Showing results: 286 - 300 of 473 items found.
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DSU1-508 -
Sercel Group
DSU1-508, featuring QuietSeis™, is Sercel’s newest and most advanced digital sensor using next generation MEMS technology. Fully integrated with 508XT, the innovative design of QuietSeis provides the most accurate data for any survey type up to 1.000.000 channels.
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LIS2DH12 (Qwiic) -
SparkFun Electronics
Qwiic has struck again! This MEMS, three axis accelerometer by STMicroelectronics has been outfitted to communicate over Qwiic. The LIS2DH12 is an ultra-low-power highperformance three-axis linear accelerometer belonging to the “femto” family with digital I2C/SPI serial interface standard output.
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Thorlabs, Inc.
Thorlabs' optical switches are available for fiber-optic circuit integration or construction. We offer optical switches with integrated MEMS technology, optical switch kits, and PRO8 modules. Also available are optical switches for applications requiring an optical shutter in the 1500 - 1600 nm range.
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STMicroelectronics
ST’s tiny silicon pressure sensors use innovative MEMS technology to ensure extremely high-pressure resolution in ultra-compact and thin packages. The devices implement proprietary technology for the fabrication of pressure sensors on monolithic silicon chips, which eliminates wafer-to-wafer bonding and maximizes reliability.
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GPR -
Sercel Group
GPRNT is an innovative seabed nodal solution based on Sercel’s leading-edge QuietSeis® technology meeting the very latest seismic industry expectations for performance. The unrivalled digital fidelity and ultra-quiet performance provided by the QuietSeis MEMS sensor ensure a step change in seismic data quality.
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MS5637 -
SparkFun Electronics
MEMs based barometric pressure sensors are quite common these days. The Qwiic Pressure Sensor with the MS5637 shines by being the most sensitive barometric pressure sensor we have come across. It is capable of detecting the difference in 13cm of air! And the MS5637 is low cost and easy to use to boot.
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Panasonic Industrial Devices Sales Company of America
Panasonic Grid-EYE® is an 8x8 (64) pixel Infrared Array Sensor. This Sensor offers digital output (I2C) for thermal presence, direction, and temperature values. The built-in lens includes a 60-degree viewing angle. Grid-EYE features compact SMD design using MEMS thermopile technology.
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WMA-320 -
Falco Systems
The WMA-320 is a high voltage, wide bandwidth laboratory amplifier. Its high output voltage, current and wide bandwidth have been designed to serve the needs of a wide variety of high-tech experiments. The WMA-320 can be used for MEMS actuation, EO-modulators, PZT (piezo) positioners, ultrasonics, and many other applications.
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ADXL335 -
SparkFun Electronics
Breakout board for the 3 axis ADXL335 from Analog Devices. This is the latest in a long, proven line of analog sensors - the holy grail of accelerometers. The ADXL335 is a triple axis MEMS accelerometer with extremely low noise and power consumption - only 320uA! The sensor has a full sensing range of +/-3g.
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ASM GmbH
Inclination sensors measure inclination between 0 and +/-180 in a non-contact, wear-free and absolute way. Utilizing the MEMS technology, these sensors are extremely resistant to shock, vibration and dirt, and are therefore well suited for outdoor applications. Various sensor enclosure designs open possibilities for many different types of applications.
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Grinding and Dicing Services, Inc.
GDSI delivers complete backgrinding solutions to the semiconductor, MEMS and biomedical industries. Backgrinding is a necessary process step to reduce wafer thickness prior to dicing and final assembly. By utilizing fully automated grinders staffed by highly qualified engineers, GDSI’s grinding procedures produce unsurpassed precision and repeatability.
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Applied Image, Inc.
For years APPLIED IMAGE has been serving customers who work with semiconductors, displays, PCB, MEMS, along with college professors, researchers, and students with Photomask making solutions tailored specifically to each customer’s needs. Working with a dedicated sales engineer means that you will have all of your questions answered.
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EV Group
ith over 15 years experience in designing and manufacturing precision wafer bonding equipment, EVG wafer bonding systems are well recognized in setting industry standards for the MEMS production industry. Besides supporting wafer level and advanced packaging, 3D interconnects and MEMS fabrication, the EVG500 series wafer bonding systems can be configured for R&D, pilot-line or volume production. They accommodate the most demanding applications by bonding under high vacuum, precisely controlled fine vacuum, temperature or high pressure conditions. Multiple bonding methods including anodic, thermo compression, glass-frit, epoxy, UV and fusion bonding are covered. Based on a unique modular bond chamber design the EVG500 series allow for an easy technology transfer from R&D to high volume production.
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McLAREN Applied Technologies
The unit is based on micro machined MEMS technology. The unit contains a 35g sensing element. The element is scaled to optimise the resolution to suit the g range of interest. An internal amplifier provides an output between 0 and 5 volts. The on board microcontroller and temperature sensor are used for offset drift compensation. This unit can be re-calibrated at the factory.
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STI9000 -
Solidus Technologies, Inc.
The STI9000 is a mixed signal ATE used for testing ASIC and MEMS products. Each STI9000 test instrument fits into a small tester mainframe and contains multi-functional analog and digital test resources.