Aries
Aries Electronics is a leading manufacturer of a broad range of interconnect products and Correct-A-Chip™ technology. Our website contains over 200 full-spec Product Data Sheets available for viewing, downloading, and printing.
- 215-781-9956
- info@arieselec.com
- 2609 Bartram Road
Bristol, PA 19007-6810
United States of America
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Product
High-Temperature SOIC DIP Adaptor
SERIES 35000-10-HT
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High Temperature Lead Free SOIC DIP Adapters. A cost effective means of upgrading to SOIC...without changing your PCB layout. Available on .300 [7.62] centers. Consult Data Sheet No. 18011 for adapters on .400 [10.16], or .600 [15.24] centers.
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Product
DIP Jumpers
Series 100 thru 111
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DIP Jumpers. Aries offers a wide array of DIP jumper configurations and wiring possibilities for all your programming needs. Protective covers are ultrasonically welded on and provide strain relief for cables. 10-color cable allows for easy identification and tracing.
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Product
Pin-Line™ Collet Socket with Wire Wrap Pins
Series 0503
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Pin-Line Collet Sockets with Wire Wrap Pins. Features: Rows of socket strips may be mounted on any centers and are end-to-end or side-by-side stackable for .100 [2.54] grid or matrix patterns. Available with wire wrap or solder tail pins. Consult Data Sheet No. 12013 for solder tail pins. Break feature allows strips to be cut to the number of positions desired.
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Product
P/N 1110087 144-Pin VQFP-to-PGA Adaptor
1110087
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144 Pin VQFP to PGA Adapter. Convert surface mount VQFP packages to a 13 x 13 PGA footprint. Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs. Pins are mechanically fastened and soldered to board using Aries patented process, creating a reliable electrical connection and rugged contact. Consult factory for panelized form or for mounting of consigned chips.
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Product
PLCC-to-DIP Adaptor
Series 652000/653000
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PLCC to DIP Adapter. Converts PLCC packaged ICs to DIP footprints. Ideal for prototyping and testing/evaluation. Available with PLCC sockets or PLCC pads on top side. Consult factory for panelized form or for mounting of consigned ICs.
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Product
Quick-Release Universal ZIF
Series X57X
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Quick-Release Universal Zero Insertion Force Dip Test Socket. Aries Universal Test Socket accepts devices on .300 to .600 [7.62 to 15.24] centers. Swing quick-release handle down to open contacts and insert device. Release and handle automatically returns as contacts close onto device leads.
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Product
Pin-Line™ Vertisocket™
Series 0517
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Pin-Line Vertisockets. For mounting components, jumpers, etc., at right angle to PC board. Available 1 to 25 positions; cuttable to any number desired.
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Product
SSOP-to-DIP Adaptor
Series 651000
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SSOP IC to DIP Adapter. Allows the use of .65mm pitch surface mount ICs in thru-hole designs. Ideal for prototyping and testing/evaluating SSOP ICs. Adapter can be cut to smaller sizes by end user. Consult factory for panelized form or for mounting of consigned ICs.
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Product
QFP-to-PGA Motorola 68340 144-Pin Adaptor
97-68340
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144 Pin QFP to PGA Adapter for Motorola 68340. Convert surface mount QFP packages to a 15 x 15 PGA footprint. Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs. Pins are mechanically fastened and soldered to board using Aries patented process, creating a reliable electrical connection and rugged contact.
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Product
JEDEC TO Collet Socket
Series 514
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TO Collet Sockets. Aries TO sockets feature molded chamfer lead-ins for easy device insertion. High stand-off design for heat dissipation and easy cleaning. External polarization for positive location.
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Product
Socket with Bifurcated Contact Solder Tail Pins
Series 0511
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Strip-Line Sockets with Bifurcated Contact Solder Tail Pins. Features: For mounting liquid crystal displays and other high pin count or odd centered components. Available in several sizes with bifurcated contacts in solder tail or wire wrap pins. Consult Data Sheet No. 12009 for wire wrap pins. Optional spacer available for mounting on .300 [7.62], .600
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Product
Standard DIP Socket with Solder Tail Bifurcated Contacts
Series 511
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Standard DIP Sockets with Wire Wrap Bifurcated Contacts. Features: Standard DIP sockets are available with solder tail or wire wrap pins, all with bifurcated contacts. Consult Data Sheet No. 12005 for wire wrap pins. Aries offers these standard DIP sockets in more sizes than any other manufacturer.
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Product
PLCC-to-DIP Adaptor
1109342
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PLCC to DIP Adapter for Intel 80C31BH, 80C51BH, 87C51, 80/83C652 ,80C251 and other Microprocessors. Designed specifically for use with Intel 80/83C652 and 80C251 microprocessors.
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Product
DIP Header with Coined Contacts
Series 600
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DIP Headers with Coined Contacts. Aries offers a full line of DIP headers, available with either coined or screw machine contacts. Consult Data Sheet No. 12035 for screw machine contacts. Snap-on, protective covers are available for all sizes shown below and accommodate .125 [3.18] to .750 [9.05] component heights. Consult Data Sheet No. 12033 for protective covers.
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Product
DIP-to-JEDEC TO Adaptor Socket
1109522 & 1109523
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DIP to TO Adapter Sockets. 8 pin DIP IC socket on the top and a circular, 8 pin TO can male pin footprint on the bottom. ICs now available only in 8 pin DIPs can be readily mounted on boards having TO thru-hole footprints without having to redesign the board.
