3-D Solder Paste Inspection
checks form, height, surface area, bridges, volume, x/y offset and coplanarity of solder.
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Product
Inspects MEMS and Wafer Level Devices
NorCom 2020-WL
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The NorCom 2020-WL is specifically designed for wafer-level inspection and leak tests up to 1000 devices per cycle. The system can inspect up to an 8” wafer on or off a saw frame. It is designed to test MEMS and other wafer level devices that have a cavity.
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Product
WiFi Inspection Cameras
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WiFi Inspection Cameras generates a local WiFi hotspot (without Internet access) through which video clips and still photos of hard-to-reach or hard-to-see areas or equipment captured by the probe camera can be sent to an app-enabled smartphone or tablet for viewing and sharing. Free apps for iOS devices (iPhones or iPads) and Android devices are available from the iTunes App Store and Google Play Store, respectively. The three WiFi cameras differ in probe length, camera lighting and grip style.
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Product
Micro Coax, Two Piece Contact, ITA, PCB Vertical Mount, Solder
610141109
Coax Contact (ITA)
For vertical PCB terminationsUsed with standard 50 and 120 Pin Micro Coax ModulesUp to 10GHz transmission speeds (PCB design dependent)Two-piece contact that allows for pin replacement, field repairableMates to all existing Micro Coax contacts
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Product
Non-contact 3D Optical Profilers
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LuphoScan platforms are interferometric, scanning metrology systems. They are designed to perform ultra precision non-contact 3D form measurements mainly of rotationally symmetric surfaces such as aspheric lenses.
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Product
3D Optical Profilers
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Bruker is the industry-leading provider of 3D surface measurement and inspection solutions, offering systems for fast, reliable, and easy-to-use non-contact analyses with best-in-class accuracy on samples ranging in size from microscopic MEMS to entire engine blocks. They provide researchers and engineers in R&D, manufacturing, and quality control the industry-leading sensitivity and stability necessary for precision 3D surface measurements in applications and environments that are challenging for other metrology systems.
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Product
High Energy Industrial CT X-Ray Inspection System
MeVX Series
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The most advanced industrial DR & CT systems in the world are now available with Linear Accelerators. Offered with energies up to 9MeV, the MeVX series of systems provide the same ease of use as our low energy systems in a high energy format. Utilizing our current efX software platform along with the superior service, support & training that we are known for puts these systems in a class of their own.
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Product
A Compact X-ray Inspection System, The MedaScope™ Desktop
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A compact X-ray machine weighing only 55 pounds, the MedaScope Desktop is easy to carry and can be set up rapidly. Glenbrook’s MedaScope Desktop is a portable, compact manual system for real-time, magnified x-ray screening of packaged devices including medical devices, electronics, and cables.
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Product
Luminescence Defect Inspection System
INSPECTRA® PL Series
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This system uses luminescent images created using photoluminescence (PL) to perform high-speed, high-sensitivity automatic inspection for crystal defects, cracks, and luminescence defects which cannot be detected with conventional visible light surface inspection!
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Product
ATD 3D Layout Machine
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ATD Model is consisted of 2 main body and one cast iron surface plate for marking work and 3D measruing.
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Product
Advanced 3D Graphic
Geo Surface3D PRO
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ScienceGL offers 3D visualization for extended GIS data that combines multiple layer terrain and multi-variable thematic map in one interactive 3D screen. Visualize Digital Elevation Model (DEM), land map, roads, satellite image, LIDAR data in the same screen. Combine terrain data with vector graphics, businesses thematic map, weather map, etc. Use transparancy to highlight more important data. The unique combination of GIS and multi-variable thematic maps helps to discover trends and patterns quickly and accurately. No other data presentation method comes close to expressing so much information within such a small space.
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Product
Borehole 3D Geophones
GFA 50/100
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3D borehole geo-phone is realized with 3x high sensitive geophones (nat.freq.10 Hz- 1 vertical and 2 horizontal sensors) oriented according to a triad of orthogonal Cartesian axes XYZ. Delivered with a cleat assembly to sustain its weight at the requested depth (GFA cable is graduated in meters), this borehole geophone has a pneumatic-mechanical clamping system.
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Product
Non-Destructive Inspection Equipment
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Non-destructive inspection means that various materials such as metal are "without damaging the object, knowing the presence or absence of scratches on the surface or inside and the degree of scratches, and passing the object against standards such as standards.
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Product
3D Digital Inspection
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Digital stereo 3D imaging is a unique, advanced, stereo image presentation system designed to provide fully interactive real time natural 3D viewing and visualisation with outstanding depth perception.
