In-Circuit Test Systems

As a Scandinavian pioneer in this area, In-Circuit-Test technology is at the heart of our mission. ICT is by far the most widely accepted test technology and Kontest has over the years contributed considerably in this field. Our range of ICT systems takes care of the most complex boards and come with extensive programming tools.

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Testsystems & Services

Columbia Elektronik AB

Testing is more than just finding defects on Printed Circuit Boards. It is also about how to predict defects before they occur. True economy can only be achieved when you see testing as an integrated part of manufacturing. To achieve this we provide Advanced Diagnostic Tools and Electronic Manufacturing Systems (EMS) that integrate testing with design, manufacturing and repair. Columbias expertise covers all aspects of PCB and sub-assembly production testing utilizing a full range of modern technologies: SPI, AOI, ICT, functional analog/digital testing and flying probe testing.

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Device Programming Systems

Columbia Elektronik AB

*Ultra-fast, universal In-System Programmers*True parallel, program up to 8 devices at once*Industrial-grade reliability*Standalone operations or host controlled*Easy to install and to use*Compact size, fixture friendly

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Flying Probe Systems

Columbia Elektronik AB

Smaller production series and fast prototyping requirements combined with zero fixturing costs are factors driving the development of Flying Probe testers.

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Function Test Systems

Columbia Elektronik AB

Open, modular and flexible functional testplatforms and accessories from 6TL.

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Safety Testers

Quanti Product Series - Columbia Elektronik AB

Quanti™ lifts test and measurement and electrical safety testing to a completely new level. Quanti™ offers reliable, rugged, fast, accurate, intrinsically safe and easily programmable testing no matter what your need is.

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AOI & SPI

Columbia Elektronik AB

Most defects in circuit-board assembly are due to the solder paste or the process of printing solder paste. Since the transition of to lead free soldering, a whole new spectra of problems have emerged in older paste printing and its due processes. Incomplete coalescence of ball grid array (BGA) spheres and solder paste deposits, are failure modes that has increased in frequency since the transition to lead-free soldering.

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In-Circuit Test Systems

Testsystems & Services

Device Programming Systems

Flying Probe Systems

Function Test Systems

Safety Testers

AOI & SPI