Showing results: 181 - 195 of 274 items found.
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LXinstruments GmbH
Source Measure Units are high-precision multifunctional devices that combine voltage/power supply and various measurement functions in one unit. This combination eliminates the need to interconnect several units, which can otherwise be very time-consuming.In addition to the standard measurement tasks for voltage and current, devices with LCR extension can also be used to determine inductance, capacitance and resistance of the respective specimen.
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N7562A -
Keysight Technologies
A series of multiport ECal that cascade-able up to 36-ports which makes it possible to calibrate a wide frequency range from DC up to 9 GHz without making numerous connections during calibration process. Ideal for multiport measurement application with VNA in such as high-volume PA/FEM, massive MIMO antenna or high-speed digital interconnect test applications
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PCIe -
Teledyne LeCroy
PCI Express (PCIe) has become the leading interconnect technology to succeed the Peripheral Connect Interface (PCI) architecture. The PCI Express(PCIe) architecture retains the PCI usage model and software interfaces for investment protection and smooth development migration. The technology is aimed at multiple market segments in the computing and communication industries, and supports chip-to-chip, board-to-board and adapter solutions. PCI Express 5.0 currently runs at 16GT/s or 32Gbps per lane in each direction, providing a total bandwidth of 128GBps in a 16-lane configuration which is the largest size in use.
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Smiths Interconnect
Smiths Interconnect is committed to providing technically advanced, high quality “state-of-the-art” RF Filters, Multiplexers, Switched Filter Banks, and Integrated assemblies, from 100 KHz to 65 GHz. All products are subject to the same rigorous design, manufacturing, and inspection criteria. Regardless of the application, our internal process and procedures help ensure that all products are fully compliant to all specifications. Our R & D activities are constantly evaluating new materials, plating techniques, and manufacturing processes to offer the highest performing components available today.
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Hamlet Video International Ltd
The MSC remote control panels operate over a standard 10BaseT Ethernet LAN. Most other switcher manufacturers either offer no remote control panels and rely solely on expensive third party control''s connected to the RS232 port, one remote panel that ties up the RS232 port or some form of proprietary multi-panel interconnect scheme. Typically these proprietary systems have no isolation between control panels. If one panel fails possibly all of the panels on the network can be locked out until the failed panel is found and removed or fixed.
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Frequency Devices Inc.
Is a computer bus interconnect for industrial computers,combining a Eurocard-type connector and PCI signaling and protocols. Boards are standardized to 3U or 6U sizes, and are typically interconnected via a passive backplane. The connector pin assignments are standardized by the PICMG US and PICMG Europe organizations. The connectors and the electrical rules allow for eight boards in a PCI segment. Multiple bus segments are allowed with bridges.
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Curtiss-Wright Defense Solutions
Our VME and mezzanine switches and routers provide systems integrators with a fast and powerful way to interconnect chassis, cards, and processors through switched Gigabit Ethernet links. Operating at wire-speed, these networking modules can be used to architect a network-centric infrastructure for advanced military systems. Both managed and unmanaged versions are available to support air-cooled and rugged conduction-cooled defense and aerospace applications.
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Curtiss-Wright Defense Solutions
Our OpenVPX switches and routers, some with SOSA-aligned options, provide systems integrators with a fast and powerful way to interconnect chassis, cards, and processors through switched Gigabit, 10 Gigabit, and 40 Gigabit Ethernet interfaces. Operating at wire-speed, these Ethernet switching and routing modules can be used to architect the network-centric infrastructure for backplane and twisted-pair networks within advanced military systems.
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Averna
Smart, swappable fixtures and flexible test bedsMulti-site setups, including multi-threadingLong-wire, short wire, and wirelessBed-of-nails for in-circuit testing (ICT)RF, high-speed digital, and thermal designsSolidWorks design expertise and global manufacturing (e.g., US, Mexico, China)Multiple options for mass interconnects (VPC, MAC Panel) and harnessesBuilt-in self-test (BIST) fixtures and calibration tools
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Cytec Corp.
Cytec manufactures passive and programmable patch panels for Automated Test, Data Acquisition and communications. The passive patch panels simply allow you to convert between connector types for rack mount wiring and interconnect issues. The programmable patch panels allow you to reconfigure wiring from a computer using Ethernet LAN, GPIB, RS232, USB or other communication protocols.
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Teledyne Defense Electronics Storm Microwave
Storm Products has been producing high performance semi-rigid interconnects for over 20 years for a variety of markets, including: defense, telecom, wireless and test & measurement. Experienced in:- Cable sizes from 0.034" to 0.500"- Solid PTFE dielectric and high performance tape wrapped products- Wide variety of standard connector styles: MCX, SMA, SMB, SMC, TNC, N, 7/16, SC, and HN- Years of experience on blindmate connector styles: OSP GPO, GPPO, and GMSSpecialized experience in:- Applications where phase stability is critical- low intermod interconnects- High power designsManufacturing equipment:- Automated bending equipment and optical comparators - Programmable thermal chambers for pre-conditioning formed cables- Specialized assembly and soldering equipment for high volume applications- Automated network analyzers through 50GhzDue to the custom nature of formed semi-rigid cable assemblies, additional information is required before providing a quotation for your requirement.
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Teledyne Labtech
Teledyne Labtech prides itself in being at the forefront of RF/Microwave PCB development. Teledyne Labtech were also one of the first companies to successfully develop techniques for embedding SMD resistors and capacitors within multilayer structures and the embedding of connector pins in buried stripline circuits.The advantages of such a structures ensures a much higher density of interconnect. This then removes the need for via-hole connections to the board surface or the need to create access pockets to the inner layers. Consequently you finish with a board with that exhibits much lower RF/Microwave losses. This is particularly important when designing large RF feed networks or 16:1 power dividers.
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Nexus Technology, Inc.
Accessories primarily enable the connection between an industry standard logic analyzer footprint (D-Max, Mictor, P6860, etc) and an instrument probe. For example, a connection between a D-Max footprint and the digital channels of an MSO (Mixes Signal Oscilloscope). They can also enable the interconnect of a probe to a different industry standard footprint. Adding flying leads to a probe designed for a mictor footprint and a probe tester are also some of the accessories that are available.
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Teledyne LeCroy
NVM Express is a scalable host controller interface designed to address the needs of Enterprise, Data Center and Client systems for supporting chip-to-chip, board-to-board, adapter and distance solutions. The protocol can efficiently use interconnect and fabric technologies such as PCI Express, Ethernet and Fibre Channel. Teledyne LeCroy provides protocol analysis, emulation, exerciser and other test equipment to service all NVMe storage applications.
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xUTS -
Bloomy Controls, Inc.
Extend test to encompass copious test points and DUT varieties along with real-time, hardware-in-the-loop and other state-of-the-art instrumentation. extendedUTS (xUTS) is a custom product for high complexity functional test. Configured for the unique needs of a class of devices under test (DUTs), the xUTS employs our universal test system approach that combines the best open platform instrumentation and software along with mass interconnect technology.
