Solder Paste Inspection
assures volume and area of paste application.
See Also: Solder Paste, Solder Paste Measurement, 3D Solder Paste Inspection
-
Product
3D Solder Paste Inspection system
PI Series
-
PI Series is a new generation 3D Solder Paste Inspection system that overcomes the limitations of traditional SPIs and satisfy all your inspection needs. The PI Series allows to easily implement Solder Paste Inspection in any PCBA line. These new generation systems are very intuitive to use, allowing non-experienced persons to get expected results.
-
Product
High Speed Solder Paste Inspection
VisionPro HSi
-
The VisionPro HSi offers high speed solder paste inspection. Utilizing the most advanced high resolution staging and sensor technologies, the VisionPro HSi provides the accuracy and reliability needed to compliment your overall screen print process improvement strategy.
-
Product
Solder Paste Inspection
3D SPI
-
Checking all the relevant points in the production process is essential, especially in terms of analyzing the causes of defects, fixing them, and – most importantly – preventing them in the future. That’s why solder paste printing is of fundamental importance for manufacturing complex assemblies: If paste printing isn’t performed correctly, the defect can impact the subsequent assembly and the soldering process, resulting in a tilted component or a poor or missing solder joint.
-
Product
Solder Paste Inspection Machine
3D SPI
-
The 6500 series is the measurement equipment provided by Jiezhi Technology for the small pads of solder paste printed on the PCB board. It will cause defects such as sharpness, offset, more tin, and less tin printing during solder paste printing. Causes defects in the later stage of production, this equipment can find problems in advance
-
Product
3D Solder Paste Inspection
aSPIre 3
-
Industry-leading measurement accuracy and inspection reliability- Perfect solution to eliminate shadow problems, base plane settings, and problems with projection direction- Full 3D foreign material inspection solution for the entire PCB- High productivity through the highest accuracy
-
Product
Solder Paste Inspection System
KY8030-3
-
The new KY8030-3 delivers 3x fasterinspection without compromisingperformance and accuracy.Using patented dual projection,the system eliminates the criticalShadow problem that all 3D SPI systemscan be vulnerable to.Additionally, the new KY8030-3 has solvedthe PCB Warp problem that seriouslyimpacts inspection accuracyand reliability of result.
-
Product
3D Inline Solder Paste Inspection System
TROI 7700 SERIES
-
Using Moire' pattern, Pemtron's three-dimensional lead applicationdosage tester combines 2D color images with 3D measurement data toprovide more detailed, near-real PCB images, unlike traditionalcolor maps. We will also provide you with the best solution forhigh-quality and high-precision PCB production with a varietyof statistical programs, along with information you need toquickly and accurately judge positive/failure.
-
Product
3D Solder Paste Inspection Machine (3D-SPI)
3Si Series
-
Saki's 3D SPI identifies critical defects and assists with process improvement.
-
Product
Solder Paste Inspection System
LaserVision SP3D Mini
-
The LaserVision SP3D Mini offers the same level of overall measurement capabilities as the VisionPro SP3D. Utilizing a lower cost microscope platform and the ability for customers to supply their own PC if needed, the SP3D Mini sets the "affordable" boundary on reliable, low cost SPI solutions.
-
Product
3D Solder Paste Inspection (SPI)
TR7007 SII
-
Offering inspection speeds of up to 200 cm2/sec, the TR7007 SII is the fastest solder paste inspection system in the industry. This highly accurate inline shadow-free solder paste inspection solution offers full 3D inspection at resolutions of 15 µm or 10 µm. Built on a high precision linear motor platform, the system's hallmark features include closed loop function, enhanced 2D imaging, auto-warp compensation and fringe pattern technology. Increase capacity without sacrificing additional space with an available dual-lane configuration.
-
Product
3D Solder Paste Inspection (SPI)
-
Systems designed for solder paste inspection (SPI) quickly and reliably check the solder paste deposits on the circuit board.
-
Product
Solder Past Inspection
-
From the innovative Z-Check 3D through to the entry level Z-Check 100 the entire range has been designed to provide accurate pad specific measurement of solder paste deposits, adhesives and component placement. Amongst its other features the Z check software comes with the convenience of a full SPC package as standard.
-
Product
Tool, Inspection Depth Gauge, Micro Coax, ITA
910121180
-
Tool, Inspection Depth Gauge, Micro Coax, ITA.
-
Product
Tool, Inspection Depth Gauge, Mini Coax, Receiver
910121156
-
Used to verify the depth setting of the center conductor of receiver mini coax contacts.
-
Product
Solder Paste Analysis
SPA1000
-
The SPA 1000 also introduces new process control capability by accurately measuring the suitability of the solder paste prior to its implementation on the production line. It achieves this by determining the "Open-Time" for the paste. It also performs the Slump Test and both of these methods provide a "Go/No Go" answer in less than 30 minutes to ensure minimum delay for the production line.
