. diagonal color LCD). Wireless inspection cameras offer operating flexibility because the user can use both hands to manipulate the probe.
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3D Machine Vision Systems
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Whether performing a single profile measurement or scanning an entire surface in 3D, Cognex has the most powerful and robust 3D machine vision tools. Manufacturers in all industries trust Cognex technology to deliver high accuracy surface feature measurements that go beyond the capabilities of 2D machine vision technology.
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X-Ray Inspection
MXI Jade Plus
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Restrictions in manufacturing materials and ever increasing expectations for reliability mean ensuring quality product manufacture is more important than ever. Jade Plus enables you to Prove Your Quality and reduce product returns from the field, and the associated cost and damage to reputation.
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Metra Scan 3D
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The most accurate scanning and probing solutions, whether in lab or on the shop floor.Highly accurate measurementDynamic referencingComplete metrology solution
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IR Inspection System
EVG®20
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The EVG 20 offers a fast inspection method, especially for fusion bonded wafers. A live imageof the entire wafer via IR transmission supports void detection down to a radius of 0.5 mm. The infrared inspection system is a perfect match for fusion bonding processes either as the stand-alone EVG 20 tool or as a station in EVG''s integrated bonding systems.
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Inspection Scope
KI-TK1010
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Inspection scope & cleaning materials for SC, FC, ST connectors, universal 2.5 mm & 1.25 mm ferrules (LC / 1.25 mm option)
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Building Inspection System with Moisture Hygrometer & MSX® IR Camera
FLIR MR277
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The MR277 is the first FLIR building inspection system to combine the advantages of Infrared Guided Measurement (IGM) and our patented Multi-Spectral Dynamic Imaging (MSX) with advanced environmental sensors to help you quickly locate, clearly identify, and easily document problems. IGM technology and a laser pointer isolate the area where you can use the integrated pinless moisture sensor for non-invasive readings or external pin probe for invasive measurements. With automatically calculated environmental readings and a field-replaceable humidity/temperature sensor, the MR277 lets you finish the job and minimize downtime. Connect to external devices with METERLiNK® and use FLIR Tools® to enhance troubleshooting and reports.
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Product
01 With Soldering Eyelets | 12 Positions | M8 | 2 Wafers
01-2xxx-00/30xx-12-0
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Multi wafer compact selector with 30° detent angle, 4 mm shaft diameter, 25'000 switching cycles and with up to 6 Ncm switching torque
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Silicon Inspection System
NIR-01
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The NIR-01 imaging system is made of CNC engineered Aluminium alloy. The suruface protection is powder painting and electrolitic oxidation on pure aluminium surfaces. The frame of the system is a high quality industrial design. All components are designed for long term heavy usage with minimal maintenance needs. Electrical components are also selected for stability and durability. The block like electronics gives the advantage of easy and quick repair.
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Digital Automated Interferometer and Microscope for Surface Inspection
DAISI-V3
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The ultimate production interferometer for measuring end-face geometry on single-fiber connectors, equipped with a revolutionary «no-exterior-moving-parts» mechanical design.
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Fiber Inspection & Cleaning
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ShinewayTech Fiber Inspection & Cleaning - Optical Connector Inspector, Wireless FIber Inspection Probe, Cleaning Pen, & more.
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Non-Destructive Test Resonant Inspection Station
RAM-TEST-FIXTURE
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The NDT Test Station, Model RAM-TEST-FIXTURE Resonant Inspection System is an ideal choice for testing when repeatable manual inspections are required. The innovative Test Station allows precise control of part positioning with an adjustable table ranging up to 6.25 inches (158.75 mm) in height.
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Digital Automated Interferometer for Surface Inspection
DAISI
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DAISI (Digital Automated Interferometer for Surface Inspection) achieves the high workability and repeatability with the features such as auto-focus function, auto-calibration function and auto connector fixing system.
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Desktop 3D Scanners
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Automated 3D Scanning for small to medium sized parts. Desktop scanners offer a more compact solution with great accuracy.
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Testing, Inspecting & Cleaning Kit
KI-TK033
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850/1300 nm source & power meter, inspection microscope, cleaning materials. Interchangeable MPO, SC, LC connectors
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Benchtop 3D Optical Profilometers
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Compact, non-contact metrology instruments used for high-precision, sub-nanometer to micrometer-level measurement of surface topography, roughness, and step heights.
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Product
Solder Paste Printers
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Shenzhen Leadsmt Technology Co.,Ltd
Is mainly used to print the solder paste to the circuit board, is one of the essential equipment in electronic manufacturing.
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Product
Full 3D Inline Metrological & Imaging AOI
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Metrological Full 3D AOI is achieved by measuring all 3 dimensions (X, Y and Height) to detect every measurable solder and component defect pre-reflow and/or post reflow soldering.
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Product
04 With Soldering Eyelets | 3 Wafers | 24 Positions
04-3xx3-00/30-xx
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Very robust, multi wafer selector with 15° detent angle, switching torque up to 20 Ncm and a rotational life up to 25'000 cycles
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Dual Projection 3D In-Line Solder Inspection System
KY8030-2
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The new KY8030-2 delivers 2x fasterinspection without compromising performanceand accuracy.Using patented dual projection, the systemeliminates the critical Shadow problem thatall 3D SPI systems can be vulnerable to.Easy UI and SPC Plus are included in the systempackage in order to help users achieve faster& easier printer process optimization
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Optical BGA Inspection
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Imaging hidden solder joints of BGA, IBGA, FlipChip, CSP, CGA and SMD components
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3D Audio Servers
GoldSeries
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AuSIM offers a growing number of prepackaged configurations, designed to meet a broad spectrum of R&D and deployment needs. These standard packages are generically called GoldSeries, and have a range of options to tune them to the needs of a specific project. If none of these are appropriate to your application, AuSIM will gladly develop a custom package for your specialized needs.
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Solderability Tester
LBT210
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Microtronic Microelectronic Vertriebs GmbH
Microtronic's LBT-210 solderability tester has software that offers statistical information such as mean value, standard deviation, etc. A camera option offers video of the test cycle and storage in memory with the appropriate test measurements and data. Additionally, it has the feature to test under nitrogen. This function can be switched on in the software. An enclosure that is flooded with nitrogen lowers and rises with the device under test.
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Micro Coax, Two Piece Contact, ITA, PCB Vertical Mount, Solder
610141109
Coax Contact (ITA)
For vertical PCB terminationsUsed with standard 50 and 120 Pin Micro Coax ModulesUp to 10GHz transmission speeds (PCB design dependent)Two-piece contact that allows for pin replacement, field repairableMates to all existing Micro Coax contacts
