Aries
Aries Electronics is a leading manufacturer of a broad range of interconnect products and Correct-A-Chip™ technology. Our website contains over 200 full-spec Product Data Sheets available for viewing, downloading, and printing.
- 215-781-9956
- info@arieselec.com
- 2609 Bartram Road
Bristol, PA 19007-6810
United States of America
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Product
Elevator Socket with Bifurcated Contacts
Series 8XXX
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Elevator Sockets with Bifurcated Contacts. Ideal for elevating devices (displays, switches, etc.) to desired level with .260 to 1.250 [6.60 to 31.75] height extension.
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Product
Test & Burn-In Socket for Devices up to 13mm Square
CSP/MicroBGA
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Test & Burn-In Socket. Socket is easily mounted and removed to & from the BIB due to solderless pressure mount compression spring probes which, are accurately located by two molded plastic alignment pins and mounted with four stainless steel screws. Standard molded socket format can accommodate any device package of 13mm or smaller, by using machined (for small quantities) or custom molded (for large quantities) pressure pads and interposers.
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Product
PQFP-to-PGA 132-Pin Amp Footprint Socket
97-AQ132D
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132 Pin PQFP to Amp Socket PGA Footprint. Convert surface mount PQFP packages to an Amp interstitial PGA footprint. Reduce costs by using less expensive PQFP packages to replace PGA footprints in existing designs.
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Product
Universal Test Socket Receptacle
Series 6556
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Universal Test Socket Receptacle. The Aries Universal Test Socket Receptacle is sturdy, open frame, and easily mounted to PC boards. Allows for easy replacement of Aries and other manufacturers test sockets. A choice of four collet pin styles makes the receptacle useful for any interconnection method.
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Product
Flat Pin-Staked Flex Jumpers
Series 171 thru 173
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Flat Pin Staked Flex Jumpers. Aries Flat Pin Staked Flex Jumpers combine thin, flexible, solid Copper conductors embedded between layers of tough, flexible, flame- retardant insulation.
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Product
Program Header and Cover
Series 680
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Program Headers and Covers. Complete versatility for programming within the unit itself...thus eliminating the need for DIP switches in many situations. Available pre-programmed from Aries, or do it yourself using Aries hand tool No. T-680. Consult Data Sheet No. 22002 for programming tool information.
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Product
Shorting Plugs and Jacks
Series SP200 & SJ200
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.040 [1.02] Shorting Plugs and Jacks. These shorting plugs and jacks are used in conjunction with Aries DIP strips, available separately, for your programming needs. Consult Data Sheet Nos. 16007 and 16008 for details.
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Product
SSOP-to-DIP Adaptor
Series 351000
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SSOP IC to DIP Adapter. Allows the use of .65mm pitch surface mount ICs in thru-hole designs. Ideal for prototyping and testing/evaluating SSOP ICs. Adapter can be cut to smaller sizes by end user. Consult factory for panelized form or for mounting of consigned ICs.
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Product
24-Pin SOIC w/Package-to-22-Pin 0.400" DIP
22-304504-18
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24Pin SOIC w/ Package to 22 Pin .4 DIP. A cost effective means of upgrading to SOIC without changing your PCB layout.
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Product
DIP-ER™ Logic Jumper
Series 115, 116, & 117
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DIP-ER Logic Jumper. Reliable, electronically tested solder connections. Protective covers are ultrasonically welded on and provide strain relief for cables. DIP-ER Logic jumper wiring is point to point. Consult factory for other wiring needs.
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Product
DIP-to-JEDEC TO Adaptor Socket
1109522 & 1109523
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DIP to TO Adapter Sockets. 8 pin DIP IC socket on the top and a circular, 8 pin TO can male pin footprint on the bottom. ICs now available only in 8 pin DIPs can be readily mounted on boards having TO thru-hole footprints without having to redesign the board.
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Product
Pin-Line™ Collet Socket with Wire Wrap Pins
Series 0503
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Pin-Line Collet Sockets with Wire Wrap Pins. Features: Rows of socket strips may be mounted on any centers and are end-to-end or side-by-side stackable for .100 [2.54] grid or matrix patterns. Available with wire wrap or solder tail pins. Consult Data Sheet No. 12013 for solder tail pins. Break feature allows strips to be cut to the number of positions desired.
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Product
SOIC and SOJ-to-DIP Adaptor
Series 35000X
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SOIC & SOJ to DIP Adapters. A cost effective means of upgrading to SOJ or SOIC...without changing your PCB layout.
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Product
Hybrid Socket
CSP/Ballnest
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Any grid size available on 0.50mm pitch or larger. ZIF style socket using Aries solderless, gold plated pressure mount Spring Probe. The gold over nickel plated compression spring probes leave very small witness marks on the bottom surface of the device solderballs.
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Product
Strip-Line™ Socket with Bifurcated Contact Wire Wrap Pins
Series 0501
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Strip-line Sockets with Bifurcated Contact Wire Wrap Pins. Features: For mounting liquid crystal displays and other high pin count or odd centered components. Available in several sizes with bifurcated contacts in wire wrap or solder tail pins. Consult Data Sheet No. 12008 for solder tail pins.