-
Product
Solder Paste Analyser
SPA 1000
-
The SPA 1000 also introduces new process control capability by accurately measuring the suitability of the solder paste prior to its implementation on the production line. It achieves this by determining the "Open-Time" for the paste. It also performs the Slump Test and both of these methods provide a "Go/No Go" answer in less than 30 minutes to ensure minimum delay for the production line.
-
Product
Soldering Inspection Video Microscope
MS-1000
-
The MS-1000 is a highly portable microscope for exclusive use with BGA, CSP, and QFP. It is highly efficient in inspecting portions which cannot be inspected by the X-ray inspection method.Specifically, it is efficient for inspecting the following conditions: fillets of soldered balls, melted condition of soldered parts, cracks, defective soldering, etc.
-
Product
High-speed 3D Solder Inspection Machine
YSi-SP
-
a high-speed 3D solder paste inspection machine that enables high-speed high-accuracy inspections based on our “1-head solution” concept for using a single type of head to handle various inspections. It is used to inspect the printing quality (volume, height, area, misalignment) of solder paste after it has been printed onto PCBs. Available April '18.
-
Product
Solder Paste
MVP Versa (3D SPI)
-
The first part of any SMT process is Paste. MVPs Versa and 900 Series platforms provide high accuracy paste inspection. High accuracy paste measurements are made using a choice of 10um or 5um 3D measurement systems.
-
Product
Tool, Solder Kit, Mini Coax with Solder Sleeve
910121144
-
Used to solder Mini Coax Solder Sleeve contacts.
-
Product
Solder Paste Wetting Tester
SP-2
-
SP-2 is wettability testing machine forsolder paste, parts electrode and PC board,adopted SP-Tension-Method (Temperature Profile Method).
-
Product
Selective Wave Soldering Optical Inspection Machine
-
Landrex Technologies Co., Ltd.
Selective Wave Soldering Optical Inspection Machine
-
Product
Soldering station
SM-850 with Hot Air
-
*Place of Origin: Guangdong, China (Mainland)*Brand Name: MCH*Model Number: SM-850*CONDITION: BRAND NEW
-
Product
Soldering Stations
SM-878AD
-
*Module: 878AD*Display: LED*Power Rating:700W *Air Flow: 120L/Mints*Temperature: 100-450DEGREE*Noisy: <45dB
-
Product
Dimensional Inspection (3D Inspection)
-
The 3D measurement data from our scanners and PCMMs offers a comprehensive definition of a physical object that is used for measurement, inspection, comparison and reporting. When a part is defined by millions of points, you can see subtle deviations, slight variations and fine details, which gives you the confidence that a part (or mold) meets your specifications. To deliver the best of both worlds, we combine 3D scanning with our contact, touch-probe measurement tools to deliver precise dimensions on geometric shapes.
-
Product
Solder Wettability Tester
5200ZC
-
The current machine (5200TN) was developed as a comprehensive machine that covers solderability test standards around the world, but we have added a high cost performance machine to the lineup that has realized the request of "single function + low price", which many people who are using the successive machines of SAT2000-5000-5100 type.
-
Product
SparkFun Solder-able Breadboard
-
This is the SparkFun Solderable Breadboard. A bare PCB that is the exact size as our regular breadboard with the same connections to pins and power rails. This board is especially useful for preserving a prototype or experiment you just created on a solderless breadboard by soldering all the pieces in place.
-
Product
Dual Projection 3D In-Line Solder Inspection System
KY8030-2
-
The new KY8030-2 delivers 2x fasterinspection without compromising performanceand accuracy.Using patented dual projection, the systemeliminates the critical Shadow problem thatall 3D SPI systems can be vulnerable to.Easy UI and SPC Plus are included in the systempackage in order to help users achieve faster& easier printer process optimization
-
Product
Soldering Station
SM-898D
-
*Using micro-processor PID program control technology, precise dual digital display hot air gun and the stability of the actual temperature of the soldering iron, fast automatic temperature compensation feature further enhanced temperatures.*The amount of wind, air flow, temperature soldering iron are adjustable.*The air gun holder is a magnetron (or light control), holding the handle when the system will automatically enter the working mode; handle is placed on the shelf when the system enters standby mode automatically.(One more than the 898D Auto Sleep off function)*System with automatic cold wind function, can prolong the life of the heating element.*This product uses "brushless fan" as a source of air, reduce noise, improve work efficiency
-
Product
Solder Wettability Tester
5200 Advanced
-
This is an ultra-high-sensitivity wettability tester developed to evaluate the solder wettability of ever-miniaturizing electronic components. Electronic devices, especially mobile devices, are becoming more compact and multi-functional. As the number of electronic components mounted on them increases and the pitch of connectors that connect each device increases, soldering parts are becoming increasingly miniaturized. expected to respond to further miniaturization of electronic components and miniaturization of joints in the future .