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Product
3D AOI Series
MV-6 OMNI
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- Exclusive 15MP / 25MP CoaXPress Camera System- OMNI-VISION® 3D Digital Tri-Frequency Moiré Technology- Leading-Edge 12 Projection Blue DLP Technology- Precision Compound Telecentric Camera Lens- Eight Phase Color Lighting System- 10MP / 18MP SIDE-VIEWER® Camera System- Programmable Z-Axis Multi-Focus System- INTELLI-PRO® Automatic Programming Software- Multi-Functional AOI-SPI Fusion Technology- INTELLISYS® Industry 4.0 Intelligent Factory Automation System
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Product
9-Pin D-Type Male, Solder Bucket, HV
40-960-009-M-HV
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9-Pin Male D-Type Connector, High Voltage, Solder Bucket - With Backshell
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Product
Inspection System
CIX100
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The OLYMPUS CIX100 inspection system is a dedicated, turnkey solution for manufactures who maintain the highest quality standards for the cleanliness of manufactured components. Quickly acquire, process, and document technical cleanliness inspection data to comply with company and international standards. The system’s intuitive software guides users through each step of the process so even novice operators can acquire cleanliness data quickly and easily.
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Product
Inspection Tools
Deca XG1040
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SATA 3.0 Gbps interface supportedSATA 3.0 Gbps supported. Up to 144PB HDD is supported.Register and edit inspection details (operation modes)Operation modes can be registered and edited using script files in text format.More accurate inspections can be performed using various types of inspections.Provides high speed data transfer at 8GB/minute.(* Varies according to performance of connected HDD.)Deletion and quick diagnostics functionEquipped with overwrite deletion using specified values and DoD (Department of Defense) conforming deletion method.Quick inspections such as SMART status, random seek inspection, entire area read/write inspection can be performed.HDDs connected to each port can be executed, terminated, attached or removed individually.Multiple channels supportedUp to 16 HDDs can be operated by attaching 4 devices.
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Product
3D And 2D Visualization Software
3DViz
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The 3DViz software provides intuitive 2D and 3D visualization of high-definition sensor data. Software allows strain or temperature data from an ODiSI system to be visualized directly on a 3D CAD model or a 2D image.
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Product
Digital Video Inspection Microscope
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Contamination is the first reason for troubleshooting optical networks. Proactive inspection and cleaning of fibre connectors can prevent poor signal performance, damage to equipment, and network downtime. DIAMOND’s Video Microscope Kit contains all necessary tools for proper inspection and cleaning of the connector’s front-faces to help ensure optimal connector performance.
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Product
Digital Ultrasonic Inspection, Information, storage, and retrieval system
ULTRAPROBE 3000
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The Ultraprobe 3000 is an advanced digital ultrasonic leak detector specializing in compressed air, leak detection, and steam traps. This instrument is versatile and offers reporting capabilities such as on-board data logging.
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Product
01 With Soldering Eyelets | 12 Positions | M8 | 2 Wafers
01-2xxx-00/30xx-12-0
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Multi wafer compact selector with 30° detent angle, 4 mm shaft diameter, 25'000 switching cycles and with up to 6 Ncm switching torque
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Product
Multicore Universal Solderability Tester
MUST System 3
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The MUST System 3 is the latest technological evolution of the original Multicore Universal Solderability Tester (MUST) that grandfathered all modern solderability test standards. It remains the unquestioned industry benchmark for solderability testing.
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Product
Wireless Inspection Cameras
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General offers three wireless inspection cameras whose probes can be disconnected from the grip and monitor. They are the DCS18HPART (with a 6mm/0.23 in. diameter articulating probe), the DCS1800HP (with a 5.5mm/0.22 in. diameter non-articulating probe), and the DCS500 (with a 9mm/0.35 in. diameter probe and a 5 in. diagonal color LCD). Wireless inspection cameras offer operating flexibility because the user can use both hands to manipulate the probe.
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Product
X-Ray Inspection System
MX1
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Manncorp’s new MX1 is a high-performance x-ray inspection system designed for real time imaging of multilayer PCBs and dense metal BGAs, μBGAs, and chip scale packages. Its high voltage (80kV), computer-controlled x-ray tube and 35 μm focal spot provide the power necessary for detection of a variety of defects including bridging, voids, and missing balls. The MX1’s standard camera features continuous zoom magnification from 4X to 50X and variable angle viewing up to 45°, and an upgrade to the x-ray tube can boost magnification to 225X.
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Product
Customized Semiconductor Wafer Inspection, Sorting & Metrology Equipment | Systems
Customized Solutions
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Unique Needs? Need better wafer inspection throughput, accuracy, versatility? Need a wafer defect inspection expert who’s not a sales person? We’ve been providing complete semiconductor wafer inspection, sorter, and microscopes solutions to semiconductor wafer manufacturers since 1994.
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Product
Soldering Station
SM-943
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*Module: 943*Display: LED*Power Rating: 220V/70W*Temperature: 200-480DEGREE*Noisy: <45dB
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Product
Post Wire and Die Bond Inspection Machine
IV-T3300
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IV-T3300 is a post wire and die bond inspection machine with Dual JEDEC Tray Feeder System. It features a large inspection area of 600x500mm and a quick trays change of 5-7 seconds.
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Leadframe Inspection Machine
IV-L200
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The IV-L200 is a leadframe inspection machine ideal for measuring leadframe dimension and pitch. Aside from identifying leadframe warpage, it is also used to detect bent or skewed leads as well as surface defects such as scratch, ink, and contamination, among others.
