Failure Analysis
examination of faults, determine root cause and recommend corrective actions.
See Also: Crush, Performance Testing, Investigation
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Failure Analysis
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A partial list of our state of the art test equipment, applicable to these testing disciplines, will include the following: Two Scanning Electron Microscopes with EDS (SEM/EDS) Three Differential Scanning Calorimeters (DSC) Three Thermogravimetric Analyzers (TGA) Three Thermo Mechanical Analyzers (TMA) One Dynamic Mechanical Analyzer (DMA) Two Real-Time Fluoroscopic X-ray Systems, including a Microfocus System One Fourier Transform Infrared Microscope (FTIR) (capable of identifying a single particle of an unknown material) Two Ion Chromatographs (IC) (capable of identifying ionic impurities in ppm)
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Failure Analysis
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Failure Analysis (FA) plays a crucial role in the production of semiconductors. It provides process and design feedback to determine the root cause of any failures. Time-to-data for the FA Engineer is a critical measurement and SemiProbe’s Probe System for Life ® (PS4L) is ideally suited to excel in this application. All key components are interchangeable, making it easy to switch between individual die, wafers, and packaged parts.
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Failure Analysis Services
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Innovative Circuits Engineering, inc
Innovative circuits engineerin's failure analysis group performs root cause analysis on a wide variety of integrated circuit devices.
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Destructive Physical Analysis & Failure Analysis
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DPACI's component analysis laboratory performs major analytical functions, such as destructive physical analysis, failure analysis, counterfeit analysis, and material analysis on components & devices. Our destructive physical analysis techniques are performed in accordance with standards and methods used in most military and space program requirements. Solutions for difficult production problems are resolved through our failure analysis procedures.
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Failure Analysis
MicroINSPECT 300FA
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The MicroINSPECT 300FA is an automated wafer inspection tool used for semiconductor wafer failure analysis. Its small footprint, high speed, and low cost relative to its rich features yield a superb cost of ownership and makes this an ideal tool for your fab or failure analysis lab. The MicroINSPECT 300FA combines advanced robotics, wafer sorting, an intelligent wafer inspection microscope together with SiteVIEW Software to produce an integrated failure analysis tool.
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Failure Analysis
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Failure analysis on electronic components is a continuous challenging task. The smaller transistor dimensions, increasing functional complexity and changing device packaging styles requires new tools and skills for sample preparation, fault localization techniques, high resolution imaging and analysis.
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Electronics Failure Analysis System
Sentris
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Due to the continued decrease in integrated circuit feature size and supply voltages, detecting and locating the miniscule amount of heat generated by failure sites has become increasingly difficult. Sentris pinpoints low-level infrared thermal emissions from IC faults such as short circuits and leakage current.
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Failure Analysis – Materials
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Failure analysis – materials is the investigation into the background or history of a sample, or an event, to determine why a particular failure occurred. A product failure may include premature breakage, discoloration or even an unexpected odor. It is useful to know if this failure is a new, unique occurrence or if it has been an ongoing issue. The investigation can involve analyzing the sample as it currently exists and extrapolating from that data what may have caused the failure. A sample of the “good” vs. “bad” product may also be useful for comparison purposes.
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Failure Analysis And Magnetic Imaging Services
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Micro Magnetics offers failure analysis services on a contractual basis. We maintain two current density metrology systems at our headquarters in Fall River and can produce maps of current flow in a wide variety of ICs and packages, usually with initial results delivered within 48 hours. Our engineers will work closely with you to understand and interpret the results in order to determine the root cause of the failure.
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Failure Analysis Services
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BMP Testing and Calibration Services Inc.
Failure analysis plays a crucial role in product development that enables industries to prevent future product failures and improve them for the end-user. It’s a multi-faceted approach to finding how and why a product failed and involves an in-depth investigation of the circumstances surrounding the failure and discovery of relevant background information, including but not limited to the type of application, environmental factors, service life, and pertinent design information.
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Teaching-use Portable Vibration Tester
KD-9363-ED-4S2R
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King Design Industrial Co., Ltd.
