Aries
Aries Electronics is a leading manufacturer of a broad range of interconnect products and Correct-A-Chip™ technology. Our website contains over 200 full-spec Product Data Sheets available for viewing, downloading, and printing.
- 215-781-9956
- info@arieselec.com
- 2609 Bartram Road
Bristol, PA 19007-6810
United States of America
-
Product
Universal ZIF (Zero-Insertion-Force) DIP Test Socket
Series X55X
-
Universal Zero Insertion Force DIP Test Socket. All pin count sockets go into PCB with either .300 or .600 [7.62 to 15.24] centers. Sockets can be soldered into PCBs or plugged into any socket. Socket fits into Aries or any competitive test socket receptacle.
-
Product
Universal SOIC ZIF (Zero-Insertion-Force) Test Socket
Series 547
-
Universal SOIC Zero Insertion Force Test Socket. Devices with up to 44 pins can be inserted without bending or otherwise damaging the legs, since no force is required to either insert or remove the component from the socket. Accepts SOIC gull-wing and J-lead devices, up to 44 pins on .050 [1.27] lead pitch, body widths from .150 to .600 [3.81 to 15.24].
-
Product
DIP Header with Coined Contacts
Series 600
-
DIP Headers with Coined Contacts. Aries offers a full line of DIP headers, available with either coined or screw machine contacts. Consult Data Sheet No. 12035 for screw machine contacts. Snap-on, protective covers are available for all sizes shown below and accommodate .125 [3.18] to .750 [9.05] component heights. Consult Data Sheet No. 12033 for protective covers.
-
Product
SOIC DW-to-20-Pin PLCC
MC145158-2
-
ADAPTER FOR MOTOROLA. FROM PLCC 20 PIN FN PACKAGE TO SOIC DW PACKAGE. A cost effective means of upgrading to SOJ or SOIC ... without changing your PCB layout.
-
Product
Lo-PRO®file ZIF (Zero-Insertion-Force) Socket
Series 526
-
LO-PRO file Zero Insertion Force Socket. A choice of 24, 28, or 40 pin count devices can be inserted without bending or otherwise damaging the legs, since no force is required to either insert or remove the component from the socket. A metal cam provides strong, smooth action as it moves to a positive stop, compressing the double-sided contacts, ensuring a gas-tight seal.
-
Product
Pin-Line™ Collet Socket with Wire Wrap Pins
Series 0503
-
Pin-Line Collet Sockets with Wire Wrap Pins. Features: Rows of socket strips may be mounted on any centers and are end-to-end or side-by-side stackable for .100 [2.54] grid or matrix patterns. Available with wire wrap or solder tail pins. Consult Data Sheet No. 12013 for solder tail pins. Break feature allows strips to be cut to the number of positions desired.
-
Product
SSOP-to-DIP Adaptor
Series 651000
-
SSOP IC to DIP Adapter. Allows the use of .65mm pitch surface mount ICs in thru-hole designs. Ideal for prototyping and testing/evaluating SSOP ICs. Adapter can be cut to smaller sizes by end user. Consult factory for panelized form or for mounting of consigned ICs.
-
Product
Mini-Link™ Miniature Jumper
Series ML-100
-
Mini-Link Miniature Jumpers. Used to jumper from row-to-row or from pin-to-pin. Their miniature size makes it possible to stack one on top of the other. A convenient test probe slot is provided as well. Mini-Links are available from the factory with or without a handle, used for ease of inserting or extracting.
-
Product
Header Covers
Series 650
-
Header Covers. Aries offers a complete line of DIP headers and covers useful for mounting components such as resistors, diodes, etc. Consult Data Sheet 12032 for mating DIP header information. Four cover heights provide mounting of 1/8? [3.18] high to 3/4? [19.05] high components.
-
Product
DIP-ER™ Logic Jumper
Series 115, 116, & 117
-
DIP-ER Logic Jumper. Reliable, electronically tested solder connections. Protective covers are ultrasonically welded on and provide strain relief for cables. DIP-ER Logic jumper wiring is point to point. Consult factory for other wiring needs.
-
Product
QFP-to-PGA EIAJ 208-Position, 0.0197 [0.50] Pitch Adaptor
96-208M50
-
QFP to PGA Adapter for EIAJ 208 Position, .0197 [.50] Pitch. Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs. Pins are mechanically fastened and soldered to board using Aries patented process, creating a reliable electrical connection and rugged contact.
-
Product
Male/Female DIP Jumpers
Series 200 thru 216
-
Male/Femaie DIP Jumpers. Reliable, electronically tested solder connections. Protective covers are ultrasonically welded on and provide strain relief for cables. 10-color cable allows for easy identification and tracing.
-
Product
P/N 1110087 144-Pin VQFP-to-PGA Adaptor
1110087
-
144 Pin VQFP to PGA Adapter. Convert surface mount VQFP packages to a 13 x 13 PGA footprint. Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs. Pins are mechanically fastened and soldered to board using Aries patented process, creating a reliable electrical connection and rugged contact. Consult factory for panelized form or for mounting of consigned chips.
-
Product
Lo-PRO®file Collet Socket with Solder Tail Pins
Series 513
-
LO-PROfile Collet Sockets with Solder Tail Pins. Features: LO-PRO file Collet Sockets are available with solder tail or wire wrap pins. Consult Data Sheet No. 12012 for wire wrap pins. Choose from several size and plating options
-
Product
DIP Header with Screw Machine Contacts
Series 625
-
DIP Headers with Screw Machine Contacts. Aries offers a full line of DIP headers, available with either screw machine or coined contacts in a variety of styles. Consult Data Sheet No. 12032 for coined contacts.
