3D Solder Paste Inspection
checks form, height, surface area, bridges, volume, x/y offset and coplanarity of solder. Also known as: 3D SPI
See Also: Solder Paste Inspection, 3D SPI
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3D Cameras
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Imaging Development Systems GmbH
3D Machine Vision is considered to be the future of Robot Vision. The integration of 3D data makes it possible to precisely capture and interpret the environment, enabling tasks in robot technology to be solved more efficiently. This applies both to demanding assembly processes, such as gluing or welding, and to the notoriously tricky process of "bin picking". With the Ensenso 3D cameras and the Nion ToF camera, IDS offers powerful camera systems for 3D imaging – with a focus on precision, cost-effectiveness and easy integration.
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Soldering station
SM-850 with Hot Air
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*Place of Origin: Guangdong, China (Mainland)*Brand Name: MCH*Model Number: SM-850*CONDITION: BRAND NEW
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3D AOI
Zenith2
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Zenith 2 AOI platform, which provides the AI-driven Auto Programming for rapid job programming. The Zenith 2 also combines Koh Young’s advanced vision algorithms with innovative high-resolution optics. The latest platform expands inspection capabilities, delivering best-in-class performance, functionality, and accessibility. Koh Young’s side-view solution allows Zenith 2 to quickly detect and analyze defects on a wide range of mounted components and chips.
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3D Automated Optical Inspection Systems (3D-AOI)
3Di Series
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Saki’s 3Di Series applies cutting edge technologies to improve production efficiency and enhance production quality across the entire assembly line.
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Inspection System
CIX100
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The OLYMPUS CIX100 inspection system is a dedicated, turnkey solution for manufactures who maintain the highest quality standards for the cleanliness of manufactured components. Quickly acquire, process, and document technical cleanliness inspection data to comply with company and international standards. The system’s intuitive software guides users through each step of the process so even novice operators can acquire cleanliness data quickly and easily.
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Field Inspections
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MISTRAS Group has evolved into an asset protection industry leader on the backbone of our expansive non-destructive testing (NDT) and field-testing portfolio.
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High-speed 3D Solder Inspection Machine
YSi-SP
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a high-speed 3D solder paste inspection machine that enables high-speed high-accuracy inspections based on our “1-head solution” concept for using a single type of head to handle various inspections. It is used to inspect the printing quality (volume, height, area, misalignment) of solder paste after it has been printed onto PCBs. Available April '18.
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3D Optical Profiler
Nexview™ NX2
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Designed for the most demanding applications, the Nexview™ NX2 3D optical profiler combines exceptional precision, advanced algorithms, application flexibility, and automation into a single package that represents ZYGO's most advanced Coherence Scanning Interferometric (CSI) profiler.
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Inspection and Maintenance
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Sensors' EMISSIONS INSPECTION ANALYZERS have a long-standing history for exceeding international standards with compact, portable, and cost-effective systems.
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3D CT AXI
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PCB manufacturers can enjoy comprehensive, high-speed inspection with Omron’s revolutionary technology that reliably captures defects in hidden areas.
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3D Software
Geomagic Control X
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Combined with the powerful and highly precise Artec 3D scanners, Geomagic Control X is a fantastic solution for anyone looking for speed, accuracy and a large variety of tools to choose from. Easily get the data required for extensive quality control in no time at all with Artec’s advanced 3D scanning solutions. Acquire precise measurements and carry out inspection and data analysis on the spot, using Geomagic Control X and an Artec 3D handheld scanner. Compare 3D scans to the reference CAD model to minimise assembly flaws and increase productivity.
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Battery Inspection
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We design, develop and manufacture X-ray solutions specifically for battery cells. At Exacom we stand for passion, innovation, out of the box thinking, honesty and reliability, as well as speed and a hands on mentality.
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3D Flexible Scanner
HDI Advance
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The HDI Advance 3D scanner offers the flexibility of scanning objects of different shapes and sizes. Simply move the camera positions to change the scanner’s field of view (FOV). The 3D scanner comes with three preset camera slots to quickly modify the field of view from 165mm up to 600mm, depending on the scanner model.
