3D Solder Paste Inspection
checks form, height, surface area, bridges, volume, x/y offset and coplanarity of solder. Also known as: 3D SPI
See Also: Solder Paste Inspection, 3D SPI
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3D Video Microscope
BVM-20102B
High-resolution CCD sensor, built-in analog/digital converter, analog and digital signal directly display on the screen, can also simultaneously display on TV and computer through corresponding interfaces; taking photo and video through software; easy operation, reducing user's fatigue and injury.
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3D Imaging Sensor
The GS 3D sensors, can be used in applications such as bin picking, robotic manipulation, sorting products, mold clearance checking, and space monitoring and object recognition. In addition, the 3D technology will aid in determining spatial positions and measurements.The GS 3D images larger objects at longer distances and does so in milliseconds without the cycle time and motion required by scanning-based methods.
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Can Inspection
Whether they are 14oz cans, 28oz cans, 12oz bottles, or some other size or format – they typically all look fine, as they fly by on your production line or sit on pallets ready to go out to customers. The challenge is, most companies have some kind of sealing issue at some point. Tops go on crooked, lids don’t seal, vacuums don’t set right – and it’s nearly impossible to tell by physical or visual inspection.
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3D Laser Imager
Vector-DD
The Vector 3D laser imager offers multi wavelength, full waveform data capture, coupled with the flexibility of an all-sky scanner. The Vector-DD is a direct detection (DD) 3D (range, angle, angle) active imager with an all-sky full hemisphere scanner. It employs a nodal point design so that all the lines-of-sight converge to a single point at the instrument*. In addition, two wavelengths can be transmitted so that differential reflectivity information can be derived. The unit is compact and portable and operates from 24V DC.
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Solder Past Inspection
From the innovative Z-Check 3D through to the entry level Z-Check 100 the entire range has been designed to provide accurate pad specific measurement of solder paste deposits, adhesives and component placement. Amongst its other features the Z check software comes with the convenience of a full SPC package as standard.
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Non-contact 3D Optical Profilers
LuphoScan platforms are interferometric, scanning metrology systems. They are designed to perform ultra precision non-contact 3D form measurements mainly of rotationally symmetric surfaces such as aspheric lenses.
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Chip Inspection System
GEN3000T
GEN3000T is an inspection system that performs automatic inspection of individual semiconductor chips.This revolutionary chip surface inspection system was achieved by combining the chip handling technology cultivated by Toray with the inspection algorithm used in the "INSPECTRA®" wafer defect inspection system.
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Wafer & Die Inspection
SemiProbe wafer inspection system (WIS) examines, locates and identifies defects created during wafer manufacturing, probing, bumping, dicing or general handling. This provides microelectronic device manufacturers with accurate, timely quality assurance and process information. The WIS has single sided and double sided wafer mapping capabilities and can improve efficiency, reduce manufacturing costs, increase yields and shorten time to market.
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Digital Inspection Kits
Ideal for ‘paperless’ quality assurance systems the kits come complete with ElcoMaster® Data Management Software for professional reporting and analysis.
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Affordable 3D Scanner
Metron E
Professional desktop 3D scanner for generating digital 3D models from physical objects at an affordable price. Metron E 3D scanner is the perfect solution if you are looking for a practical desktop 3D scanner. It’s effective at getting the job done to make you more productive.
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3D Sensors
*Up to 38500 distance values per measurement for a detailed assessment of the application*Configurable outputs*Visual assessment of distance, level or volume*Predefined function blocks*Time-of-flight measurement principle
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High-Resolution 3D Seismic Solution
PIKSEL
PIKSEL is an integrated and compact solution that enables high-resolution seismic data acquisition in targeted areas for offshore construction and field development.
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Wafer Sorter and Inspection
SolarWIS Platform
Eliminating the opportunity for problematic wafers to enter cell manufacturing lines greatly improves output and yield. ASM AE’s wafer sorter features 3D area inspection capability to inspect wafer thickness, total thickness variation (TTV), saw marks, as well as wafer bow and warpage. SolarWIS also includes modules that can inspect for stain, geometry, micro-cracks, edge chips, resistivity, P or N conductivity and lifetime.
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X-Ray Inspection System
TruView™ Cube
The Perfect Solution for a Powerful Small Form Factor X-ray Inspection System. The all new TruView™ Cube X-Ray Inspection System is a fully motorized radiography system developed to meet the stringent requirements of electronics assembly and component inspection. Ideal for applications where space is premium, the the TruView™ Cube X-Ray sits comfortably on your laboratory bench.
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Thickness and Flaw Inspection
OmniScan SX
Olympus is proud to introduce the OmniScan® SX, a flaw detector that benefits from more than 20 years of phased array experience and shares the OmniScan DNA. For improved ease of use, the OmniScan SX features a new streamlined software interface displayed on an 8.4 in. (21.3 cm) touch screen. A single-group and non-modular instrument, the OmniScan SX is easy to operate and cost-effective for less demanding applications.
