Aries
Aries Electronics is a leading manufacturer of a broad range of interconnect products and Correct-A-Chip™ technology. Our website contains over 200 full-spec Product Data Sheets available for viewing, downloading, and printing.
- 215-781-9956
- info@arieselec.com
- 2609 Bartram Road
Bristol, PA 19007-6810
United States of America
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Product
Lock/Eject DIP Collet Socket with Surface Mount Pins
EJECT-A-DIP
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Lock/Eject DIP Collet Sockets with Surface Mount Pins. Features: Aries Eject-A-Dip is a rugged, solderable socket with a unique ejector/latch for fast in-field board maintenance. The latch locks in the connector or device, making it ideal for high vibration environments. The latch, when used as an ejector, removes DIP packages without pin damage.
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Product
QFP-to-PGA Motorola 68340 144-Pin Adaptor
97-68340
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144 Pin QFP to PGA Adapter for Motorola 68340. Convert surface mount QFP packages to a 15 x 15 PGA footprint. Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs. Pins are mechanically fastened and soldered to board using Aries patented process, creating a reliable electrical connection and rugged contact.
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Product
DIP-to-SOIC Adaptor
Series 354000
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DIP to SOIC Adapters. Convenient, cost-effective means of converting DIP style packaging to SOIC PC board layouts.
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Product
PLCC-to-DIP Adaptor
Series 652000/653000
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PLCC to DIP Adapter. Converts PLCC packaged ICs to DIP footprints. Ideal for prototyping and testing/evaluation. Available with PLCC sockets or PLCC pads on top side. Consult factory for panelized form or for mounting of consigned ICs.
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Product
Surface Mount-to-DIP JEDEC SOT-25, SOT-23A-6 Adaptor
1110748
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Surface Mount to DIP Adapter for SOT-25, SOT-23A-6. Allows for breadboarding or substitution of microgate SOT-23A-6 and SOT-25 IC and transistor packages into .100 [2.54] pitch proto boards or PC boards. Solder masked top-side pads allow user to hand solder devices directly to topside of adapter with fewer problems of solder bridging. Longer male bottom pins are available at special request for easy use of probe clips. Large topside pads allow for soldering test pins, jumpers, etc. to top of adapter.
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Product
68-Pin PLCC with Die Flipped-to-68-Pin PGA for 87C196 IC and Others
68-304538-10
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68P PLCC WITH DIE FLIPPED TO 68 PGA FOR 87C196 IC AND OTHERS. Correct-A-Chip technology solves problems associated with the use of alternative ICs (due to availability, obsolescence, need for better performance, etc.) by eliminating the need for new PCBs.
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Product
High-Temperature SOIC DIP Adaptor
SERIES 35000-10-HT
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High Temperature Lead Free SOIC DIP Adapters. A cost effective means of upgrading to SOIC...without changing your PCB layout. Available on .300 [7.62] centers. Consult Data Sheet No. 18011 for adapters on .400 [10.16], or .600 [15.24] centers.
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Product
Pin-Line™ Vertisocket™
Series 0517
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Pin-Line Vertisockets. For mounting components, jumpers, etc., at right angle to PC board. Available 1 to 25 positions; cuttable to any number desired.
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Product
Mini-Link™ Miniature Jumper
Series ML-100
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Mini-Link Miniature Jumpers. Used to jumper from row-to-row or from pin-to-pin. Their miniature size makes it possible to stack one on top of the other. A convenient test probe slot is provided as well. Mini-Links are available from the factory with or without a handle, used for ease of inserting or extracting.
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Product
Economy Mini-Link™ Miniature Jumper
Series ME-100
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Economy Mini-Link Miniature Jumper. Mini-LinkTM miniature jumpers are useful for jumpering .025 [.63] square pins on .100 [2.54] centers. Their miniature size makes it possible to stack one on top of the other.
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Product
40-Pin DIP-to-Socketable PLCC Adaptor
1111163
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40 Pin DIP to Socketable PLCC Adapter. Can be used with Intel 80/83C652 and 80C251 microprocessors and any IC that follows standard DIP to PLCC pinout conventions. Allows user to switch package styles and avoid shortage problems. Designed to plug directly into your 44 pin PLCC socket.
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Product
Deci-Center™ Jumpers
Series 112, 113 & 114
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Deci Center Jumpers. Reliable, electronically tested solder connections. Pitch bars help maintain .100 [2.54] conductor spacing. 10-color cable allows for easy identification and tracing.
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Product
TSOP-to-DIP (0.600 [15.24]) Adaptor
655000
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TSOP to .600 [15.24] DIP Adapter. Designed to allow user to cut 32 position adapter down to any size desired. Pins are mechanically fastened and soldered to board using Aries patented process, creating a reliable electrical connection and rugged contact.
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Product
160-Position QFP-to-PGA Adapter
96-160M65
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QFP to PGA Adapter for 160 Position, .0256 [.65] Pitch. Convert surface mount QFP packages to a 15 x 15 PGA footprint. Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs. Pins are mechanically fastened and soldered to board using Aries patented process, creating a reliable electrical connection and rugged contact.
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Product
Socket with Bifurcated Contact Solder Tail Pins
Series 0511
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Strip-Line Sockets with Bifurcated Contact Solder Tail Pins. Features: For mounting liquid crystal displays and other high pin count or odd centered components. Available in several sizes with bifurcated contacts in solder tail or wire wrap pins. Consult Data Sheet No. 12009 for wire wrap pins. Optional spacer available for mounting on .300 [7.62], .600