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HDI 3D Scanners
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Quickly capture high resolution digital 3D scansaccurately from objects in the physical world. The High Definition Imaging (HDI) 3D scanners use structured-light technology for capturing high-resolution digital 3D scans from real world objects. These systems are great for companies, manufacturers, academic institutions, visual effect studios, and research labs that need 3D scan data for visualization and measurement applications including: 3D modeling, documentation/archiving, reverse engineering, scientific measurement, computer-aided inspection, rapid prototyping/3D printing.
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Inspection Microscope/Video
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Connector end face contamination is a big problem with fiber optic cables and patch cords and it causes network issues. If you are a professional technician, you need a quality optical microscope. The magnification of connector end faces will allow you to discover any quality problems such as scratches. You need to make sure you have a clean connection with no dirt and debris. Visual inspection is fast, easy and simple. Using this test equipment can help avoid problems.
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3D Scanner Software
3DX Engine
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*Easy step-by-step user interface, low learning curve, suitable even for first time users*Recovery mode always protects all your scan project and data from computer crash and power outage.*Texture Scanning (OBJ format)
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3D Printer Laboratory
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Trialon’s commitment to providing 3D printing services is second to none. Our facility is equipped with state-of-the-art 3D printers that create accurate plastic prototype and end user parts.
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Solder Cup Connector Kit
Y1141A
D-Sub Male Connector
Used to build custom cables for 34951, 34952 – 50-pin Dsub male – 125 V.
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3D Optical Profilers
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Bruker is the industry-leading provider of 3D surface measurement and inspection solutions, offering systems for fast, reliable, and easy-to-use non-contact analyses with best-in-class accuracy on samples ranging in size from microscopic MEMS to entire engine blocks. They provide researchers and engineers in R&D, manufacturing, and quality control the industry-leading sensitivity and stability necessary for precision 3D surface measurements in applications and environments that are challenging for other metrology systems.
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Inspection Kits
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Elcometer offers one of the widest ranges of inspection equipment available. Our products are used across numerous industry sectors. In all cases, there is always a need to undertake a number of specific inspections during quality control assessments - as one parameter can affect another.
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GENERAL INSPECTION MACHINE AFTER SOLDER MASK
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DVI is a technology of automated optical inspection, which can inspect deep to the difference from semi-transparent layers or semi-reflective layers.
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Bond Inspection
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Increasingly thin wires, finer pitches, as well as more applications of thick wire for higher capacities are among the current trends in wire bonding. At the same time, the requirements for robust and defect-free bonds are increasing, for example in assistance systems in the automotive sector and in RF modules in the 5G mobile communications network. This makes reliable inspections extremely important.
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3D X-ray hybrid inspection system
YSi-X
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Ideal for 100% inspection of onboard automotive products and many other items by 3D X-rays acquire layered of target. X-ray, optical, infrared, and laser height measurement as standard equipment; hybrid and high reliability with multiple inspection modes.
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High-Resolution 3D Seismic Solution
PIKSEL
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PIKSEL is an integrated and compact solution that enables high-resolution seismic data acquisition in targeted areas for offshore construction and field development.
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Optical BGA Inspection
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Imaging hidden solder joints of BGA, IBGA, FlipChip, CSP, CGA and SMD components
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Wafer Sorter and Inspection
SolarWIS Platform
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Eliminating the opportunity for problematic wafers to enter cell manufacturing lines greatly improves output and yield. ASM AE’s wafer sorter features 3D area inspection capability to inspect wafer thickness, total thickness variation (TTV), saw marks, as well as wafer bow and warpage. SolarWIS also includes modules that can inspect for stain, geometry, micro-cracks, edge chips, resistivity, P or N conductivity and lifetime.
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High-speed In-Line 3D CT Inspection System
X-eye 6300
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Automatically inspects the defects of products in customer's line with high-speed 3D CT tomography.Able to inspect every defects of Double-sided PCBA & BGA mounted components precisely by solving overlapped X-ray image issue.Inspection speed of 3 sec/1FOV from loading to automatic Good/NG judgement.
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Product
3D Compliance SAR System
cSAR3D
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Schmid & Partner Engineering AG
cSAR3D is our newest and most advanced system for fast, high-precision SAR measurements of wireless devices. We have realized a system concept that has been developed over the last years to meet the demands of our highly valued customers. The system uses a novel sensor concept and advanced reconstruction algorithms. The measurement system has high absolute accuracy due to the determination of all field components in a large region of the head and body phantoms.
