Showing results: 256 - 270 of 274 items found.
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5900 SERIES -
Probe Master Inc.
Probe Master's new 5900 series passive oscilloscope probes are available in 400 MHz & 500 MHz bandwidths. Probes are also available with readout actuators for oscilloscopes with the readout feature. The "GOLD PROBE" has been designed specifically for use with Tektronix, Hewlett Packard and other high performance oscilloscopes. This new slim design along with a host of versatile accessories, allows you to reach the most difficult test point in today's highly complex circuitry. The gold plated Probe Tips, Sprung Hook, Ground Lead, Alligator Tip and other critical interconnect points within the Gold Probe, provide excellent contacts for probing low level analog signals and high speed digital data. Unlike most "off shore" commodity probes, Probe Master guarantees quality and continuing domestic support for our "Made in America" Gold Probe.The probe body is made of high impact ABS. Soft molded strain reliefs at all stress points assure long cable life. In short it has been designed to offer you high performance coupled with high quality.
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CA9806 -
UC Instruments, Corp.
The UC INSTRUEMNTS CA9806 is a high performance, flexible four channel Pulse Pattern Generator and Error Detector that can operate from 1.0 to 17.0 Gb/s (consult factory for higher or lower operation speeds). It is also a standalone Bit Error Rate test solution that incorporates an internal full rate clock synthesizer. Its small size allows it to be placed close to the device under test, it can also be placed further away using the TX driver pre and post emphasis controls features to compensate for cable and interconnect losses. It also has a non destructive, integrated eye outline capture feature along with a quick eye height and width measurement capability. Build‐in 8.5 ~ 15 Gb/s eye diagram testing function.
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A8a -
atg Luther & Maelzer
The A8a test system provides the flexibility of flying probe testers while delivering high throughput testing for bare board printed circuit boards (PCBs). The target market for the A8a is the electrical test of tablet and PC motherboards and high density interconnect (HDI) products for smart phones. The A8a is designed for high productivity, reliability and test accuracy. To achieve high throughput the key feature of the A8a is a new dual shuttle system, which reduces the product exchange time to zero seconds in automation mode. In combination with the fast test speed of up to 140 measurements/second the A8a will give customers a competitive test solution for batches up to 5000 boards. A typical cycle time of a 4-up smart phone board is about 2 minutes.
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CRMS -
Ultra-Tech Enterprises, Inc.,
The CRMS is a system designed to allow any user to measure the resistance of each set of relay contacts associated with the relay under test. The test system consists of a CONTACT RESISTANCE MEASUREMENT UNIT (CRMU), a MULTIPLE RELAY TEST RACK, as well as an interconnect CABLE ASSEMBLY. Either DC or AC energy to pick and drop relay coils under test for all contact measurements is supplied from the CRMU and easily interfaces with the Multiple Relay Test Rack. For additional and more thorough testing of relays an external relay tester can be interfaced to the Multiple Relay Test Rack to supply energy to the relay coil. It is recommended that the UTE Relay Tester With Timer/Counter (UTE Product # 15967-00) be utilized so the operator can take full advantage of the unique features it offers
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Macom Technology Solutions Holdings Inc.
IEEE 802.1AE Media Access Control Security (MACsec) is an industry standard security technology that provides secure communication for Ethernet traffic. MACOM’s wire-speed Ethernet MACsec PHY products offer highly scalable and cost-effective encryption solutions to address the data security issues in wireless, carrier, data center and cloud networks. Combining MACOM’s strength in high speed, high performance mixed-signal I/O and industry leading CMOS silicon technology, MACOM’s MACsec PHY products provide line-rate encryption and authentication at a very low power-footprint that enables encryption at wire-speed on every port. They are ideal for adoption on switch/router line cards, data center interconnect (DCI) transponder and wireless xHaul aggregation systems to provide security function in addition to the connectivity to optical and copper modules.
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Model 2180 -
Magnetic Instrumentation Inc.