Vibration testing is applied to confirm the reliability and screen out of the non-performing products prior to ship out of the factory; and to assess the non-performing failure analysis;expecting to become high standard, high reliability products.
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ISDD Tool Suite
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The Integrated System Diagnostic Design or ISDD Tool Suite provides a start to finish solution for meeting all the diagnostic needs of system design. The ISDD design process is centered around functional modeling of systems which is used to develop the diagnostics and failure analysis necessary to fully support good system design. This includes: *Analysis of Fault Detection and Fault Isolation.*Analysis of critical failures and their impact upon safety.*Detecting and reducing false alarms caused by diagnostics.*The impact of prognostics upon fault detection/fault isolation and mitigation of critical failures.*Development of vehicle health management and troubleshooting diagnostics
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Real-Time X-Ray Imaging and Variable Pressure Scanning Electron Microscope
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Trialon has the equipment and experienced staff to operate this highly technical piece of laboratory equipment. Our state-of-the-art materials analysis lab located in Auburn Hills, MI is managed by a Ph.D with over 20 years of hands-on experience in root cause failure analysis of design, material and process for current and future products.
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Semiconductor & Electronic Systems Test and Diagnostics Services
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Reliability Test and Diagnostic services are offered to a wide range of customers that are active as Fabless Semiconductor or Integrated Device Manufacturers, automotive electronics supplier, Telecom and ICT application specialists, Industrial and Medical electronic system manufacturers or in Aerospace and Space applications. Independent high tech test and diagnostic service laboratory. IC and electronic module qualification. ESD and Latch Up testing. Design assessment by HALT/HASS. Failure and construction analysis.
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Surface Insulation Resistance Testing
AutoSIR2™
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One AutoSIR chassis can hold between 1 to 16 measurement cards and can monitor up to 256 x 2-point test patterns or 78 x 5-point test patterns, or 32 x 9-point test patterns at selectable intervals from minutes to days. Each channel is current limited (1 M Ω), ensuring that dendrites are preserved for failure analysis. The frequent monitoring capability provides a full picture of the electrochemical reactions taking place on a circuit assembly, and provides early trend analysis enabling tests to be curtailed, thus saving considerable test time and money.
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Cross-Section Analysis Laboratory
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PCBs are constructed of a variety of materials such as glass, ceramic, copper, solder and Teflon. Trialon has the equipment and experienced staff to perform this difficult analysis. Our state-of-the-art materials analysis lab located in Auburn Hills, MI is managed by a Ph.D with over 20 years of hands-on experience in root cause failure analysis of design, material and process for current and future products.
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Diagnostic Test System™
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The original Teseda system for bench-top stimulus, test pattern debug, validation, device failure mode stimulation in-situ with other Failure Analysis lab equipment such as an EMMI, etc.
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Material Analysis Laboratory
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Trialon’s world class Material Analysis Laboratory consists of state-of-the-art equipment and experienced staff. Our specialty is to determine failure analysis of design, material, process and root cause in both current and future products across multiple industries.
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X-ray Inspection Performance
MXI Quadra 7
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Ultimate image quality and magnification, Quadra 7 reveals quality defects as small as 0.1 µm. Ideal for root cause failure analysis, wire bond integrity checking, component cracking, MEMS inspection and wafer level components including TSV and wafer bumps.
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Test System
Griffin III
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The Griffin III system brings new price/performance efficiency to the Tester-in-a-Head tradition, a concept created and introduced by HILEVEL in 1987. This tester is a superior cost-effective solution for Engineering, Production, and Failure Analysis test applications.
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Leeb Hardness Testers
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Your product description goes here. Leeb hardness tester application: Leeb hardness tester is for metal. Die cavity of molds,Inspection of bearing and other mass produced parts on a production line,Failure analysis of pressure vessel, steam generator and other equipment, Inspection of installed machinery, permanent parts of assembled systems and heavy work pieces.Rapid testing in large range and multi-measuring areas for large-scale work piece.
