Showing results: 271 - 274 of 274 items found.
-
SUB-20 -
Dimax
SUB-20 is a versatile and efficient bridge device providing simple interconnect between PC (USB host) and different HW devices and systems via popular interfaces such as I2C, SPI, MDIO, RS232, RS485, SMBus, ModBus, IR and others. It is also a full "any to any" converter between all supported interfaces and I/O features. SUB-20 is a powerful I/O controller with 32 GPIO, 8 Analog Inputs, PWM Outputs, Edge DEtectors, LCD, Leds and push buttons.SUB-20 system includes SW package containing driver, API Library, GUI and Command Line based applications, C,C++,C#,VB.net, MATLAB, LabView sample code and documentation. SUB-20 can be used with PC 64/32 bit running Windows 2000/XP/Vista/Win7/Win8, MacOS, Unix/Linux and DOS.Working with SUB-20 does not require deep knowledge of low layers of the specific interface. All you need to do is to call right API function at the right place. And this is really very easy as API functions are well documented and "exampled". API set is relatively small but comprehensive.SUB-20 is equipped with status Leds, optional LCD and buttons. All this guarantee fast and comfortable development, field debugging and maintenance of applications including option of standalone operation.
-
Pasternack Enterprises, Inc.
Pasternack SMP connector (sub-miniature push-on connectors) category contains mostly RoHS and REACH compliant product varieties. The SMP connector category includes dozens of configurations including coaxial sub-miniature push-on connectors, PCB mounted, non-sealed and hermetically sealed terminals and shrouds. Our subminiature push-on SMP connectors are built to precise microwave and RF industry specifications and are part of over 40,000 in-stock RF products. Connectors in SMP series from Pasternack are manufactured in male or female gender with a 50 Ohm impedance. Pasternack's SMP subminiature connector are available in straight or right angle versions as well as bulkhead or mount-less options. These connector designs include solder or solder/solder attachment methods. Pasternack’s SMP connectors are miniaturized push-on interconnects commonly used in high density, blind-mate systems that can operate up to 40 GHz. Standard sub-miniature push on connector items are offered in a high frequency 40 GHz version as well as a low frequency 8 GHz version and are also available in smooth bore, limited detent and full detent styles. As with the other over 40,000 RF, microwave and millimeter wave products from Pasternack, this SMP connector series is in-stock. Not just in stock, these subminiature push on connectors will also ship the same day as they are purchased.
-
MIC-6030 -
Advantech Co. Ltd.
The MIC-6030 is a ruggedized single-slot 3U OpenVPX switch providing high-speed, low-latency interconnects between VPX blades connected to PCI Express and Ethernet backplane fabrics. An ExpressLane™ PEX8733 PCIe Gen3 switch connects to six PCIe Gen3 x4 ports enabling non-transparent and transparent bridging of processor blades for highly flexible multi-host and legacy configurations. A Marvell® Link Street® 88E6390X Ethernet layer 2 switch with VLAN support switches gigabit Ethernet traffic between VPX blades connected to the Ethernet fabric enabling a linerate control plane. When configured with optional Mellanox ConnectX®-4 Multi-Host™ Technology and drivers, the MIC-6030 enables high speed communication of up to 10Gbps bandwidth between up to 4 processor VPX blades VPX by transforming the PCIe bus into a programmable network interface, facilitating the development of data communication between boards and eliminating the need to program a more complex DMA interface. The onboard BMC firmware based on Advantech’s IPMI core technology brings an advanced set of system management features and can be customized when unique features are required. Lightweight switch management is available via the BMC, supporting tagged and untagged VLANs, port-based VLAN, and port status reporting. Advantech offers standard designs with either convection or conduction-cooling. A conduction-cooled heatsink ensures operation in harsher environments, providing a reliable solution for operation in extended temperatures, and where extreme shock and vibration requirements must be met. The MIC-6030 is compact, light and robust, meeting stringent size, weight, and power (SWAP) demands.
-
MIC-6311 -
Advantech Co. Ltd.
Advantech’s MIC-6311 is a single processor VPX blade based on the 4th generation Intel® Core™ i3/i5/i7 platform. It enables the highest performance available in 6U VPX form factor with two SRIOx4 ports in the VPX data plane and two PCI Express x8 gen. 3 lanes in the VPX expansion plane for workstation and compute intense applications. The two Serial RapidIO ports offer the possibility to interface the MIC-6311 to digital front ends such as DSP and FPGA cards via a high speed, low latency deterministic interconnect. In addition, PCI Express ports with up to 8GB/s throughput offer a high performance interface to mainstream peripherals and IO cards. With a SO-DIMM socket and additional soldered, onboard DRAM with ECC in a dual channel design running up to 1600MT/s, the MIC-6311 offers the ability to fit harsh environments while maintaining maximum memory throughput and supporting memory expansion using the latest SO DIMM technology. Moreover, the 4th generation Intel® Core™ processors offer increased cache size and efficiency as well as instruction set improvements which make the MIC-6311 a high performance compute engine with outstanding floating point and vector processing performance. Tailored for rugged environments, MIC-6311 has been designed to support ruggedized convection cooled heat sinks. Additionally, it implements an onboard soldered, industrial SSD for maximum reliability. By using the latest powerful PCH (Lynx Point) from Intel®, with its advanced SATA controller advanced storage options are supported such as a 2.5" SATA III HDD/SSD socket offering high storage capacity with up to 6Gbps transfer speed. A CFast socket provides an alternative for implementing a cost efficient, pluggable SSD. An onboard XMC/PMC site with PCIe x8 gen.3 connectivity can host high speed offload or I/O mezzanines. Two USB 3.0 ports in front panel can connect to the external devices with up to 5Gbps data rate. Network and remote connectivity can be achieved via a RS232 console (RJ45) and two GbE RJ45 ports, powered by Intel®’s latest Gigabit Ethernet Controiller, the i350. The processor’s integrated enhanced graphics engine Iris offers up to 2x the graphic performance compared to previous generation solutions. Triple independent display support can be implemented by using the MIC-6311’s VGA front panel port and two Display port / HDMI interfaces on rear transition modules. Audio port support via the backplane interface enhances media support. Three SATA ports (SATAIII) and four USB ports (2x USB 3.0, 2x USB 3.0) are also connected to backplane to fulfill the demand for extra IO ports or storage. Two GbE/ SERDES ports support system level IP connectivity and two UART interfaces can be leveraged to interface to legacy devices and consoles.