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Drone Inspection Software
Qii.AI
Qii.AI automates the detection and analysis of defects. It is the only enterprise AI platform that combines drone inspection software with an AI labeling tool, AI-assisted computer vision, and machine learning.
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Value Inspection Cameras
General's Value Inspection Cameras offer excellent savings on certain Inspection Cameras such as the DCS280 Rugged Video Inspection System & the KT280 Professional Inspection Kit. Take a look & see if one will meet your needs.
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Optical Inspection Machine
3D AOI
3D AOI latest optical inspection machine 1. No part dead angle, 4-way projection, complete measurement 2. Part height measurement, accurate measurement of defects 3. Multi-piece inspection without additional program 4. DLP digital projection, program editable height measurement
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Vision Inspection Systems
We have available with us diverse array of Vision System. These systems are based on high-end technologies and meet the requirements of diverse sectors. Further, our systems are an epitome of quality and available at economical prices. Details of different systems.
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Vision Inspection System
Vision Station
Design and manufacture vision inspection system for SOT, SOD, TO, DPAK, SOIC, TSOP, SSOP, QFN/MLP, ODFN and LED inspection.
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Inspection scope
KI-TK1012
Inspection scope & cleaning materials. Interchangeable MPO SC LC connectors
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Biofuels Testing and Inspection
Intertek delivers assurance, testing, inspection and certification services to refiners, producers, blenders, distributors, consumers and research institutes across the world.
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Desktop 3D AOI Series
MV-3 OMNI
- Exclusive 15MP / 25MP CoaXPress Camera System- OMNI-VISION® 3D Digital Tri-Frequency Moiré Technology- Leading-Edge 12 Projection Blue DLP Technology- Precision Compound Telecentric Camera Lens- Eight Phase Color Lighting System- 10MP / 18MP SIDE-VIEWER® Camera System- Programmable Z-Axis Multi-Focus System- INTELLI-PRO® Automatic Programming Software- Multi-Functional AOI-SPI Fusion Technology- INTELLISYS® Industry 4.0 Intelligent Factory Automation System
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Inspection Systems
Video Inspection Systems with?or without measurement capabilities are an excellent way to evaluate and test small items or items in?difficult to access locations. Many options are available in addition to the measurement capability. Video Inspection is used for a variety of purposes including the ability to see? and measure items that are much smaller than the eye can see or that hand tools can measure. Video systems can also reduce the eye and/or back strain associated with production environments where an operator must look in a microscope all day.
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Defect Inspection and Review
KLA’s defect inspection and review systems cover the full range of yield applications within the chip and wafer manufacturing environments, including incoming process tool qualification, wafer qualification, research and development, and tool, process and line monitoring. Patterned and unpatterned wafer defect inspection and review systems find, identify and classify particles and pattern defects on the front surface, back surface and edge of the wafer. This information allows engineers to detect, resolve and monitor critical yield excursions, resulting in faster yield ramp and higher production yield.
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WiFi Inspection Cameras
WiFi Inspection Cameras generates a local WiFi hotspot (without Internet access) through which video clips and still photos of hard-to-reach or hard-to-see areas or equipment captured by the probe camera can be sent to an app-enabled smartphone or tablet for viewing and sharing. Free apps for iOS devices (iPhones or iPads) and Android devices are available from the iTunes App Store and Google Play Store, respectively. The three WiFi cameras differ in probe length, camera lighting and grip style.
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Waterproof Inspection Cameras
waterproof inspection cameras have waterproof probes, General's DCS6XX wet/dry cameras, the DCS600A, DCS605, DCS660A, DCS665 & the DCS665-ART, go one step further because their grips and monitors are also waterproof. This feature, unique in the industry, allows users to inspect toilets and water and sewer lines carrying running water without worrying about dropping and "dunking" the instrument.
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9-Pin D-Type Male, Solder Bucket, HV
92-960-009-M-HV
9-Pin Male D-Type Connector, High Voltage, Solder Bucket - Without Backshell
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Package Inspection Products
Image quality. Speed. Uptime. They’re all crucial. Getting all three at the same time in a nondestructive testing (NDT) solution for package inspection is the challenge. It takes continuous innovation, advancing the state of the art to keep pace with the semiconductor industry’s own exponential progress.
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3D Multibeam Scanning Sonar
ProScan™
Teledyne BlueView's 3D Multibeam Scanning Sonar user interface software. ProScan connects to the sonar and pan/tilt unit, configures each scan, generates full 3D point clouds, and optionally streams output to third party hydrographic software for fusion with other sensors. Data is recorded in multiple file formats: .son (raw acoustic data file for ProScan reprocessing), .txt (plain text record of all point locations and positional data) and .xyzi (industry standard xyzi data for 3D point cloud viewers, registration software, etc.). In playback mode, users can review and reprocess scans to modify sound speed, intensity threshold, multidetect and range settings as needed. ProScan coupled with Teledyne PDS MotionScan, pitch, roll heading and position sensors provides the capability to scan areas to collect 3D point clouds while correcting for motion.
