Aries
Aries Electronics is a leading manufacturer of a broad range of interconnect products and Correct-A-Chip™ technology. Our website contains over 200 full-spec Product Data Sheets available for viewing, downloading, and printing.
- 215-781-9956
- info@arieselec.com
- 2609 Bartram Road
Bristol, PA 19007-6810
United States of America
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Product
QFP-to-PGA JEDEC 132-Position, 0.025 [0.64] Pitch Adaptor
95-132I25
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QFP to PGA Adapter for JEDEC 132 Position, .025 [.64] Pitch. Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs. Pins are mechanically fastened and soldered to board using Aries patented process, creating a reliable electrical connection and rugged contact.
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Product
Thru-Hole 0.040 [1.02] Female DIP Strip
Series F40
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Thru-Hole .040 [1.02] Female DIP Strips. This female DIP strip is used in conjunction with Aries Shorting Plug SP200, available separately, for your programming needs.
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Product
DIP-to-SOIC Adaptor
Series 354000
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DIP to SOIC Adapters. Convenient, cost-effective means of converting DIP style packaging to SOIC PC board layouts.
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Product
Elevator Socket with Bifurcated Contacts
Series 8XXX
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Elevator Sockets with Bifurcated Contacts. Ideal for elevating devices (displays, switches, etc.) to desired level with .260 to 1.250 [6.60 to 31.75] height extension.
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Product
Yellow Streak Jumpers on 0.100 [2.54] Centers
Series 154
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Yellow Streak Jumpers on .100 [2.54] Centers. A low-cost jumper available with (Series 154YP) or without (Series 154YS) pitch bars.
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Product
Test & Burn-In Socket for Devices up to 13mm Square
CSP/MicroBGA
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Test & Burn-In Socket. Socket is easily mounted and removed to & from the BIB due to solderless pressure mount compression spring probes which, are accurately located by two molded plastic alignment pins and mounted with four stainless steel screws. Standard molded socket format can accommodate any device package of 13mm or smaller, by using machined (for small quantities) or custom molded (for large quantities) pressure pads and interposers.
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Product
Deci-Center™ Jumpers
SERIES 150/151
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DECI-CENTER JUMPERS. Pitch bars help maintain .100 [2.54] conductor spacing.Consult factory for jumper lengths under the specified minimum length.
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Product
Standard DIP Socket with Solder Tail Bifurcated Contacts
Series 511
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Standard DIP Sockets with Wire Wrap Bifurcated Contacts. Features: Standard DIP sockets are available with solder tail or wire wrap pins, all with bifurcated contacts. Consult Data Sheet No. 12005 for wire wrap pins. Aries offers these standard DIP sockets in more sizes than any other manufacturer.
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Product
Open-Frame Collet Socket with Solder Tail Pins
Series 518
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Open Frame Collet Sockets with Solder Tail Pins. Features: Open frame allows for more efficient utilization of board space and better cooling. Choose from several pin styles. Compatible with automatic insertion equipment. Side-to-side and end-to-end stackable.
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Product
PQFP-to-PGA 132-Pin Amp Footprint Socket
97-AQ132D
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132 Pin PQFP to Amp Socket PGA Footprint. Convert surface mount PQFP packages to an Amp interstitial PGA footprint. Reduce costs by using less expensive PQFP packages to replace PGA footprints in existing designs.
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Product
Pin-Line™ Collet Socket with Wire Wrap Pins
Series 0503
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Pin-Line Collet Sockets with Wire Wrap Pins. Features: Rows of socket strips may be mounted on any centers and are end-to-end or side-by-side stackable for .100 [2.54] grid or matrix patterns. Available with wire wrap or solder tail pins. Consult Data Sheet No. 12013 for solder tail pins. Break feature allows strips to be cut to the number of positions desired.
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Product
PLCC-to-DIP Adaptor
Series 652000/653000
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PLCC to DIP Adapter. Converts PLCC packaged ICs to DIP footprints. Ideal for prototyping and testing/evaluation. Available with PLCC sockets or PLCC pads on top side. Consult factory for panelized form or for mounting of consigned ICs.
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Product
DIP Program Header
Series 675
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DIP Program Headers. Aries DIP programmable headers offer unusual versatility for programming within the header itself. They can be individually programmed using cutters or Aries programming tool, Part No. T-675, available separately, to remove the interconnecting sections. Consult Data Sheet No. 22002 for Aries programming tool.
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Product
68-Pin PLCC-to-DIP 64-Pin Motorola MC68HC000 Adaptor
1110267-N
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68 PIN PLCC PACKAGE MOTOROLA MC68HC000 TO 64 PIN DIP FOOTPRINT. Allows easy replacement of a difficult to find part.
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Product
Inverter Socket
Series 6621
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Inverter Sockets. Inverted configuration allows the socket to be wave soldered on the component side of the PCB and the device socketed through a window on the solder side of the PCB. Available on .600 [15.24] centers. Consult factory for other sizes.
