Aries
Aries Electronics is a leading manufacturer of a broad range of interconnect products and Correct-A-Chip™ technology. Our website contains over 200 full-spec Product Data Sheets available for viewing, downloading, and printing.
- 215-781-9956
- info@arieselec.com
- 2609 Bartram Road
Bristol, PA 19007-6810
United States of America
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Product
Pin-Line™ Header with Screw Machine Contacts
Series 0625
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Pin-Line Headers with Screw Machine Contacts. Aries Pin-Line headers are available with a variety of screw machined contacts. Consult Data Sheet No. 12034 for strip-line headers with coined contacts. Break feature allows header to be cut to the number of positions desired.
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Product
Test & Burn-In Socket for Devices up to 13mm Square
CSP/MicroBGA
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Test & Burn-In Socket. Socket is easily mounted and removed to & from the BIB due to solderless pressure mount compression spring probes which, are accurately located by two molded plastic alignment pins and mounted with four stainless steel screws. Standard molded socket format can accommodate any device package of 13mm or smaller, by using machined (for small quantities) or custom molded (for large quantities) pressure pads and interposers.
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Product
160-Position QFP-to-PGA Adapter
96-160M65
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QFP to PGA Adapter for 160 Position, .0256 [.65] Pitch. Convert surface mount QFP packages to a 15 x 15 PGA footprint. Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs. Pins are mechanically fastened and soldered to board using Aries patented process, creating a reliable electrical connection and rugged contact.
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Product
Mini-Link™ Miniature Jumper
Series ML-100
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Mini-Link Miniature Jumpers. Used to jumper from row-to-row or from pin-to-pin. Their miniature size makes it possible to stack one on top of the other. A convenient test probe slot is provided as well. Mini-Links are available from the factory with or without a handle, used for ease of inserting or extracting.
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Product
20-Pin PLCC-to-16-Pin DIP Adaptor
16-304633-18
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20 PIN PLCC TO 16 PIN DIP ADAPTER FOR MOTOROLA MC12009 AND OTHERS. A cost effective means of upgrading to PLCC Package without changing your PCB layout.
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Product
SOWIC-to-DIP Adaptor 14 to 28 Pins
Series 35W000
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SOWIC to DIP Adapters - 14/28Pins. A cost effective means of upgrading to SOIC without changing your PCB layout.
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Product
Lock/Eject DIP Collet Socket with Surface Mount Pins
EJECT-A-DIP
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Lock/Eject DIP Collet Sockets with Surface Mount Pins. Features: Aries Eject-A-Dip is a rugged, solderable socket with a unique ejector/latch for fast in-field board maintenance. The latch locks in the connector or device, making it ideal for high vibration environments. The latch, when used as an ejector, removes DIP packages without pin damage.
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Product
Universal SOIC-to-0.600 [15.24] DIP Adaptor
Series 647
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Universal SOIC to .600 [15.24] DIP Adapter. 44 pin adapter for mounting Aries Series 547 Universal SOIC ZIF (zero insertion force) Test Socket to .600 [15.24] DIP PCB layout. Consult Data Sheet No. 10015 for test socket information.
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Product
QFP-to-PGA Motorola 68340 144-Pin Adaptor
97-68340
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144 Pin QFP to PGA Adapter for Motorola 68340. Convert surface mount QFP packages to a 15 x 15 PGA footprint. Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs. Pins are mechanically fastened and soldered to board using Aries patented process, creating a reliable electrical connection and rugged contact.
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Product
PLCC-to-DIP Adaptor
Series 352000/353000
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PLCC to DIP Adapter. Converts PLCC packaged ICs to DIP footprints. Available with PLCC sockets or PLCC pads on top side. Consult factory for panelized form or for mounting of consigned ICs.
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Product
ZIF (Zero-Insertion-Force) Socket
Series 516
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Zero Insertion Force Socket. A choice of 24, 28, or 40 pin count devices can be inserted without bending or otherwise damaging the legs, since no force is required to either insert or remove the component from the socket. Contacts are normally open and are closed by a unique cam action controlled by dual lever arms. The last 15° of movement of the cam provides a wiping action to the contacts on the legs of the device to remove any residue, ensuring a gas-tight seal.
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Product
QFP-to-PGA JEDEC 132-Position, 0.025 [0.64] Pitch Adaptor
95-132I25
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QFP to PGA Adapter for JEDEC 132 Position, .025 [.64] Pitch. Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs. Pins are mechanically fastened and soldered to board using Aries patented process, creating a reliable electrical connection and rugged contact.
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Product
SOIC and SOJ-to-DIP Adaptor
Series 45000X & 65000X
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SOIC & SOJ to DIP Adapters. A cost effective means of upgrading to SOJ or SOIC...without changing your PCB layout.
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Product
0.5mm 8- and 10-Pin MSOP-to-0.300" DIP Adaptor
1111841-X
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.5MM 8 AND 10 PIN MSOP TO .3 DIP ADAPTERS. A cost effective means of upgrading to MSOP .5MM package SOIC... without changing your PCB layout. Available on .300 [7.62] centers.
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Product
Lo-PRO®file Collet Socket with Wire Wrap Pins
Series 503
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LO-PRO file Collet Sockets with Wire Wrap Pins. Features: LO-PRO file Collet Sockets are available with solder tail or wire wrap pins. Consult Data Sheet No. 12011 for solder tail pins. Choose from several sizes and plating options.
