Showing results: 271 - 285 of 476 items found.
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VIEW Micro-Metrology
VIEW offers a full line of optical metrology systems for wafer, photomask, slider, MEMS, semiconductor package, HDD suspension, probe card, and micro-component process measurements.
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MICROLINE AF -
VIEW Micro-Metrology
The VIEW MicroLine® is a high-performance critical dimensional measurement system for wafers, masks, MEMS and other micro-fabricated devices in situations which do not require fully automated operation.
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InFlip -
Cohu, Inc.
InFlip MEMS strip-test module incorporates a modular architecture designed to replace expensive custom-designed machinery. It can operate in a standalone mode or it can be configured with a Cohu InStrip platform for full automation.
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Averna
Quickly deliver flawless camera & LiDAR modules, MEMS devices, die based sensors, LED and laser-based headlights and other high-end products with a supremely accurate standardized platform.
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Analog Devices Inc.
Analog Devices accelerometers and iSensor® MEMS accelerometer subsystems provide accurate detection while measuring acceleration, tilt, shock, and vibration in performance driven application. Our portfolio leads the industry in power, noise, bandwidth, and temperature specifications, and offers a range of MEMS sensor and signal conditioning integration on chip. Our MEMS-based Circuits from the Lab® reference designs have been built and tested by ADI experts to help you jumpstart your next system design.
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Analog Devices Inc.
Analog Devices accelerometers and iSensor® MEMS accelerometer subsystems provide accurate detection while measuring acceleration, tilt, shock, and vibration in performance driven application. Our portfolio leads the industry in power, noise, bandwidth, and temperature specifications, and offers a range of MEMS sensor and signal conditioning integration on chip. Our MEMS-based Circuits from the Lab® reference designs have been built and tested by ADI experts to help you jumpstart your next system design.
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ULTRA L -
FocusTest, Inc.
The ULTRA L is a high performance “Lab” system that provides thermal conditioning, mechanical stimulus and an electrical ATE signal path for testing Micro-Electro-Mechanical Systems (MEMS) Accelerometers and Gyroscopes.
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Shenzhen Golight Technology Co.,Ltd
Optical switch is an instrument with optical path switching and optical channel expansion function. It can integrate different types of optical switch devices such as mechanical, MEMS, electrooptical, and magneto-optical according to user requirements.
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RedSparrow -
OtO Photonics Inc.
spectrometer is constructed by MEMS technology and designed for near infrared region. It can provide high optical resolution and fast spectral response and the compact size is very flexible for system integration, portable and handheld.
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aixACCT Systems GmbH
Whether thin film, thick film, MEMS, multilayer or bulk: With test systems from AixACCT Systems, you can characterize your piezoelectric materials both in development and during production with the greatest accuracy.
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ULTRA P -
FocusTest, Inc.
The ULTRA P is a high performance production handler that provides thermal conditioning, full 6 DOF mechanical stimulus and an electrical ATE signal path for testing Micro-Electro-Mechanical Systems (MEMS) Accelerometers and Gyroscopes.
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Sensata Technologies
Whatever configuration you require, look to Sensata. Our devices span a spectrum of pressure ranges, configurations and form factors.High pressure (>750psi / 50bar)Micro Silicon Strain Gauge solutions provides rugged reliability and a hermetic seal for a wide variety of environmentsMid pressure (100 to 750psi / 6 to 50 bar)Ceramic capacitive or MEMS solutions offer a wide range of solutions tailored to application needs at superior valueLow pressure (inches of water to 100psi / 2mbar to 6 bar)MEMS solutions including TPMS offer extremely low power consumption and wireless connectivity
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Fujikura Ltd.
Through state-of-the-art silicon MEMS(Micro Electronics Mechanical System) process and assembly technology, Fujikura produces various types of piezo-resistive pressure sensor such as sensing elements, integrated sensors and modules. The products feature high-accuracy, high-reliability and cost-effectiveness.
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EV Group
With the invention of the world’s first double sided alignment system in 1985, EV Group has revolutionized MEMS technology and set worldwide industry standards in aligned wafer bonding by separating the alignment and bonding process. This process separation results in higher flexibility and universal application of the wafer bonding equipment. The EVG bond alignment systems offer highest precision, flexibility, ease of use and modular upgrade capability and have been qualified in numerous high throughput production environments. The precision of EVG bond aligners accommodates most demanding alignment processes in MEMS production and in emerging fields like 3D integration applications.
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Nippon Avionics Co.,Ltd.
It is an equipment to hermetically seal the packages, such as the crystal and SAW devices, optical devices, sensors, MEMS, etc., by seam welding. Hermetic sealing can be accomplished in both N2 and vacuum environment. Furthermore, we are offering a variety of products for research and development and production applications.