The unit is compact and lightweight. The basic system is 7″ wide by 2.5″ high and 12″ long. When measurements are needed below approximately 100 micro-ohm-centimeters, the basic system is piggybacked onto a second enclosure that houses a power amplifier with a current gain of ten. The combined unit measures 7″ wide by 5″ high and 12″ long. The combined unit weighs 11.5 pounds. Two short cables interconnect the two enclosures for powering the power amplifier and routing the signals to the fixture or four point probe. The front panel of the basic system includes a 32-character backlit LCD display and a set of function keys. An easy-to-use menu will allow access to user defined parameters such as sample thickness, sample volume, and calibration constants; upper and lower alarm limits, relative measurements, and several others.
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EV Group
ith over 15 years experience in designing and manufacturing precision wafer bonding equipment, EVG wafer bonding systems are well recognized in setting industry standards for the MEMS production industry. Besides supporting wafer level and advanced packaging, 3D interconnects and MEMS fabrication, the EVG500 series wafer bonding systems can be configured for R&D, pilot-line or volume production. They accommodate the most demanding applications by bonding under high vacuum, precisely controlled fine vacuum, temperature or high pressure conditions. Multiple bonding methods including anodic, thermo compression, glass-frit, epoxy, UV and fusion bonding are covered. Based on a unique modular bond chamber design the EVG500 series allow for an easy technology transfer from R&D to high volume production.
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8494G -
Keysight Technologies
The Keysight 8494G dc to 4 GHz programmable step attenuator offers exceptional repeatability and reliability. Attenuation is provided in 1 dB steps from 0 to 11 dB. Precision gold-plated leaf springs ensure long-life (over 5 million cycles) and very high attenuator repeatability (typically 0.01 dB). To improve measurement accuracy, NIST traceable data (SWR and attenuation) is available as Option UK6. A maximum switching time of 20 ms (including contact settling) speeds automatic testing. Custom step attenuator/switch combinations are possible. The Keysight 11716A/B/C interconnect kits provide quick connection of Keysight 8494/5/6/7 1 dB and 10 dB step attenuators in series for greater dynamic range with 1 dB steps.
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784663-01 -
NI
1- or 2-Port, USB LIN Interface Device—The USB‑8506 is a Local Interconnect Network (LIN) interface for developing applications with the NI‑XNET driver. The USB‑8506 is powered over the USB bus and does not require external power. The USB‑8506 excels in applications requiring logging or manipulation of hundreds of LIN frames and signals, such as in-vehicle data logging, bus monitoring, automation control, and more. The NI‑XNET device-driven DMA engine enables the onboard processor to move LIN frames and signals between the interface and the user program without CPU interrupts, minimize message latency, and free host processor time. The USB‑8506 is available with a three‑pin COMBICON synchronization connector for triggering and synchronizing the internal hardware timebase with other devices.
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784664-01 -
NI
1- or 2-Port, USB LIN Interface Device—The USB‑8506 is a Local Interconnect Network (LIN) interface for developing applications with the NI‑XNET driver. The USB‑8506 is powered over the USB bus and does not require external power. The USB‑8506 excels in applications requiring logging or manipulation of hundreds of LIN frames and signals, such as in-vehicle data logging, bus monitoring, automation control, and more. The NI‑XNET device-driven DMA engine enables the onboard processor to move LIN frames and signals between the interface and the user program without CPU interrupts, minimize message latency, and free host processor time. The USB‑8506 is available with a three‑pin COMBICON synchronization connector for triggering and synchronizing the internal hardware timebase with other devices.
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Analog Devices Inc.
The Analog Devices family of I2C solutions support hot swappable, 2-wire bidirectional bus buffers to allow I/O card insertion into a live backplane without corruption of the data and clock busses. Additional supported 2-wire buses include SMBus, PMBus, the ATCA intelligent platform management bus (IPMB), and the HDMI DDC bus. I2C/SMBus Accelerators improve bus transitions to allows multiple device connections or a longer, more capacitive interconnect, without compromising slew rates or bus performance. ADI's software-programmable and pin-selectable I2C multiplexers help resolve I2C address limitations, increase fan-in or fan-out, and integrate bus buffers and rise time accelerators for an all-in-one solution. Resistor configurable I2C address translators can be configured with over 100 unique slave addresses to allow multiple slave devices with the same address to coexist on the same bus.
