Aries
Aries Electronics is a leading manufacturer of a broad range of interconnect products and Correct-A-Chip™ technology. Our website contains over 200 full-spec Product Data Sheets available for viewing, downloading, and printing.
- 215-781-9956
- info@arieselec.com
- 2609 Bartram Road
Bristol, PA 19007-6810
United States of America
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Product
Quick-Release Universal ZIF
Series X57X
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Quick-Release Universal Zero Insertion Force Dip Test Socket. Aries Universal Test Socket accepts devices on .300 to .600 [7.62 to 15.24] centers. Swing quick-release handle down to open contacts and insert device. Release and handle automatically returns as contacts close onto device leads.
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Product
Universal SOIC-to-0.600 [15.24] DIP Adaptor
Series 647
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Universal SOIC to .600 [15.24] DIP Adapter. 44 pin adapter for mounting Aries Series 547 Universal SOIC ZIF (zero insertion force) Test Socket to .600 [15.24] DIP PCB layout. Consult Data Sheet No. 10015 for test socket information.
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Product
Program Header and Cover
Series 680
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Program Headers and Covers. Complete versatility for programming within the unit itself...thus eliminating the need for DIP switches in many situations. Available pre-programmed from Aries, or do it yourself using Aries hand tool No. T-680. Consult Data Sheet No. 22002 for programming tool information.
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Product
DIP-to-SOIC Adaptor
Series 354000
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DIP to SOIC Adapters. Convenient, cost-effective means of converting DIP style packaging to SOIC PC board layouts.
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Product
TSOP-to-DIP (0.600 [15.24]) Adaptor
655000
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TSOP to .600 [15.24] DIP Adapter. Designed to allow user to cut 32 position adapter down to any size desired. Pins are mechanically fastened and soldered to board using Aries patented process, creating a reliable electrical connection and rugged contact.
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Product
PLCC-to-DIP Adaptor
Series 652000/653000
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PLCC to DIP Adapter. Converts PLCC packaged ICs to DIP footprints. Ideal for prototyping and testing/evaluation. Available with PLCC sockets or PLCC pads on top side. Consult factory for panelized form or for mounting of consigned ICs.