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PWB Interconnect Stress Test
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PWB Interconnect Solutions Inc.
Services to test the reliability of Printed Circuit Boards. PCBs).Coupon Inspection and Electrical Prescreen. Coupon Testing. Failure Location via I/R Photo Imagery. Failure Analysis.
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DI Lab System™
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Comprehensive Product Engineering and Failure Analysis Lab system for complete device analysis and physical defect isolation.
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Automated DC Parametric Curve Tracer
MultiTrace
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MultiTrace curve tracer is a mid-sized benchtop model supporting pin counts from 216-625 pins and includes the PGA-625 fixture as a standard interface. MultiTrace supports a wide range of test applications: Failure analysis, Reliability testing, Counterfeit device analysis, Nondestructive electrical counterfeit test, Opens, shorts leakage testing (OSL), Post decap electrical inspection, Optical fault localization, ESD testing, Latch-up testing, Supply current measurements, and more!
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Acoustic Microscope
AMI D9650
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Specifically designed to serve as a general purpose tool for failure analysis, process development, material characterization and low volume production inspection, the capabilities of the D9650 are truly unmatched. Representing the latest in C-SAM acoustic micro imaging, the D9650 delivers the unrivaled accuracy and robustness that you would expect from Nordson Test & Inspection instruments, plus improved electronics and software that raises the performance level for laboratory acoustic microscopes.
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Specialty Lab Testing Services
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Serving the Testing and Consulting needs for the Aerospace, Automotive, Bio-Medical, Military, Electrical and Electronics Product Industries since 1995 with technical excellence and exemplary customer service. Failure Analysis, Electronics Qualification, Screening, Environmental Test, Shock, Vibration, Package Test, and Transportation Simulation. Our customers come from a diverse group of manufacturers, from start-ups to Fortune 500 companies.
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Plasma Profiling TOFMS
PP-TOFMS
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Plasma Profiling TOFMS addresses the needs of materials scientists across a wide range of application areas. PP-TOFMS provides fast elemental depth distribution of any inorganic material. The speed and ease of use of PP-TOFMS permit to reduce optimization time of growth processes as many research scientists strive to reduce the time from discovery to applications of new materials.The simultaneous full coverage of TOFMS available for each point of depth permits the detection of non suspected contamination. This is key for failure analysis and optimization of thin film processes that tend to no longer be based on ultra-high grade methods (i.e. ink jet printing…).
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Precision Curve Tracer
CurveMasterTM
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The CurveMasterTM delivers new price/performance efficiency to curve tracing and Failure Analysis. Curve trace has been a standard feature in our full-power chip tester for years, so the CurveMasterTM is built with today’s components and technology. With all new high-accuracy DC Parametrics, you’ll enjoy the most powerful curve tracer you have ever used.
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IC/BGA Tester
Focus-2005
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As a screening checker to detect defective devices(mainly electrostatic destruction)which are returned from fields before failure analysis process of IC/LC in the quality assurance division of semiconductor manufacture.As a screening checker to detect defective devices before acceptance inspection by IC/LSI expensive tester at semiconductor company(trading, manufacture)Short/Open checker for semiconductor sensor device.It is possible to measure two kinds of measurements which are constant voltage biased current measurement and constant current biased voltage measurement. User can set the threshold of 10 ranks. (auto measurement)Only device can be measured. It is also possible to fabricate the test fixture.Various devices can be measured by replacing the socket board.It is no need to generate complex test programs as reference values are calculated from good device.It can be expanded by adding multiplexer boards which are 128pins per one board.(MAX 2048pins)
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Scanning Acoustic Microscope
Pulse2
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This industry-leading scanning acoustic microscope provides a universal inspection tool for packaged semiconductor development, production and failure analysis. With the ability to detect air defects as thin 0.05 micron and spatially resolve defects down to 10 microns, the ECHO is perfect for bump detection, stacked die (3D packaging) inspection, complex flip chip inspection and more traditional plastic packages.





