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Ironwood Electronics
For BGA, QFN, or LGA applications, GTP contact technology provides >94 GHz signal speed and can additionally be used in high cycle life applications such as ATE. These sockets support pitches from 0.2 mm to 1.27 mm. Ironwood's GT sockets are ideal for prototyping and testing almost any BGA device application. These IC sockets provide excellent signal integrity yet remain cost effective. Innovative elastomer interconnect technology that delivers low signal loss (1dB at 94GHz) and supports BGA packages with pitches down to 0.2mm was utilized in these sockets. GT BGA sockets are mechanically mounted over a target system's BGA lands using mounting and alignment holes at proper locations (page 2 of the individual socket drawing shows recommended PCB layout information). These low-profile sockets are only 2.5 mm per side larger than actual IC packages (industry's smallest footprint).
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PRO RACK ATE -
Qmax Test Technologies Pvt. Ltd.
Pro-Rack is a cost effective ATE System, which comes with Modular Structure provision option to improvise and enhance much instrumentation based on the user’s requirements. Basically it is designed to cater to the needs of PCB test and repair depots, keeping in mind the changing PCB technology and the challenges in testing them off-line. It can provide complete PCB test and diagnostic functions for any kind of PCB including the latest very high density complex PCBs with high pin count PQFP, FPGA VLSI chips. AC /DC parametric tests enables testing of the DC parametric of device pins on the edge connector for input bias current, Fan out capacity ,Tri-state leakage currents, AC parametric measurements such as Input / Output Propagation delay Rise time / Fall time to further enhance fault coverage. Pro-Rack is designed with VPC Mass Interconnect adapter with 16 bit fixture ID interface to the UUT through simple clips and probes or through card edge or through a bed of nail test fixture.
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FTB-4 Pro -
EXFO Inc.
The FTB-4 Pro is the latest addition to EXFO’s test orchestration portfolio which transforms business as usual into smarter, scalable network testing that significantly increases operational efficiency and provides vital insights into field operations, network performance and service delivery. The 4 slot modular FTB-4 Pro platform enables a unique combination for 100G commissioning, turn-up and troubleshooting which includes the FTBx-88200NGE 100G Multiservice tester (with iOptics transceiver validation software) and the FTB-5240S-P optical spectrum analyzer. There is no need to carry additional platforms or swap modules for unmatched transport and spectral testing on a single platform that no one in the industry can offer. The versatile FTB-4 Pro platform supports a wide range of modules for field testing, data center interconnect, submarine testing, and lab applications for maximum flexibility and ROI across all phases of the service delivery chain: development, deployment, maintenance and troubleshooting. Module combinations on the FTB-4 Pro can also include iOLM/OTDRs, market leading OLTS for fiber characterization, dispersion solutions and other transport modules all with compatibility with EXFO’s market leading fiber inspection probes.
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Ironwood Electronics
Ironwood’s GHz BGA & QFN/MLF sockets are ideal for prototyping and testing almost any BGA or QFN device application. These ZIF sockets provide excellent signal integrity yet remain cost effective. Innovative elastomer interconnect technology that delivers low signal loss up to >40GHz and supports BGA or QFN/MLF pitches down to 0.3mm was utilized in these sockets. GHz BGA sockets are mechanically mounted over a target system’s BGA lands using mounting and alignment holes at proper locations (page 2 of the individual socket drawing shows recommended PCB layout information). These low-profile sockets are only 2.5 mm per side larger than actual IC packages (industry’s smallest footprint). They support IC devices with body sizes ranging from 55mm down to 1mm. Larger body sizes may require a backing plate. If the backside of the target PCB contains capacitors and resistors, a custom insulation plate with cavities cut for those components can be designed. This insulation plate sandwiches between the backing plate and target PCB.
